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公开(公告)号：JP6420015B2
公开(公告)日：2018-11-07
申请号：JP2018109570
申请日：2018-06-07
申请人： 日鉄マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45609 , H01L2224/45618 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45678 , H01L2224/48011 , H01L2224/48247 , H01L2224/48507 , H01L2224/85065 , H01L2224/85075 , H01L2224/85439 , H01L2924/10253 , H01L2924/1576 , H01L2924/20752 , H01L2924/013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01007 , H01L2924/01001 , H01L2924/01028 , H01L2924/00013 , H01L2924/20656 , H01L2924/01046 , H01L2924/01078 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01045 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01083 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204
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公开(公告)号：JP6410692B2
公开(公告)日：2018-10-24
申请号：JP2015168713
申请日：2015-08-28
申请人： 田中電子工業株式会社
CPC分类号： H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48247 , H01L2224/48451 , H01L2224/48456 , H01L2224/78301 , H01L2224/85 , H01L2924/00011 , H01L2924/01079 , H01L2924/01047 , H01L2924/01015 , H01L2924/01028 , H01L2924/01046 , H01L2924/01078 , H01L2924/013 , H01L2924/01026 , H01L2924/0103 , H01L2924/01034 , H01L2924/0105 , H01L2924/01052 , H01L2924/01083 , H01L2924/00013 , H01L2924/01033 , H01L2924/01206
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公开(公告)号：JP6388427B2
公开(公告)日：2018-09-12
申请号：JP2011541475
申请日：2009-12-18
发明人： ヴァル、クリスチャン , クルデルク、パスカル , ヴァル、アレクサンドル
CPC分类号： H01L21/6835 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/96 , H01L2221/68377 , H01L2224/04105 , H01L2224/13139 , H01L2224/16 , H01L2224/2919 , H01L2224/29298 , H01L2224/81201 , H01L2224/81801 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H05K1/141 , H05K1/185 , H05K3/321 , H05K2203/1469 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/0401
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公开(公告)号：JP6353486B2
公开(公告)日：2018-07-04
申请号：JP2016096235
申请日：2016-05-12
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
CPC分类号： H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45609 , H01L2224/45618 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45678 , H01L2224/48011 , H01L2224/48247 , H01L2224/48507 , H01L2224/85065 , H01L2224/85075 , H01L2224/85439 , H01L2924/10253 , H01L2924/1576 , H01L2924/20752 , H01L2924/013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01007 , H01L2924/01001 , H01L2924/01028 , H01L2924/00013 , H01L2924/20656 , H01L2924/01046 , H01L2924/01078 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01045 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01083 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204
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公开(公告)号：JP6352205B2
公开(公告)日：2018-07-04
申请号：JP2015031242
申请日：2015-02-20
IPC分类号： H01L21/60
CPC分类号： H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11462 , H01L2224/1147 , H01L2224/11901 , H01L2224/1308 , H01L2224/13084 , H01L2224/13147 , H01L2224/13583 , H01L2224/13611 , H01L2224/13655 , H01L2224/16 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T428/24612 , H01L2924/00014 , H01L2924/01083 , H01L2924/01015 , H01L2224/13099 , H01L2924/00 , H01L2224/1146
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公开(公告)号：JP6306076B2
公开(公告)日：2018-04-04
申请号：JP2016065961
申请日：2016-03-29
申请人： ジプトロニクス・インコーポレイテッド
发明人： ポール・エム・エンキスト
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18 , H01L21/60 , H01L21/3205 , H01L21/768 , H01L23/522 , H01L21/8249 , H01L27/06 , H01L21/8238 , H01L27/092 , H01L21/8234 , H01L27/088 , H01L27/00
CPC分类号： H01L21/76898 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/48091 , H01L2924/00013 , H01L2924/01057 , H01L2924/10253 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/1461 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00
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公开(公告)号：JP6276501B2
公开(公告)日：2018-02-07
申请号：JP2012267962
申请日：2012-12-07
申请人： 田中電子工業株式会社
CPC分类号： H01L2224/05624 , H01L2224/29144 , H01L2224/43 , H01L2224/43848 , H01L2224/45 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48511 , H01L2224/48624 , H01L2224/85205 , H01L2924/00011 , H01L2924/013 , H01L2924/01322 , H01L2924/12041 , Y02B20/181 , H01L2924/00 , H01L2924/01029 , H01L2924/00015 , H01L2924/01017 , H01L2924/01105 , H01L2924/01046 , H01L2924/01079 , H01L2924/01205 , H01L2924/01057 , H01L2924/0102 , H01L2924/01063 , H01L2924/0105 , H01L2924/01203 , H01L2924/01014 , H01L2924/20752 , H01L2924/00014 , H01L2924/01055 , H01L2924/00013 , H01L2924/01049 , H01L2924/00012 , H01L2924/01004
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公开(公告)号：JP6254649B2
公开(公告)日：2017-12-27
申请号：JP2016151318
申请日：2016-08-01
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
CPC分类号： H01L24/45 , B23K35/0227 , B23K35/3013 , B23K35/302 , B23K2201/40 , C22C5/04 , C22C9/00 , C22C9/04 , C22C9/06 , H01L24/05 , H01L24/43 , H01L24/48 , H01L2224/05624 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43986 , H01L2224/45 , H01L2224/45005 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45118 , H01L2224/4512 , H01L2224/45147 , H01L2224/45155 , H01L2224/45169 , H01L2224/45173 , H01L2224/45178 , H01L2224/45541 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48227 , H01L2224/4845 , H01L2224/48463 , H01L2224/48824 , H01L2224/78 , H01L2224/78251 , H01L2224/85 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85444 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01052 , H01L2924/01057 , H01L2924/0665 , H01L2924/0705 , H01L2924/10253 , H01L2924/186 , H01L2924/01028 , H01L2924/0103 , H01L2924/01045 , H01L2924/01049 , H01L2924/01077 , H01L2924/01078 , H01L2924/01031 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/00015 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/20752 , H01L2924/00014 , H01L2924/01014 , H01L2924/013 , H01L2924/00013 , H01L2924/20105 , H01L2924/01001 , H01L2924/01007 , H01L2924/00012 , H01L2924/00
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公开(公告)号：JPWO2016204138A1
公开(公告)日：2017-09-14
申请号：JP2017525235
申请日：2016-06-14
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/45 , B23K35/0227 , B23K35/3013 , B23K35/302 , B23K2201/40 , C22C5/04 , C22C9/00 , C22C9/04 , C22C9/06 , H01L24/05 , H01L24/43 , H01L24/48 , H01L2224/05624 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43986 , H01L2224/45 , H01L2224/45005 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45118 , H01L2224/4512 , H01L2224/45147 , H01L2224/45155 , H01L2224/45169 , H01L2224/45173 , H01L2224/45178 , H01L2224/45541 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48227 , H01L2224/4845 , H01L2224/48463 , H01L2224/48824 , H01L2224/78 , H01L2224/78251 , H01L2224/85 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85444 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01052 , H01L2924/01057 , H01L2924/0665 , H01L2924/0705 , H01L2924/10253 , H01L2924/186 , H01L2924/01028 , H01L2924/0103 , H01L2924/01045 , H01L2924/01049 , H01L2924/01077 , H01L2924/01078 , H01L2924/01031 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/00015 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/20752 , H01L2924/00014 , H01L2924/01014 , H01L2924/013 , H01L2924/00013 , H01L2924/20105 , H01L2924/01001 , H01L2924/01007 , H01L2924/00012 , H01L2924/00
摘要： Cu合金芯材と、前記Cu合金芯材の表面に形成されたPd被覆層とを有する半導体装置用ボンディングワイヤにおいて、前記ボンディングワイヤが高温環境下における接続信頼性を付与する元素を含み、下記(1)式で定義する耐力比が1.1〜1.6であることを特徴とする。耐力比=最大耐力/0.2%耐力 (1)
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公开(公告)号：JP2017135397A
公开(公告)日：2017-08-03
申请号：JP2017050510
申请日：2017-03-15
申请人： ボンドテック株式会社
发明人： 山内 朗
CPC分类号： H01L25/50 , H01L21/67144 , H01L21/6835 , H01L24/75 , H01L24/80 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2221/68354 , H01L2221/68381 , H01L2224/0401 , H01L2224/05571 , H01L2224/05647 , H01L2224/08145 , H01L2224/13023 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75753 , H01L2224/7598 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81191 , H01L2224/81201 , H01L2224/81815 , H01L2224/8183 , H01L2224/83 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/15788 , H01L2924/3511
摘要： 【課題】複数の電子部品を基板上に平面配置して実装することをさらに容易に実現することが可能な実装技術を提供する。 【解決手段】基板WA上に複数のチップCP1が平面配置されて積層される。次に、仮基板WT2上に形成された樹脂層RS2に、チップCP1上に実装する第2層の複数のチップCP2がフェイスアップ状態で平面配置され仮固定される。そして、仮基板WT2の上下を反転して第2層の複数のチップCP2をフェイスダウン状態で仮基板WT2に保持し、基板WAと仮基板WT2とを位置合わせしながら、第2層の各チップCP2と基板WA上の第1層の各チップCP1とが相対的に接近させ、各チップCP1と各チップCP2とが接合する。さらに、各チップCP2が各チップCP1に接合された状態を維持しつつ、第2層の複数のチップCP2から仮基板WT2が分離される。上記工程を繰り返して積層体を得る。 【選択図】図22
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搜索结果
1909 条记录 (耗时 0.042 秒)
