公开(公告)号：JP2003213019A

公开(公告)日：2003-07-30

申请号：JP2002015943

申请日：2002-01-24

Applicant: SUMITOMO BAKELITE CO

Inventor： YABUKI KENTARO ,  HOZUMI TAKESHI ,  BABA TAKAYUKI ,  ARAI MASATAKA

IPC: C08J5/24 ,  B32B15/08 ,  C08K3/00 ,  C08L63/00 ,  C08L79/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide prepregs having excellent dielectric characteristics, laser processability and flame retardancy and provide printed wiring boards. SOLUTION: The prepregs are prepared by impregnating nonwoven fabrics made of organic fiber with a resin composition including cyanate resin and/or its prepolymer, epoxy resin, and inorganic fillers. The printed wiring boards is produced by laminating a metal foil clad on the prepreg and compressing the resultant laminate with heat. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003206360A

公开(公告)日：2003-07-22

申请号：JP2002007643

申请日：2002-01-16

Applicant: SUMITOMO BAKELITE CO

Inventor： YABUKI KENTARO ,  HOZUMI TAKESHI ,  BABA TAKAYUKI ,  ARAI MASATAKA

IPC: C08J5/24 ,  B32B15/08 ,  C08K3/00 ,  C08K7/18 ,  C08L61/06 ,  C08L67/03 ,  C08L77/10 ,  C08L79/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a prepreg excellent in dielectric characteristics, laser processability and flame retardancy, and a printed wiring board. SOLUTION: The prepreg is prepared by impregnating a nonwoven fabric composed of an organic fiber with a resin composition comprising a cyanate resin and/or a prepolymer thereof, a phenolic resin and an inorganic filler. The printed wiring board is prepared by laminating a metallic foil on the prepreg, followed by pressure-molding under heating. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2000252623A

公开(公告)日：2000-09-14

申请号：JP4784099

申请日：1999-02-25

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  ARAI MASATAKA ,  KOMIYATANI TOSHIROU

IPC: H05K3/38 ,  C09J163/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain enough adhesion with a conductor of an insulating adhesive for additive plating in the shrinkage of conductor circuits and the interlayer conductor connection through fine Via holes by allowing the insulating adhesive to comprise at least a specified amount of an epoxy resin, an epoxy resin harden er, thermoplastic resin having a specified characteristic or above, and a metal oxide. SOLUTION: An insulating adhesive for additive plating comprises a bisphenol type epoxy resin having an equivalent weight of 500 or below with respect to an epoxy, a novolak-type epoxy resin, a dicyclopentadiene-type epoxy resin, an epoxy resin hardener such as an aminophenol-type epoxy resin, a resol- or novolak-type phenol resin, an amine compound, an immidazole compound, and an acid anhydride, a thermoplastic resin such as bisphenol A-type epoxy resin having a weight average molecular weight of 10,000 or above and a disphenol F-type epoxy resin, and a metal oxide such as zinc oxide and titanium oxide.

公开(公告)号：JP2000239639A

公开(公告)日：2000-09-05

申请号：JP4783999

申请日：1999-02-25

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  ARAI MASATAKA ,  KOMIYATANI TOSHIROU

IPC: H05K3/46 ,  C08K3/22 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To provide an insulating adhesive for additive plating which is excellent in adhesion to a plating conductor and used suitably for a wiring plate of multilayer-printing. SOLUTION: An insulating adhesive for additive plating contains the following individual components as essential components: (a) a thermosetting resin; and/or (b) a photopolymerizable resin or its monomer, and/or photopolymerizable and thermosetting polymers or their monomers; and (c) a metal oxide. Preferable formulations are composed of: (a11) an epoxy resin having epoxy groups of not more than 500 equivalents; (a2) a curing agent of an epoxy resin; (b1) a diluent comprising a monomer having plural photosensitive functional groups and/or a polyfunctional monomer having photosensitive functional and thermal sensitive groups; (b2) a photopolymerizable initiator; and (c) a metal oxide.

公开(公告)号：JP2000223839A

公开(公告)日：2000-08-11

申请号：JP2641399

申请日：1999-02-03

Applicant: SUMITOMO BAKELITE CO

Inventor： KOMIYATANI TOSHIROU ,  KAMISAKA MASAO ,  ARAI MASATAKA

IPC: H05K3/46 ,  C09J7/02 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To provide flame retardancy without adding halogen by adding a phosphorus compound expressed by a specific chemical formula at a weight ratio within a specific range, and adding multifunctional epoxy resin containing a specific number or more of glycidyl groups, and copolymer of bisphenol F and bisphenol S epoxy resins with a specific weight-average molecular weight. SOLUTION: A phosphorus content of 1.5-10 wt.% of a phosphorus compound expressed by the formula is mixed with resin solid contents composing an interlayer insulating adhesive (in the formula, R1 and R2 are alkyl group and aromatic group). In addition, multifunctional epoxy resin containing three or more glycidyl groups is added, and further copolymer of bisphenol F epoxy resin and bisphenol S epoxy resin with a weight-average molecular weight of 20000-100000 is added. The interlayer insulating adhesive for multilayer printed wiring boards thus constituted does not contain halogen compounds at all which produce dioxin when burnt, and achieves flame retardancy for printed wiring board as per JIS C6481.

公开(公告)号：JP2000216549A

公开(公告)日：2000-08-04

申请号：JP1240299

申请日：1999-01-20

Applicant: SUMITOMO BAKELITE CO

Inventor： ARAI MASATAKA ,  KOMIYATANI TOSHIROU ,  KAMISAKA MASAO

IPC: H05K3/46 ,  C09J7/02 ,  C09J161/12 ,  C09J163/00 ,  C09J181/04 ,  C09J181/06

Abstract: PROBLEM TO BE SOLVED: To develop a flame resistance of a layer insulation adhesive for multilayer printed wiring boards by contg. an S-contg. thermoplastic resin, a specified polyfunctional epoxy resin contg. no halogen, a P-contg. compd. contg. no halogen, and an epoxy curing agent in the adhesive. SOLUTION: A layer insulation adhesive for multilayer printed wiring boards contains an S-contg. thermoplastic resin such as polyphenylene sulfide, polysulfine, polyether sulphone, etc., a polyfunctional epoxy resin contg. no halogen, having an epoxy equivalent of 500 or less, such as bisphenol type A epoxy resin, bisphenol type F epoxy resin, phenol Novolak type epoxy resin, etc., a P-contg. compd. contg. no halogen such as trimethyl sulfonate, tributyl sulfonate, etc., and an epoxy curing agent such as phenol Novolak, amine compd., acid anhydrite, etc.

公开(公告)号：JP2000104033A

公开(公告)日：2000-04-11

申请号：JP27858898

申请日：1998-09-30

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  KOMIYATANI TOSHIROU ,  ARAI MASATAKA ,  HOZUMI TAKESHI

IPC: H05K3/46 ,  C08G59/20 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for preparing multi-layer printed wiring boards excellent in heat resistance, formability and surface smoothness without using an undercoating agent and with high productivity as well. SOLUTION: An inter layer insulation adhesive for a multi-layer printed wiring board comprises, as essential components, (a) an epoxy resin having an epoxy equivalent weight of not more than 500, (b) an epoxy resin curing agent, (c) a diluent composed of a monomer having a plurality of photo- functional groups and/or a polyfunctional monomer having a photo-functional group and a heat-functional group, (d) a photopolymerization initiator, and (e) an inorganic filler. An insulation adhesive film is obtained by coating this insulation adhesive on a carrier film. A method for preparing a multi-layer printed wiring board comprises the steps of laminating this insulation adhesive film on an inner circuit substrate; irradiating the laminated adhesive film with activation energy rays; and heat-curing the resulting film.

公开(公告)号：JPH11186735A

公开(公告)日：1999-07-09

申请号：JP35029997

申请日：1997-12-19

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  HOZUMI TAKESHI ,  ARAI MASATAKA

IPC: G03F7/004 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a smooth insulation layer by heat treating a buildup board having a laminate of a insulation resin dry film to make the dry film surface smooth, before curing. SOLUTION: An insulation resin adhesive compsn. contg. a solid novolak-type epoxy resin, liq. bisphenol A-type epoxy resin, and solid phenol novolak is prepared. The resin adhesive compsn. is applied to a PET carrier film 4 to form an insulation resin film 3 of 70 μm thickness, this film 3 is laminated on an inner layer circuit board 1 having inner layer circuits 2, heat treating is applied at a temp. make a melt viscosity of 1,000-10,000 poises, thereby smoothing the dry film 3. This eliminates the need for the surface polishing, ensures a uniform insulation layer, and enables the impedance control.