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公开(公告)号：JP2009230952A
公开(公告)日：2009-10-08
申请号：JP2008072862
申请日：2008-03-21
Applicant: Asahi Chem Res Lab Ltd , Fukuda Metal Foil & Powder Co Ltd , 株式会社アサヒ化学研究所 , 福田金属箔粉工業株式会社
Inventor： KAJITA OSAMU , ISHIDA MINEO , SUGITANI YUSHI , MOROOKA ISAO , IWASA AKIHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste composition capable of exhibiting conductive characteristics of silver to the maximum, and of satisfying bending characteristics required for a flexible electronic circuit board.
SOLUTION: In the conductive paste composition for the flexible electronic circuit board, a conductive powder composed of a mixed silver powder of a scale-like silver powder of the average particle diameter of 2.0 to 5.0 μm and a specific surface area of 2.0 to 3.0 m
2 /g, and dendritic silver plated copper powder of the average particle diameter 10 to 19 μm, a thermosetting resin, and an organic solvent are made essential components; a mixing ratio of the scale-like silver powder and the dendritic silver plated copper powder is 67 to 100 pts.wt. of the dendritic silver plated copper powder based on 100 pts.wt. of the scale-like silver powder; and in which a plated silver amount of the dendritic silver plated copper powder is 20 to 25 pts.wt. based on 100 pts.wt of a copper powder.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种能够最大限度地表现出银的导电特性并满足柔性电子电路板所需的弯曲特性的导电性糊剂组合物。 解决方案：在柔性电子电路板用导电性糊料组合物中，将由平均粒径为2.0〜5.0μm的鳞状银粉末的混合银粉末和比表面积为2.0构成的导电粉末 平均粒径为10〜19μm的树枝状镀银铜粉末，热固性树脂和有机溶剂成为必要成分; 鳞状银粉末和树枝状镀银铜粉末的混合比为67〜100重量份。 的树枝状镀银铜粉基于100重量份 的鳞状银粉; 其中镀银量的树枝状镀银铜粉为20〜25重量份。 基于100重量ppm的铜粉。 版权所有（C）2010，JPO＆INPIT
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43.发明专利Metal powder having excellent sinterability, method for producing the same, and method for producing sintered compact using the metal powder 审中-公开具有优异耐火性的金属粉末及其制造方法，以及使用金属粉末生产烧结紧固件的方法
公开(公告)号：JP2009167491A
公开(公告)日：2009-07-30
申请号：JP2008009103
申请日：2008-01-18
Applicant: Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社
Inventor： TERAI SHINJI , INABA KOTA , KIKUKAWA SHINRI , KOYAMA TADASHI
Abstract: PROBLEM TO BE SOLVED: To progress sintering at a low temperature in which sintering has been difficult heretofore in silver powder and silver alloy powder, and to produce a sintered compact having excellent ductility and strength.
SOLUTION: Silver powder or silver alloy powder in which the size constituting 50% is 0.5 to 20 μm, and also, sphericity is ≥0.5 is sintered in the presence of a halogen element and/or a halide, thus the growth of a neck part between powder grains is promoted upon sintering, so as to obtain a sintered compact capable of obtaining sufficient ductility and strength even by low temperature sintering, and also, having reduced dimensional shrinkage. The content of the halogen element in the metal powder lies within 5 to 2,000 ppm, and, for producing such metal powder, it is possible that a halogen-containing material as a ductility improving component is mixed into metal powder, or also, it is possible that metal powder is immersed into a solution comprising halogen ions, is discharged, and is dried. Further, it is possible that, using a halogen ion-containing aqueous solution as a spray medium, a molten metal is sprayed by the spray medium, so as to be metal powder.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 待解决的问题：为了在银粉和银合金粉末中难以进行烧结的低温下进行烧结，并制造具有优异的延展性和强度的烧结体。 解决方案：在卤素元素和/或卤化物的存在下烧结其中构成50％的尺寸为0.5至20μm，球形度≥0.5的银粉或银合金粉末，因此生长 在烧结之后促进粉末颗粒之间的颈部部分，从而获得即使通过低温烧结也能够获得足够的延展性和强度的烧结体，并且还具有减小的尺寸收缩。 金属粉末中的卤素元素的含量在5〜2000ppm的范围内，并且为了制造这种金属粉末，可以将作为延展性改善成分的含卤素材料混入金属粉末中，也可以是 可能将金属粉末浸入含有卤离子的溶液中，排出并干燥。 此外，可能的是，使用含卤离子的水溶液作为喷雾介质，通过喷雾介质喷射熔融金属，从而成为金属粉末。 版权所有（C）2009，JPO＆INPIT
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44.发明专利Mixed powder for sintered aluminum-containing copper alloy, and method for producing the same 审中-公开用于烧结的含铝铜合金的混合粉末及其制造方法
公开(公告)号：JP2009007650A
公开(公告)日：2009-01-15
申请号：JP2007171602
申请日：2007-06-29
Applicant: Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社
Inventor： TAKAYA GEN , MASUOKA SACHIKO
Abstract: PROBLEM TO BE SOLVED: To provide mixed powder for a sintered Al-containing Cu alloy capable of obtaining a Cu-Al sintered alloy having satisfactory moldability, having high safety upon handling, and dense and having excellent characteristics even at a low sintering temperature of ≤900°C, and to provide a method for producing the same.
SOLUTION: Al-Cu partially dispersed alloyed powder obtained by subjecting mixed powder composed of Al powder of 40 to 60 mass%, and the balance Cu powder is subjected to heating treatment at 540 to 560°C for 10 to 60 min in a reducing or inert atmosphere and pulverizing the same or mixed powder for a sintered Al-containing Cu alloy using Cu-coated Al powder obtained by immersing Al powder into a Cu salt aqueous solution and precipitating 40 to 60 mass% Cu as an Al source is admixed with the three components of 0.05 to 1% P, 0.5 to 4% Si and 0.1 to 1% Sn.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种能够获得具有令人满意的成型性的Cu-Al烧结合金的烧结的含Al的Cu合金的混合粉末，在处理时具有高的安全性，并且即使在低烧结下也具有优异的特性 温度≤900℃，并提供其制造方法。 解决方案：通过将由Al粉末组成的混合粉末为40〜60质量％，余量为Cu粉末的540℃〜560℃加热处理10〜60分钟，得到Al-Cu部分分散的合金粉末 还原或惰性气氛，并且通过将Al粉末浸入Cu盐水溶液中并使作为Al源的40至60质量％的Cu沉淀而获得的Cu涂覆的Al粉末，将其烧结的含Al Cu合金粉碎或混合粉末为 与0.05〜1％的P，0.5〜4％的Si和0.1〜1％的Sn混合。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009007648A
公开(公告)日：2009-01-15
申请号：JP2007171476
申请日：2007-06-29
Applicant: Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社
Inventor： TERAI SHINJI , KOYAMA TADASHI
Abstract: PROBLEM TO BE SOLVED: To provide a powder for copper-base infiltrant, capable of exhibiting a high infiltration rate against an iron-base substrate.
SOLUTION: The powder for infiltrant is a copper powder for infiltrating into a molded item comprising iron and an iron-based alloy powder or an iron-based mixture powder and is prepared by mixing 0.1-1 mass% of at least one oxide selected from the group consisting of oxides of aluminum, silicon, zirconium, titanium, and magnesium into a raw material powder consisting of 2-7 mass% iron, 1-7 mass% manganese, 0.5-5 mass% zinc, 0.03-0.1 mass% aluminum, and the remnant being copper.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种能够显示出对铁基底板的高渗透率的铜基浸渗剂用粉末。 解决方案：渗透剂粉末是用于浸入包含铁和铁基合金粉末或铁基混合物粉末的模制品中的铜粉末，并且通过混合0.1-1质量％的至少一种氧化物 从由铝，硅，锆，钛和镁的氧化物组成的组中选择为由2-7质量％铁，1-7质量％锰，0.5-5质量％锌，0.03-0.1质量％组成的原料粉末 ％的铝，剩余的是铜。 版权所有（C）2009，JPO＆INPIT
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Patent Agency Ranking46.发明专利
公开(公告)号：JP2008226800A
公开(公告)日：2008-09-25
申请号：JP2007067879
申请日：2007-03-16
Applicant: Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社
Inventor： TAKAMI MASATO , WADA HITOSHI , AKAMINE HISASHI
IPC: H01M4/70
CPC classification number: Y02E60/12
Abstract: PROBLEM TO BE SOLVED: To provide a copper foil for a negative electrode collector for a lithium secondary battery and its manufacturing method effective for delivering more excellent cycle characteristics while maintaining a high discharged capacity.
SOLUTION: An untreated electrolyte copper foil is used, wherein a difference of roughnesses Rz of both surfaces having surface roughnesses Rz 1.5-4.5 μm and gloss surface roughnesses Rz 1.5-4.5 μm is not more than 2 μm. Both of the surfaces of the electrolyte copper foil are roughened to have Rz 3.0-8.0 μm so that the difference of the roughnesses on front and rear surfaces becomes not more than 2 μm.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种用于锂二次电池的负极集电体的铜箔及其制造方法，其有效地提供更优异的循环特性同时保持高放电容量。 解决方案：使用未处理的电解铜箔，其中具有表面粗糙度Rz1.5-4.5μm和光泽表面粗糙度Rz1.5-4.5μm的两个表面的粗糙度差Rz不大于2μm。 电解铜箔的两面均被粗糙化，使得Rz为3.0〜8.0μm，使前后表面的粗糙度差不超过2μm。 版权所有（C）2008，JPO＆INPIT
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48.发明专利
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49.发明专利
公开(公告)号：JP4029265B2
公开(公告)日：2008-01-09
申请号：JP2001354978
申请日：2001-11-20
Applicant: 独立行政法人産業技術総合研究所 , 福田金属箔粉工業株式会社
CPC classification number: Y02E60/122
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公开(公告)号：JP2007284497A
公开(公告)日：2007-11-01
申请号：JP2006111118
申请日：2006-04-13
Applicant: Fukuda Metal Foil & Powder Co Ltd , Nec Tokin Corp , Necトーキン株式会社 , 福田金属箔粉工業株式会社
Inventor： MORIMOTO HIROSHI , KOMATSU MICHIO , YASUDA EITARO , SAITO TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a polymer-type electroconductive coating that can form an electroconductive coating having a low connection resistance.
SOLUTION: The electroconductive coating comprises a silver powder containing 40-200 ppm of a Na ion, which is obtained by washing with water silver particles obtained by chemical reduction deposition of silver nitrate by adding thereto sodium carbonate or sodium hydroxide together with formalin so that electroconductivity at the time of final washing falls within the range of 50-300 μS/cm, a thermoplastic resin and a solvent, where the weight ratio of the silver powder to the thermoplastic resin is within the range from 87:13 to 95:5 and the weight ratio of the total solid content of the silver powder and the thermoplastic resin to the solvent is within the range from 95:5 to 30:70.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供可以形成具有低连接电阻的导电涂层的聚合物型导电涂层。
解决方案：导电涂层包含含有40-200ppm的Na离子的银粉，其通过用通过将甲酸钠或氢氧化钠与福尔马林一起加入其中的硝酸银的化学还原沉积而获得的水银颗粒洗涤而获得 使得最终洗涤时的导电率在50-300μS/ cm的范围内，热塑性树脂和溶剂，其中银粉末与热塑性树脂的重量比在87:13至95的范围内 ：5，银粉末和热塑性树脂与溶剂的总固体成分的重量比在95:5〜30:70的范围内。 版权所有（C）2008，JPO＆INPIT
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