Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a casting composed of an Al-Si-Cu-based eutectic alloy capable of also improving ductility, besides having high tensile strength, in the casting composed of the Al-Si-Cu-based eutectic alloy.SOLUTION: The manufacturing method of the casting composed of the Al-Si-Cu-based eutectic alloy, is composed of a first step of irradiating an ultrasonic wave to molten metal up to reducing to the eutectic temperature from the temperature of the liquid phase line temperature or more by generating the molten metal of the eutectic alloy by setting the Al-Si-Cu-based eutectic alloy to the liquid phase line temperature or more, a second step of continuing irradiation of the ultrasonic wave to the molten metal while maintaining the eutectic temperature, a third step of manufacturing a casting precursor by casting the molten metal provided by the second step and a fourth step of manufacturing the casting by executing aging processing on the casting precursor.
Abstract:
PROBLEM TO BE SOLVED: To provide fiber Bragg grating having excellent productivity and a method of manufacturing the same.SOLUTION: In fiber Bragg grating 10, bubbles 13 are periodically formed along the longitudinal direction of a core 12a, which is a part of multi core fiber 11. In a method of manufacturing fiber Bragg grating, bubbles 13 are periodically formed along the longitudinal direction of the core 12a, which is a part of the multi core fiber 11 using a fiber fuse phenomenon.
Abstract:
PROBLEM TO BE SOLVED: To provide a photoelectric conversion element which enables mass-production of an ultrathin and uniform thin film having reproducibility at low cost, and which can easily reduce an interface state between a semiconductor and a thin film interface, and which does not cause deterioration in reliability and a characteristic change even when used for a long time by passing a large current through the thin film.SOLUTION: A photoelectric conversion element comprises: a crystal semiconductor 12; a first hydrogenated amorphous semiconductor film 16 provided on the crystal semiconductor 12 in vicinity to a first surface 14; and a first low-resistance film 20 provided on the crystal semiconductor 12 via the first hydrogenated amorphous semiconductor film 16.