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    Adhesive tape for manufacturing of semiconductor wafer and the like
    21.
    发明专利
    Adhesive tape for manufacturing of semiconductor wafer and the like 有权
    胶粘带用于制造半导体波形和类似物

    公开(公告)号：JP2013157420A

    公开(公告)日：2013-08-15

    申请号：JP2012016239

    申请日：2012-01-30

    Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

    Inventor： ODA NAOYA

    IPC: H01L21/301 ,  C09J4/02 ,  C09J7/02 ,  C09J11/06 ,  C09J175/04 ,  C09J175/14 ,  C09J201/06 ,  C09J201/08

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive tape for manufacturing of a semiconductor wafer and the like, which can exert a good pickup property even when adhered to a wafer within a few hours after grinding.SOLUTION: An adhesive tape for manufacturing of a semiconductor wafer and the like comprises a base material layer and an adhesive layer. The adhesive layer contains base polymer, isocyanate-based cross-linking agent and urethane acrylate. The urethane acrylate has residual polymerization catalyst which is used in manufacturing of the urethane acrylate and a residual amount of the polymerization catalyst is not less than 70 ppm and not more than 200 ppm.

    Abstract translation: 要解决的问题：提供一种用于制造半导体晶片等的胶带，其即使在研磨后几小时内也可以发挥良好的拾取性能。解决方案：用于制造半导体的胶带 晶片等包括基材层和粘合剂层。 粘合剂层包含基础聚合物，异氰酸酯基交联剂和氨基甲酸酯丙烯酸酯。 氨基甲酸酯丙烯酸酯具有用于制造氨基甲酸酯丙烯酸酯的残留聚合催化剂，并且聚合催化剂的残留量不小于70ppm且不大于200ppm。

    Water-dispersed adhesive composition, adhesive layer, adhesive member, and image display device
    23.
    发明专利
    Water-dispersed adhesive composition, adhesive layer, adhesive member, and image display device 有权
    水分散胶粘组合物，胶粘剂层，粘合剂和图像显示装置

    公开(公告)号：JP2012126789A

    公开(公告)日：2012-07-05

    申请号：JP2010278129

    申请日：2010-12-14

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： TAKAHASHI TOSHIKI ,  OKADA KENICHI ,  SHIMOKURI DAIKI ,  MAKIHATA YOSUKE ,  SHIMOKAWA KAYO ,  HOSOKAWA TOSHITSUGU ,  INUI KUNIHIRO ,  ISHII TAKAAKI

    IPC: C09J133/06 ,  B32B27/00 ,  B32B27/30 ,  C09J7/02 ,  C09J201/08 ,  G02F1/1335

    Abstract: PROBLEM TO BE SOLVED: To provide a water-dispersed adhesive capable of forming an adhesive layer which is excellent in initial adhesion strength.SOLUTION: A water-dispersed adhesive composition which comprises an aqueous dispersion includes: water-dispersed (meth) acrylic copolymer (A) whose glass transition temperature is ≥-55°C and ≤0°C; water-dispersed (meth) acrylic copolymer (B) whose glass transition temperature is ≥0°C and ≤180°C; and (C) water-soluble resin. At least either the water-dispersed (meth) acrylic copolymer (A) or that of (B) has a carboxy group-containing monomer as a monomer unit. The difference between the glass transition temperatures of the (A) and (B) is equal to or more than 50°C, and the mixing ratio of the aqueous dispersions whose range is (A)/(B)=50-95/5-50 (solid content weight ratio).

    Abstract translation: 要解决的问题：提供能够形成初始粘合强度优异的粘合剂层的水分散粘合剂。 解决方案：包含水分散体的水分散粘合剂组合物包括：玻璃化转变温度≥-55℃和≤0℃的水分散（甲基）丙烯酸共聚物（A）; 玻璃化转变温度≥0℃，≤180℃的水分散（甲基）丙烯酸共聚物（B） 和（C）水溶性树脂。 水分散的（甲基）丙烯酸系共聚物（A）或（B）的至少任意一种具有含羧基的单体作为单体单元。 （A）和（B）的玻璃化转变温度之差等于或大于50℃，范围为（A）/（B）= 50-95 / 5的水性分散体的混合比 -50（固体成分重量比）。 版权所有（C）2012，JPO＆INPIT

    Two-component reaction type hot melt resin composition and method of application thereof
    24.
    发明专利
    Two-component reaction type hot melt resin composition and method of application thereof 审中-公开
    两组分反应型热熔树脂组合物及其应用方法

    公开(公告)号：JP2010116530A

    公开(公告)日：2010-05-27

    申请号：JP2009014357

    申请日：2009-01-26

    Applicant: Yasuhara Chemical Co Ltd ,  ヤスハラケミカル株式会社

    Inventor： GOTO HIDEO ,  KONDO HIDEKI ,  TAKEUCHI SHOJI

    IPC: C09J163/00 ,  B05B7/08 ,  B05C5/04 ,  B05D7/24 ,  C09J201/08

    Abstract: PROBLEM TO BE SOLVED: To provide a two-component reaction type resin composition which is heat resistant and environment-friendly; and to provide an apparatus and a method of application thereof with uniform and stable application workability and ease of maintenance, causing no gelation due to contact or mixing of liquids in the application apparatus and in the vicinity of nozzle unit tip end in the stoppage of spouting.
    SOLUTION: This two-component reaction type hot melt resin composition is such that a first liquid is brought into contact with a second liquid, whereby a curing agent or curing promotor in the second liquid penetrates into the first liquid and reaction proceeds. The apparatus and method of application are such that the two-component reaction type hot melt resin composition is spouted from different spout ports in proximity without mixing in the apparatus, and comes into contact or mix in the air to proceed reaction; and the nozzle units in the apparatus comprises intermediate shims, comb-like shims having comb-like grooves at both ends thereof, an independent hot-melt feeding platform having channels for feeding the material to the comb-like shims, air-slit shims and an air unit.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供耐热且环保的双组分反应型树脂组合物; 并且提供其均匀且稳定的应用可加工性和易于维护的装置和方法，其在施加装置中的液体的接触或混合以及在喷射停止中的喷嘴单元末端附近不引起凝胶化 。 解决方案：这种双组分反应型热熔树脂组合物是使第一液体与第二液体接触，由此第二液体中的固化剂或固化促进剂渗透到第一液体中并进行反应。 该装置和应用方法使得双组分反应型热熔树脂组合物在不受混合的情况下从不同的喷口口喷出，并在空气中接触或混合进行反应; 装置中的喷嘴单元包括中间垫片，其两端具有梳状槽的梳状垫片，具有用于将材料馈送到梳状垫片的通道的独立的热熔供给平台，气流狭缝垫片和 一个空气单元。 版权所有（C）2010，JPO＆INPIT

    Adhesive composition and optical member
    26.
    发明专利
    Adhesive composition and optical member 审中-公开
    胶粘组合物和光学部件

    公开(公告)号：JP2009132752A

    公开(公告)日：2009-06-18

    申请号：JP2007307659

    申请日：2007-11-28

    Applicant: Cheil Industries Inc ,  チェイル インダストリーズ インコーポレイテッド

    Inventor： SUWA TATSUHIRO ,  OGAWA HIROSHI ,  SONG CHEONG HUN

    IPC: C09J201/08 ,  C09J11/06 ,  C09J133/02 ,  C09J133/26 ,  G02B5/30

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in reworkability, durability and light-leaking resistance and short in a maturing time, and to provide an optical member having the same.
    SOLUTION: The adhesive composition comprises at least a copolymer prepared by copolymerizing at least 96.5 to 99.9 pts.mass of a 1 to 16C alkyl group-having monomer with 0.1 to 1 pt.mass of a carboxyl group-having monomer, a metal chelate-based curing agent in an amount of 0.05 to 1 pt.mass based on 100 pts.mass of the copolymer, and an isocyanate-based curing agent in an amount of 0.05 to 1 pt.mass based on 100 pts.mass of the copolymer.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供可再加工性，耐久性和耐光照性以及成熟时间短的粘合剂组合物，并提供具有该粘合剂组合物的光学部件。 解决方案：粘合剂组合物至少包含通过使至少96.5-99.9重量份的含1至16个C烷基的单体与0.1至1重量％的含羧基的单体共聚制备的共聚物， 金属螯合物类固化剂，相对于共聚物为100质量份为0.05〜1质量％，异氰酸酯系固化剂为0.05〜1质量％，基于100质量份 共聚物。 版权所有（C）2009，JPO＆INPIT

    Heat-sealing pressure-sensitive adhesive sheet
    30.
    发明专利
    Heat-sealing pressure-sensitive adhesive sheet 审中-公开
    热密封压敏粘合片

    公开(公告)号：JP2007186649A

    公开(公告)日：2007-07-26

    申请号：JP2006007603

    申请日：2006-01-16

    Applicant: Panac Co Ltd ,  パナック株式会社

    Inventor： KATO JUNICHI ,  NAKAHARA MINORU

    IPC: C09J7/02 ,  C09J5/06 ,  C09J11/00 ,  C09J153/00 ,  C09J175/04 ,  C09J191/00 ,  C09J201/08

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive which has an excellent transparency, scarcely entraps air bubbles in a bonding interface, does not lose the transparency and has the re-workability allowing an easy re-application, even if air bubbles are entrapped and increases its adhesion strength by heating, after it is applied, and a heat-sealing pressure-sensitive adhesive sheet in which a layer of the adhesive is formed on an substrate sheet. SOLUTION: The heat-sealing pressure-sensitive adhesive sheet is obtained by forming a pressure-sensitive adhesive layer composed of a pressure-sensitive adhesive component containing a thermoplastic elastomer and a plasticizer on the surface of a substrate layer. A sheet-like pressure-sensitive adhesive is obtained by forming the adhesive layer on the surface of the release layer of a release sheet. The adhesive strength is strengthened by heating the part containing the adhesive layer and the pressure-sensitive adhesive layer, after the heat-sealing pressure-sensitive adhesive sheet is applied or an article is adhered via the sheet-like heat-sealing pressure-sensitive adhesive. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供具有优异透明性的粘合剂，几乎不会在接合界面中捕获气泡，即使气泡为空气，也不会失去透明性并且具有允许容易再次施加的再加工性 在施加之后通过加热而夹带并增加其粘附强度，并且在基材片上形成粘合剂层的热封压敏粘合片。 解决方案：热封压敏粘合片通过在基材层的表面上形成由含有热塑性弹性体和增塑剂的压敏粘合剂组分构成的压敏粘合剂层而获得。 通过在剥离片的剥离层的表面上形成粘合剂层来获得片状压敏粘合剂。 通过加热含有粘合剂层和粘合剂层的部分，在施加热封压敏粘合片或通过片状热封压敏粘合剂粘合制品之后，增强粘合强度 。 版权所有（C）2007，JPO＆INPIT

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