公开(公告)号：JP2005252198A

公开(公告)日：2005-09-15

申请号：JP2004064549

申请日：2004-03-08

Applicant: Denso Corp ,  株式会社デンソー

Inventor： INOUE TETSUSHI ,  SAKAMOTO ZENJI ,  SUZUKI ICHIRO ,  OSHIRO MASARU

IPC: H05K3/34 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/48

Abstract: PROBLEM TO BE SOLVED: To provide a solder joining method of an insertion mounting electronic component which can form excellent solder profile, and to provide a manufacturing method of a power converting apparatus high in electric reliability using this solder joining method.
SOLUTION: The present invention relates to the manufacturing method of the power converting apparatus which has a semiconductor lamination unit 2 formed by alternately laminating a semiconductor module 10 having a control terminal 160 and a cooling tube 20, and a controlling substrate 40 having a through hole portion 400 for solder joining by inserting the control terminal 160. The method performs: a control portion forming process of forming a control portion 52b having a solder control layer excellent in a wettability with solder material in an axial direction of the control terminal 160 as external surface; a unit forming process of forming a semiconductor lamination unit 2; a part arranging process of arranging the semiconductor lamination unit 2; and a joining process of joining the control terminal 160 at the through hole portion 400 by solder.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供能形成优异焊料形状的插入安装电子部件的焊料接合方法，并且使用该焊料接合方法提供具有高电气可靠性的电力转换装置的制造方法。 电力转换装置的制造方法技术领域本发明涉及具有通过交替层叠具有控制端子160和冷却管20的半导体模块10形成的半导体层叠单元2的电力转换装置的制造方法以及具有 用于通过插入控制端子160进行焊接的通孔部分400.该方法执行：控制部分形成处理，其形成控制部分52b，该控制部分52b具有在控制端子的轴向方向上与焊料材料的润湿性优异的焊料控制层 160为外表面; 形成半导体层叠单元2的单元形成工序; 布置半导体层叠单元2的部件布置处理; 以及通过焊料将通孔部400的控制端子160接合的接合工序。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004200481A

公开(公告)日：2004-07-15

申请号：JP2002368339

申请日：2002-12-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TANAHASHI AKIRA ,  OTA SHINJI ,  OSHIRO MASARU

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor chip and a substrate to be bonded while bringing them surely into tight contact with each other by solving problems of insufficient bonding and the like.
SOLUTION: When an area array type semiconductor chip is soldered to a substrate having wiring capable of mounting the semiconductor chip, reflow soldering is performed using flux generating such a capillary force as the chip and the substrate attract each other when solder fuses. The flux suitably exhibits a thermal weight variation rate of 15-85% at the solidus temperature of a bump composition mounted on the semiconductor chip in measurement by thermogravimetry (TG) assuming the atmospheric volume of air or nitrogen gas is 200 mL/min and a temperature rise rate is 10 °C/min.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004200479A

公开(公告)日：2004-07-15

申请号：JP2002368328

申请日：2002-12-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TANAHASHI AKIRA ,  OTA SHINJI ,  OSHIRO MASARU ,  SAKAMOTO ZENJI

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/40 ,  C22C13/00 ,  H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor chip and a substrate to be bonded while bringing them surely into tight contact with each other in a soldering process.
SOLUTION: In the method for packaging a semiconductor chip, soldering is performed using a bump of such a composition as a solid-liquid coexistence region is present when an area array arrangement type semiconductor chip is soldered to a substrate having wiring capable of mounting the semiconductor chip. The semiconductor chip includes a CSP (chip size package), an FC (flip chip) or a BGA (ball grid array) semiconductor chip.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2007129036A

公开(公告)日：2007-05-24

申请号：JP2005319713

申请日：2005-11-02

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUZUKI ICHIRO ,  SAKAMOTO ZENJI ,  TANAHASHI AKIRA ,  OSHIRO MASARU ,  INOMATA SUMITOMO

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/005 ,  B23K101/42

Abstract: PROBLEM TO BE SOLVED: To provide a laser soldering method for improving the performance and the reliability of soldering.
SOLUTION: (1) When soldering is conducted with irradiation of laser, an inserting position of a lead 12 for a through-hole 15 is detected, and thereby a solder material is supplied from the direction where distance is longer between the lead 12 and a land 14. (2) After the lead is provided through a shielding plate for shielding the laser beam, it is inserted into the through-hole. (3) Soldering is conducted by using an oval type laser beam in the size less than the oval type land. (4) Length L of the lead projected from a circuit board is determined that the light, reflected from a side surface of load, is incident on the land. (5) The wavelength of the laser beam is set as a wavelength, showing lower absorption coefficient of the circuit board. (6) The solder, containing rosin purified by distillation or synthetic resin, is used.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供用于提高焊接性能和可靠性的激光焊接方法。 （1）当通过激光照射进行焊接时，检测用于通孔15的引线12的插入位置，从而在引线之间的距离更长的方向上供给焊料材料 （2）在通过用于屏蔽激光束的屏蔽板提供引线之后，将其插入到通孔中。 （3）通过使用尺寸小于椭圆形地面的椭圆形激光束进行焊接。 （4）从电路板投影的引线的长度L被确定为从负载侧表面反射的光入射在焊盘上。 （5）将激光束的波长设定为波长，显示出较低的电路板吸收系数。 （6）使用通过蒸馏或合成树脂纯化的松香的焊料。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005328593A

公开(公告)日：2005-11-24

申请号：JP2004142070

申请日：2004-05-12

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUZUKI ICHIRO ,  INOUE TETSUSHI ,  OSHIRO MASARU ,  YAMAZAKI AKIRA

IPC: H02M1/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacture a power converter exhibiting excellent electrical reliability with high efficiency.
SOLUTION: The method for manufacture a power converter 1 comprising a planar power semiconductor module 10 and a flat tubular cooling tube 20 provided with a pair of power terminals 150 and a set of control terminals 160, a semiconductor stack unit 2 stacking semiconductors alternately, a power bus bar 30 connected electrically with the power terminal 150, and a control board connected electrically with the control terminal 160 comprises a step for fusion-bonding the power bus bar 30 to the power terminal 150 of the semiconductor stack unit 2, and a step for solder-bonding each control terminal 160 of the semiconductor stack unit 2 to a predetermined connecting position of the control board 40 following the power terminal connecting step.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种以高效率显示优异的电可靠性的电力转换器的制造方法。 解决方案：制造功率转换器1的方法，其包括平面功率半导体模块10和设置有一对电源端子150和一组控制端子160的扁平管状冷却管20，半导体堆叠单元2堆叠半导体 或者，与电源端子150电连接的电力汇流条30以及与控制端子160电连接的控制板包括用于将电力汇流条30熔接到半导体堆叠单元2的电力端子150的步骤， 以及在电源端子连接步骤之后将半导体堆叠单元2的每个控制端子160焊接到控制板40的预定连接位置的步骤。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JPH10112581A

公开(公告)日：1998-04-28

申请号：JP15850697

申请日：1997-06-16

Applicant: DENSO CORP

Inventor： TAKEMOTO MASANORI ,  OSHIRO MASARU ,  AOYAMA MASAYUKI ,  KONDO KENJI ,  YOSHINO MUTSUMI

IPC: H05K3/34 ,  H05K3/30

Abstract: PROBLEM TO BE SOLVED: To make possible soldering of all the leads of an electronic component by surely absorbing the variations of its leads, even when there exist the variations in the heights of its leads for its soldering to a board. SOLUTION: Interposing an adsorbent between an electronic part 100, its main body 101 and a board 200, the viscosity of the adsorbent is made reductive when heating the solder. That is, in the case of soldering, expanding the adsorbent along the whole surface of the board 200 and electronic component 100, as a result, the electronic component 100 is attracted to the side of the board 200 by the capillary force of the adsorbent to deform leads 102 by this attractive force and absorb the variations in the heights of the leads 102.

公开(公告)号：JP2011029659A

公开(公告)日：2011-02-10

申请号：JP2010222557

申请日：2010-09-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUZUKI ICHIRO ,  SAKAMOTO ZENJI ,  TANAHASHI AKIRA ,  OSHIRO MASARU ,  INOMATA SUMITOMO

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/005 ,  B23K3/06 ,  B23K35/26 ,  B23K35/363 ,  B23K101/42 ,  C22C13/00

Abstract: PROBLEM TO BE SOLVED: To provide a laser soldering method which improves performance and reliability of soldering.
SOLUTION: (1) When soldering by laser radiation, an insert position of a lead 12 to a through-hole 15 is detected, and a material of a solder is supplied from a direction of a long distance between the lead 12 and land 14. (2) The lead is passed through the shielding board shielding the laser light, thereafter inserted into the through-hole. (3) The soldering is performed using oval shaped laser light whose size does not expand off from an oval shaped land. (4) A projection length L of the lead from the circuit board is determined so that the reflection light reflected by the lead side face is incident on the land. (5) The wavelength of the laser light is set to a wavelength with lower absorption ratio by the circuit board. (6) A flux-containing solder including distilled and purified rosin or synthetic resin is used.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供提高焊接性能和可靠性的激光焊接方法。 （1）当通过激光辐射焊接时，检测到引线12到通孔15的插入位置，并且从引线12和引线12之间的长距离的方向供给焊料的材料 （2）引线穿过屏蔽板屏蔽激光，然后插入通孔。 （3）使用椭圆形的激光进行焊接，其尺寸不会从椭圆形的焊盘伸出。 （4）确定来自电路板的引线的突出长度L，使得由引线侧面反射的反射光入射到焊盘上。 （5）通过电路板将激光的波长设定为具有较低吸收率的波长。 （6）使用含有蒸馏精制松香或合成树脂的含助焊剂的焊剂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2005205418A

公开(公告)日：2005-08-04

申请号：JP2004011745

申请日：2004-01-20

Applicant: Denso Corp ,  Toyota Motor Corp ,  トヨタ自動車株式会社 ,  株式会社デンソー

Inventor： NAKASE YOSHIMI ,  SAKAMOTO ZENJI ,  OSHIRO MASARU ,  KANO MICHIO ,  YOSHIDA TOMOMASA

IPC: B23K1/00 ,  H01L21/58 ,  H01L21/60 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: PROBLEM TO BE SOLVED: To inexpensively reduce voids in solder in a joined structure manufacturing method in which a first joining member and a second joining member are joined with each other via solder. SOLUTION: While an IGBT element 10 which is a first joining member and a ceramic substrate 20 which is a second joining member are brought into contact with each other via solder 30, both joining members are placed in an evacuated state at the temperature not higher than the solidus of the solder 30. Successively, in this evacuated state, both joining members are heated to the temperature not lower than the liquidus of the solder 30. Then, both joining members are pressurized at the temperature not lower than the liquidus of the solder 30 to the pressure P2 higher than the pressure P1 in the evacuated state, and the solder 30 is solidified in the pressurized state. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了廉价地减少在第一接合构件和第二接合构件通过焊料彼此接合的接合结构制造方法中的焊料中的空隙。 解决方案：作为第一接合构件的IGBT元件10和作为第二接合构件的陶瓷基板20通过焊料30彼此接触，两个接合构件都处于处于抽真空状态的温度 不高于焊料30的固相线。接着，在该抽真空状态下，将两个接合构件加热至不低于焊料30的液相线的温度。然后，两个接合构件在不低于液相线的温度下被加压 焊料30的压力高于真空状态下的压力P1，焊料30在加压状态下固化。 版权所有（C）2005，JPO＆NCIPI