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    Jig for measurement, wire saw, and workpiece mounting method
    92.
    发明专利
    Jig for measurement, wire saw, and workpiece mounting method 有权
    用于测量，电线和工作安装方法

    公开(公告)号：JP2012183615A

    公开(公告)日：2012-09-27

    申请号：JP2011049054

    申请日：2011-03-07

    Applicant: Komatsu Ntc Ltd ,  コマツNtc株式会社

    Inventor： MATSUDA AKIHIRO ,  TANIZAKI HIROSHI

    IPC: B24B27/06 ,  B28D5/04 ,  H01L21/304

    CPC classification number: B28D5/0082 ,  B28D5/0064 ,  B28D5/045

    Abstract: PROBLEM TO BE SOLVED: To provide a jig for measurement and a wire saw, in which workability is improved and a working efficiency is improved thanks to no need of adjustment each time a workpiece is mounted on a workpiece support section, of the posture of the workpiece relative to the wire saw.SOLUTION: The wire saw includes: a workpiece support section 27 capable of adjusting the position around an axis extending in the vertical direction; and a jig for workpieces detachably attached to the workpiece support section 27 through a plurality of clamp fittings 30 having the positioning function. In place of the jig for workpieces, the jig for measurement 42 is provided to be detachably attached to the workpiece support section 27 through the clamp fittings 30. The jig for measurement 42 is equipped with a camera 44 for detecting the position of a wire 25 between main rollers of the wire saw. The position of the workpiece support section 27 is adjusted based on the position of the wire 25 detected by the camera 44, and the clamp fittings 30 are positioned to predetermined positions relative to the wire 25.

    Abstract translation: 要解决的问题：为了提供一种用于测量的夹具和线锯，其中，每当工件安装在工件支撑部分上时，不需要调整，其中可操作性提高并且提高了工作效率， 工件相对于钢丝锯的姿势。 解决方案：线锯包括：能够调节围绕在垂直方向上延伸的轴线的位置的工件支撑部分27; 以及用于通过具有定位功能的多个夹具配件30可拆卸地附接到工件支撑部27的工件的夹具。 用于测量的夹具用于通过夹具30可拆卸地安装在工件支撑部分27上。测量用夹具42配备有用于检测线25的位置的照相机44 在线锯的主辊之间。 基于由照相机44检测到的线25的位置来调整工件支撑部27的位置，并且夹具配件30相对于线25定位到预定位置。（C）2012年， JPO＆INPIT

    Apparatus and method for separating and conveying substrate
    93.
    发明专利
    Apparatus and method for separating and conveying substrate 审中-公开
    用于分离和输送基板的装置和方法

    公开(公告)号：JP2012060130A

    公开(公告)日：2012-03-22

    申请号：JP2011196739

    申请日：2011-09-09

    Applicant: Rena Gmbh ,  レナ ゲーエムベーハー

    Inventor： RENN SIEGFRIED ,  ROLLAND DECHANT WAGNER

    IPC: H01L21/677 ,  H01L21/304

    CPC classification number: H01L21/67706 ,  B28D5/0082 ,  B65G59/068 ,  H01L21/67092 ,  H01L21/67718

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for separating, deflecting and conveying board-shaped substrates (3) such as a solar wafer.SOLUTION: An apparatus (1) for separating, deflecting and conveying the plurality of board-shaped substrates (3), each having a shape of a substrate stack (5), disposed in liquid successively in an aligned manner in a transfer direction, comprises belt conveyors (9) disposed in a vertical direction, including at least two conveyor belts (11, 11''). A conveyance region (10) of the belt conveyors (9) is disposed on a forward side (12) of one end of the stack (5) in parallel to a forward side (12). Each belt conveyor (9) includes a vacuum apparatus (16). A substrate (3) in the top forward position of the stack (5) is capable of being sucked to at least a first conveyor belt (11) by the vacuum apparatus (16). At least the two conveyor belts (11, 11'') of the belt conveyors (9) in the vertical direction are disposed mutually on an identical plane in an adjacent region.

    Abstract translation: 要解决的问题：提供一种用于分离，偏转和输送诸如太阳能晶片的板状基板（3）的装置和方法。 解决方案：一种用于分离，偏转和输送多个板状基板（3）的装置（1），每个基板叠层（5）的形状依次以对准的方式设置在液体中 方向，包括沿垂直方向设置的带式输送机（9），其包括至少两个传送带（11,11“）。 带式输送机（9）的输送区域（10）平行于前方（12）设置在堆叠（5）的一端的前侧（12）上。 每个带式输送机（9）包括真空装置（16）。 堆叠（5）的顶部向前位置的基板（3）能够被真空装置（16）吸入至少第一传送带（11）。 带式输送机（9）的至少两个输送带（11,11“）在垂直方向上相互放置在相邻区域的同一平面上。 版权所有（C）2012，JPO＆INPIT

    Semiconductor wafer separation unit
    95.
    发明专利
    Semiconductor wafer separation unit 有权
    半导体分离单元

    公开(公告)号：JP2011249640A

    公开(公告)日：2011-12-08

    申请号：JP2010122586

    申请日：2010-05-28

    Applicant: Et System Engineering Co Ltd ,  イーティーシステムエンジニアリング株式会社

    Inventor： SASAKI TAMOTSU

    IPC: H01L21/304 ,  B28D5/00

    CPC classification number: B28D5/0082

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor wafer separation unit for definitely separating sliced wafers one by one and the wafers are not damaged by separation.SOLUTION: The semiconductor wafer separation unit includes a separation tank 1 where a separation liquid containing particles P is circulating. As a result, sludge such as a cooling agent or slicing swarf remaining between sliced wafers are removed from spaces between the wafers and discharged from the bottom of the separation tank 1 as slurry. Additionally, the particles P enter and stay in the spaces between the wafers when the sludge is removed from the spaces between the wafers thereby preventing the wafers from sticking with each other and maintaining a clearance between the wafers constant.

    Abstract translation: 要解决的问题：为了提供一个一个地明确分离切片晶片的半导体晶片分离单元，并且晶片不会被分离而损坏。 解决方案：半导体晶片分离单元包括分离槽1，其中含有颗粒P的分离液体循环。 结果，从切片晶片之间留下的诸如冷却剂或切片屑之类的污泥从晶片之间的空间中排出并从分离槽1的底部排出作为浆料。 此外，当从晶片之间的空间移除污泥时，颗粒P进入并停留在晶片之间的空间中，从而防止晶片彼此粘附并保持晶片之间的间隙恒定。 版权所有（C）2012，JPO＆INPIT

    Processing method of wafer, and polishing device and cutting device used for the same
    96.
    发明专利
    Processing method of wafer, and polishing device and cutting device used for the same 有权
    抛光加工方法及抛光装置及其切割装置

    公开(公告)号：JP2011249449A

    公开(公告)日：2011-12-08

    申请号：JP2010119204

    申请日：2010-05-25

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： TAKATAKE KYOHEI ,  MORITA HIROMITSU ,  KANO FUMIYOSHI ,  YAMAGUCHI TETSUJI ,  INOMATA SUMITOMO ,  NAGAYA MASATAKE

    IPC: H01L21/304

    CPC classification number: B28D5/022 ,  B28D5/0082 ,  H01L21/02008 ,  H01L21/02013

    Abstract: PROBLEM TO BE SOLVED: To provide a processing method of a wafer which can improve processing efficiency and also to provide a processing device used for the processing method of the wafer.SOLUTION: The processing method of the wafer includes a wafer processing step in which an ingot 11 is cut off to form a wafer 31, and a planarization step in which the surface of the wafer 31 is polished and flattened. The planarization step includes a reforming layer forming/polishing step in which the wafer 31 is disposed at a wafer holding part 32, the wafer 31 is processed while being rotated, the heat quantity is applied to a portion to be polished out of the wafer 31 to form a reforming layer 31a, and a polishing tool 33 is abutted on the portion to which the heat quantity is applied out of the wafer 31 to polish while being rotated.

    Abstract translation: 解决的问题：提供能够提高处理效率的晶片的处理方法，并且还提供用于晶片的处理方法的处理装置。 解决方案：晶片的处理方法包括晶片加工步骤，其中切割晶锭11以形成晶片31，并且平坦化步骤，其中晶片31的表面被抛光和变平。 平面化步骤包括重整层形成/研磨步骤，其中晶片31设置在晶片保持部32处，晶片31被旋转处理，将热量施加到晶片31的待抛光部分 以形成重整层31a，并且抛光工具33抵接在从晶片31施加热量的部分上，同时旋转抛光。 版权所有（C）2012，JPO＆INPIT

    Scribing apparatus and scribing method
    99.
    发明专利
    Scribing apparatus and scribing method 有权
    筛选装置和筛选方法

    公开(公告)号：JP2010194784A

    公开(公告)日：2010-09-09

    申请号：JP2009040354

    申请日：2009-02-24

    Applicant: Mitsuboshi Diamond Industrial Co Ltd ,  三星ダイヤモンド工業株式会社

    Inventor： SOYAMA MASANOBU

    IPC: B28D5/00 ,  B28D1/24 ,  C03B33/037

    CPC classification number: B28D5/0011 ,  B28D5/0064 ,  B28D5/0082 ,  C03B33/027 ,  C03B33/037

    Abstract: PROBLEM TO BE SOLVED: To scribe small-sized brittle material substrates in good work properties.
    SOLUTION: On a table 106, a plurality of the brittle material substrates 107a-107i are positioned each by a positioning pin 109 and arranged. A recipe data table is held in advance in each brittle material substrate. The brittle material substrate and a scribe head are moved relatively on the basis of the recipe data table, and an inner cutting scribe or an outer cutting scribe is carries out in each substrate. In this way, scribing work of a plurality of sheets can be carried out all together by automatic operation.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：以良好的工作性能划分小尺寸的脆性材料基材。 解决方案：在台106上，多个脆性材料基板107a-107i分别由定位销109定位并布置。 预先在每个脆性材料基板中保持配方数据表。 基于配方数据表，脆性材料基板和划线头相对移动，在每个基板中进行内切割划线或外切割划线。 以这种方式，可以通过自动操作一起执行多个片材的划线工作。 版权所有（C）2010，JPO＆INPIT

    Method and apparatus for manufacturing a thin disc or film from the semiconductor body
    100.
    发明专利
    Method and apparatus for manufacturing a thin disc or film from the semiconductor body 审中-公开

    公开(公告)号：JP2010525559A

    公开(公告)日：2010-07-22

    申请号：JP2010503351

    申请日：2008-04-15

    Applicant: エイセレ,クリストファー

    Inventor： エイセレ，クリストファー

    IPC: H01L21/304 ,  B23K26/00 ,  B23K26/38 ,  B28D5/00

    CPC classification number: B28D5/0082 ,  B23K26/0624 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  B28D5/04 ,  Y10T83/0448 ,  Y10T83/202

    Abstract: 本発明は、半導体本体（１）から薄ディスク又はフィルム（３）を製造するための１つの方法及び１つの装置に関する。 好ましくは、レーザーが切削工具（２）として用いられる。 レーザーのビームは、半導体フィルム（３）を切削するために、点状に形づくられた強度プロフィールよりもむしろ線状の強度プロフィールが作り出されるような形で、適切な工学的手段、たとえば１つの円柱レンズを用いて集中される。 さらに、半導体本体（１）の幅全体にわたる１つの分離線が形成され、その結果、切断線の全体が準連続的に（前記レーザーの繰り返し率に従って）取り除かれることができるようにいくつかの線状の強度プロフィールを並べることが有効である。 理想的には、半導体本体（１）に向かい合った集光レーザービームは、半導体本体（１）の端部に対して平行に伸びるべきである。 切削工具（２）の先端（９）付近では、半導体本体（３）に向けられた側では、周辺ビームが半導体フィルム（３）の曲げ半径に従い、焦点（切削工具（２）の先端）からの距離が大きくなるに応じて、それだけ大きなギャップが形成される。
    【選択図】 図１

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