公开(公告)号：JP2013053303A

公开(公告)日：2013-03-21

申请号：JP2012172039

申请日：2012-08-02

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： SATO KOJI ,  SHINOZAKI HIROKI ,  ARAI MASATAKA

IPC: C08J5/24 ,  B32B15/08 ,  H01L23/14 ,  H05K1/03

CPC classification number: C08J5/24 ,  B32B5/024 ,  B32B15/14 ,  B32B2260/021 ,  B32B2307/51 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/14 ,  C08J2363/00 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a prepreg giving a laminate for a thin type printed wiring board, excellent in solder heat resistance, and suppressing warpage occurring at heating such as reflow soldering.SOLUTION: This prepreg (100) is obtained by impregnating an organic fibrous base material (101) having ≤0 ppm/°C of a linear expansion coefficient in a range of 50°C to 150°C with a resin composition including a thermosetting resin. When the organic fibrous base material (101) is sequentially subjected to, by using a thermogravimetry device: a preliminary drying step (A) of measuring the weight loss rate A by holding the organic fibrous base material (101) at 110°C for 1 hour; and a measuring step (B) of measuring the weight loss rate B by heating the organic fibrous base material (101) at 10°C per 10 minutes from 25°C to 300°C, the value calculated by B-A is ≤0.30%.

Abstract translation: 要解决的问题：提供一种赋予薄型印刷线路板的层叠体的预浸料，其焊接耐热性优异，并且抑制在诸如回流焊接的加热时发生的翘曲。 ＆lt; P＆gt;解决方案：通过将具有≤0ppm/℃的线性膨胀系数的有机纤维基材（101）浸渍在50℃至150℃的范围内，由树脂组合物 热固性树脂。 通过使用热重分析装置依次进行有机纤维基材（101）的通过将有机纤维基材（101）保持在110℃下来测定重量损失率A的预干燥工序（A）1 小时; 以及通过将有机纤维基材（101）在10℃/ 10分钟内从25℃加热至300℃来测量重量损失率B的测量步骤（B），由B-A计算的值为≤0.30％。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2007087982A

公开(公告)日：2007-04-05

申请号：JP2005271268

申请日：2005-09-20

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： ARAI MASATAKA ,  HOZUMI TAKESHI

IPC: H05K3/46 ,  C08G59/62 ,  C08K3/00 ,  C08L63/00 ,  C08L79/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide resin composite with which a multilayer printed wiring board in which peeling and a crack do not occur in a thermal shock test such as a cold and heat cycle, and which has high thermal resistance, low thermal expansion property and fire retardancy can be manufactured when resin composite is used for an insulating layer of the multilayer printed wiring board; and to provide an insulation sheet with substrate using resin composite and the multilayer printed wiring board.
SOLUTION: Resin composite used for forming the insulating layer of the multilayer printed wiring board comprises (A) cyanate resin and/or its prepolymer, (B) epoxy resin, (C) phenoxy resin, (D) imidazole compound, and (E) inorganic fill. (D) imidazole compound has compatibility with (A) to (C) compounds.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供在热和热循环等热冲击试验中不发生剥离和裂纹的多层印刷线路板并具有高热阻，低热能的树脂复合体 当树脂复合材料用于多层印刷线路板的绝缘层时，可以制造膨胀性能和阻燃性; 并且使用树脂复合材料和多层印刷线路板来提供具有基板的绝缘片。 解决方案：用于形成多层印刷线路板绝缘层的树脂复合材料包括（A）氰酸酯树脂和/或其预聚物，（B）环氧树脂，（C）苯氧基树脂，（D）咪唑化合物和 （E）无机填料。 （D）咪唑化合物与（A） - （C）化合物具有相容性。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005281513A

公开(公告)日：2005-10-13

申请号：JP2004097823

申请日：2004-03-30

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： ENDO TADASUKE ,  HOZUMI TAKESHI ,  BABA TAKAYUKI ,  ARAI MASATAKA

IPC: C08J5/24 ,  B29C43/02 ,  B29K101/10 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/00 ,  C08L79/04 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a resin composition capable of producing a laminate sheet superior in hardenability, low thermal expansion coefficient, low dielectric constant and heat resistance, a prepreg using the same and a laminate sheet.
SOLUTION: This resin composition is used for use in formation of the prepreg in a sheet form by impregnation of the resin composition into a substrate. The resin composition comprises a cyanate resin and/or its prepolymer, an epoxy resin containing substantially no halogen atom, an imidazole compound of 15% or less weight loss by sublimation or decomposition at 200°C and an inorganic filler. The prepreg produced by impregnation of the resin composition into the substrate and the laminate sheet produced by molding the prepreg are provided.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够制造淬透性，低热膨胀系数，低介电常数和耐热性优异的层合片的树脂组合物，使用该层压片的预浸料和层压片。 解决方案：该树脂组合物用于通过将树脂组合物浸渍到基材中而以片状形成预浸料。 树脂组合物包含氰酸酯树脂和/或其预聚物，基本上不含卤素原子的环氧树脂，在200℃升华或分解的重量损失为15重量％的咪唑化合物和无机填料。 提供通过将树脂组合物浸渍到基材中制备的预浸料和通过模塑预浸料制备的层压片。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005209489A

公开(公告)日：2005-08-04

申请号：JP2004015106

申请日：2004-01-23

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： YOSHIDA TATSUHIRO ,  ARAI MASATAKA ,  HOZUMI TAKESHI

IPC: B32B27/38 ,  B32B27/40 ,  C08G59/40 ,  C08G73/06 ,  H01B17/56 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide an insulation sheet superior in high heat resistance, low thermal expansion property, a dielectric property, a laser workability and flame retardant property.
SOLUTION: This insulation sheet is used for forming an insulating layer in a printed circuit board, and obtained by flowing, extending and applying varnish containing a resin composite containing a cyanate resin and/or its pre-polymer, an epoxy resin substantially not containing a halogen atom, imidazol compound, an inorganic filler, and a solvent on one face or both faces of an insulating base material, by removing the solvent by heat-drying, and by forming into a film.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供高耐热性，低热膨胀性，介电性，激光加工性和阻燃性优异的绝缘片。 解决方案：该绝缘片用于在印刷电路板中形成绝缘层，并且通过流动，延伸和施加含有含有氰酸酯树脂和/或其预聚物的树脂复合材料的清漆，基本上包含环氧树脂 在绝缘基材的一面或两面上不含卤素原子，咪唑化合物，无机填料和溶剂，通过加热干燥除去溶剂，并形成膜。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005150150A

公开(公告)日：2005-06-09

申请号：JP2003381253

申请日：2003-11-11

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： YOSHIDA TATSUHIRO ,  ARAI MASATAKA ,  HOZUMI TAKESHI

IPC: B32B7/02 ,  H05K1/03 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an insulating sheet having excellent high heat resistance, low thermal expansivity, dielectric characteristics, workability and flame resistance. SOLUTION: The insulating sheet has a first layer composed of a resin composition containing a thermosetting resin and inorganic fillers, and a second layer composed of an insulating base material. In the insulating sheet, the thermosetting resin comprises a cyanate resin and/or its prepolymer. In the insulating sheet, a novolac type cyanate resin is used as the cyanate resin. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有优异的高耐热性，低热膨胀性，介电特性，可加工性和阻燃性的绝缘片。 解决方案：绝缘片具有由含有热固性树脂和无机填料的树脂组合物构成的第一层和由绝缘基材构成的第二层。 在绝缘片中，热固性树脂包含氰酸酯树脂和/或其预聚物。 在绝缘片中，使用酚醛清漆型氰酸酯树脂作为氰酸酯树脂。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004277671A

公开(公告)日：2004-10-07

申请号：JP2003074870

申请日：2003-03-19

Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

Inventor： YOSHIDA TATSUHIRO ,  HOZUMI TAKESHI ,  ARAI MASATAKA ,  BABA TAKAYUKI

IPC: C08J5/24 ,  B32B15/08 ,  C08K3/00 ,  C08L61/06 ,  C08L63/00 ,  C08L79/00 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a prepreg excellent in dielectric property, laser-processing property and flame retardant property, and a printed circuit board.
SOLUTION: The prepreg is obtained by impregnating a resin composition containing a cyanate resin and/or its prepolymer and an inorganic filler with a nonwoven fabric constituted by an organic fiber, and exhibits ≤50 ppm/°C thermal expansion coefficient in surface direction at or lower than a glass transition point of a cured material obtained by curing the prepreg. Also, the printed circuit board is obtained by laminating a metal foil on the prepreg and heating/compressing for forming.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2003096296A

公开(公告)日：2003-04-03

申请号：JP2001295503

申请日：2001-09-27

Applicant: SUMITOMO BAKELITE CO

Inventor： OKANUMA MASAKO ,  YABUKI KENTARO ,  ARAI MASATAKA ,  BABA TAKAYUKI ,  HOZUMI TAKESHI

IPC: C08J5/24 ,  B32B15/08 ,  C08K3/00 ,  C08L61/04 ,  C08L79/00 ,  H05K1/03 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a resin composition, a prepreg and a printed circuit board having excellent heat resistance, low thermal expansion and a high level of flame-retardancy. SOLUTION: The resin composition comprises a cyanate resin and/or its prepolymer, a phenol resin and an inorganic filler. Additionally, the prepreg is prepared by impregnating a base material in the above resin composition. The printed circuit board of is prepared by laminating a metal foil on the above prepreg and molding the product under heating and pressure.

公开(公告)号：JP2000277925A

公开(公告)日：2000-10-06

申请号：JP8348699

申请日：1999-03-26

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  KOMIYATANI TOSHIROU ,  KAWAGUCHI HITOSHI ,  ARAI MASATAKA

IPC: H05K3/46 ,  C09J7/02 ,  C09J9/00 ,  C09J161/08 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To improve a fire resistance, etc., of an inter-layer insulating adhesive for multilayer interconnection board by comprising a sulfur containing amorphous thermo-plastic resin, weight-average molecular weight in specified range of sulfur containing epoxy resin, multifunctional epoxy resin of epoxy equivalent to a specific value or less, epoxy settling agent, and phosphorus containing compound agent. SOLUTION: An interlayer insulating adhesive for multilayer interconnection board comprises, as essential component, a phosphorus containing amorphous thermo-plastic resin containing polysulfone and polyethersulfone of weight- average molecular weight 103-105, phosphorus containing epoxy resin such as bisphenol type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene epoxy resin of weight-average molecular weight 103-105, as well as multifunctional epoxy resin of epoxy equivalent 500 or less, epoxy curing agent, and phosphorus containing compound agent which does not contain halogen. Thus, fire-resistance and heat characteristics are improve.

公开(公告)号：JP2000273429A

公开(公告)日：2000-10-03

申请号：JP8348599

申请日：1999-03-26

Applicant: SUMITOMO BAKELITE CO

Inventor： KAMISAKA MASAO ,  KOMIYATANI TOSHIROU ,  KAWAGUCHI HITOSHI ,  ARAI MASATAKA

IPC: H05K3/46 ,  C09J7/02 ,  C09J9/00 ,  C09J161/08 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To obtain a multi-layer flexible printed circuit board having excellent flame retardance and heat resistance, preservation stability and slight variation of insulating resin thickness between circuit layers in spite of possession of glass cloth-free insulating layer. SOLUTION: This interlayer insulating resin for a multi-layer printed circuit board comprises (1) a sulfur component-containing amorphous thermoplastic resin having 103 to 105 weight-average molecular weight, (2) a sulfur-containing epoxy resin or phenoxy resin having 103 to 105 weight-average molecular weight, (3) a polyfunctional epoxy resin having

公开(公告)号：JPH11186725A

公开(公告)日：1999-07-09

申请号：JP35781697

申请日：1997-12-25

Applicant: SUMITOMO BAKELITE CO

Inventor： HOZUMI TAKESHI ,  BABA TAKAYUKI ,  KAMISAKA MASAO ,  ARAI MASATAKA

IPC: C08G59/42 ,  C09J4/06 ,  C09J5/02 ,  C09J163/02 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin type multilayed printed wiring board which has little thickness variations and smooth surface and is suited to highdensity packaging. SOLUTION: The manufacturing method comprises the steps of applying a photo-setting/thermosetting type under-coating 3 to a flame-retardant inner layer circuit board 1 composed of a flame-retardant epoxy resin-impregnated glass cloth board, irradiating an active energy to make tack-free, laminating a Cu foil having a layer insulation adhesive layer, and heating so that the melting viscosity of this adhesive layer does not fall below 10,000 poises, and the under-coating 3 starts the curing reaction with the melting viscosity ranging between 1,000 poises and 10,000 poises prior to the start of the curing reaction of the adhesive layer, thereby finally curing both together.