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    Adhesive composition
    81.
    发明专利
    Adhesive composition 有权
    粘合剂组合物

    公开(公告)号：JP2008133404A

    公开(公告)日：2008-06-12

    申请号：JP2006322227

    申请日：2006-11-29

    Applicant: Yokohama Rubber Co Ltd:The ,  横浜ゴム株式会社

    Inventor： MIYATA AKIHIRO ,  YAMAMOTO MASAKI ,  MURATA SHIN ,  SHIRAI YASUSHI ,  HASHIKATA HISASHI

    IPC: C09J201/10 ,  C09D201/10 ,  C09J11/00

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition that affords a composite material exhibiting excellent adhesive properties (adherence) to an adherend and also excellent heat insulating properties, an application method of the adhesive composition, and a composite material.
    SOLUTION: The adhesive composition comprises a base material component comprising a crosslinkable silyl group-containing organic polymer (A) and a curing agent component comprising tackifier (B), wherein the base material component and/or the curing agent component contains unexpanded thermally expandable microcapsules (C).
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种粘合剂组合物，其提供对被粘物具有优异的粘合性（粘附性）和优异的隔热性的复合材料，粘合剂组合物的施加方法和复合材料。 粘合剂组合物包含含有可交联甲硅烷基的有机聚合物（A）和包含增粘剂（B）的固化剂组分的基材组分，其中所述基材组分和/或固化剂组分含有未膨胀 热膨胀性微胶囊（C）。 版权所有（C）2008，JPO＆INPIT

    Honeymoon adhesive consisting of two different components, adhesion system using the adhesive, product and use thereof
    86.
    发明专利
    Honeymoon adhesive consisting of two different components, adhesion system using the adhesive, product and use thereof 审中-公开
    蜂蜜胶粘剂包含两种不同组分，使用粘合剂，产品和使用的粘合剂体系

    公开(公告)号：JP2008007777A

    公开(公告)日：2008-01-17

    申请号：JP2007160550

    申请日：2007-06-18

    Applicant: Kaneka Corp ,  株式会社カネカ

    Inventor： PHANOPOULOS CHRIS

    IPC: C09J5/00 ,  C09J5/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J183/00 ,  C09J201/10

    CPC classification number: C09J5/04 ,  C08L101/10

    Abstract: PROBLEM TO BE SOLVED: To provide a two-liquid type honeymoon adhesive whose components disperse through each other at the rate faster than reacting to each other after the adhesive is coated on a surface.
    SOLUTION: The honeymoon adhesive contains the first agent and the second agent which are separately present. The honeymoon adhesive comprises at least three components selected from a polymer containing a reactive silyl group, a catalyst and water. The first agent comprises at most two kinds of above components. The second agent comprises at least the third component. Also, either of the first and the second component does not comprise all of three components.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种双液型蜜月粘合剂，其在将粘合剂涂覆在表面上之后以比彼此反应更快的速率彼此分散。

    解决方案：蜜月粘合剂含有单独存在的第一种试剂和第二种试剂。 蜜月粘合剂包含至少三种选自含有反应性甲硅烷基的聚合物，催化剂和水的组分。 第一代理包括至多两种以上组件。 第二剂包含至少第三组分。 而且，第一和第二组件中的任何一个不包括三个组件的全部。 版权所有（C）2008，JPO＆INPIT

    Flame retardant humidity curing type composition
    88.
    发明专利
    Flame retardant humidity curing type composition 有权
    阻燃剂湿度固化型组合物

    公开(公告)号：JP2007084633A

    公开(公告)日：2007-04-05

    申请号：JP2005273118

    申请日：2005-09-21

    Applicant: Cemedine Co Ltd ,  セメダイン株式会社

    Inventor： ITO MASAKI ,  KUROSAWA SHIGERU ,  SAITO ATSUSHI ,  HORIE YASUNOBU

    IPC: C08L101/10 ,  C08K3/22 ,  C08K3/36 ,  C08K9/04 ,  C09C1/40 ,  C09C3/08 ,  C09C3/12 ,  C09J123/26 ,  C09J133/00 ,  C09J183/12 ,  C09J201/10

    Abstract: PROBLEM TO BE SOLVED: To provide a flame retardant humidity curing type composition having excellent performance as an adhesive or fixing agent for electric products or precision instruments which require flame retardant property, and to provide a flame retardant humidity curing adhesive composition comprising the composition as an active ingredient and to provide an adhering method using the same. SOLUTION: The flame retardant humidity curing type composition comprises 100 pts. by mass (abbreviated as pts. in the following) of (A) an organic polymer containing a reactive silicone group, (B) 150-350 pts. of a metal hydroxide having 0.1-200 μm of average particle diameter, (C) 0.1-15 pts. of hydrophilic silica, and (D) 1-50 pts. of surface treated calcium carbonate having 0.01-10 μm of average particle diameter as essential components. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种具有优异性能的阻燃湿固化型组合物，其作为需要阻燃性能的电子产品或精密仪器的粘合剂或固定剂，并提供阻燃剂湿固化粘合剂组合物，其包含 组合物作为活性成分，并提供使用其的粘附方法。

    解决方案：阻燃剂湿固化型组合物包含100个点。 （A）含有反应性硅氧烷基团的有机聚合物（B）为150-350重量份（以下简称为以下）。 的平均粒径为0.1〜200μm的金属氢氧化物，（C）为0.1〜15。 的亲水性二氧化硅，（D）1-50份。 的平均粒径为0.01-10μm的表面处理碳酸钙作为必要成分。 版权所有（C）2007，JPO＆INPIT

    Room temperature curing composition
    89.
    发明专利
    Room temperature curing composition 有权
    室温固化组合物

    公开(公告)号：JP2006257405A

    公开(公告)日：2006-09-28

    申请号：JP2006035299

    申请日：2006-02-13

    Applicant: Asahi Glass Co Ltd ,  旭硝子株式会社

    Inventor： FUTAMI TATSUHIRO ,  SUNAYAMA YOSHITAKA ,  SHIOYA GENICHIROU

    IPC: C08L71/02 ,  C08K5/00 ,  C08L33/14 ,  C08L101/10 ,  C09J11/06 ,  C09J133/04 ,  C09J143/04 ,  C09J171/02 ,  C09J201/10

    Abstract: PROBLEM TO BE SOLVED: To provide a room temperature curing composition which cures in the presence of moisture by way of a pressure-sensitive adhesive matter. SOLUTION: The room temperature curing composition, containing (A) a reactive silicon group-containing oxyalkylene polymer, (B) a reactive silicon group-containing vinyl polymer, (C) an organotin compound and (D) an amino group-containing silane coupling agent, is characterized in that a content (% by mass) of the tin atom in the above composition relative to a methyl ethyl ketone-soluble component is of not less than the value of cSn 1 which is determined at the time of a coefficient k of 0.60 in formula (1): cSn 1 =k×(1-Y/S), wherein Y is a mass of the component insoluble in methyl ethyl ketone and S is a mass of the whole composition. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 待解决的问题：提供通过压敏粘合剂物质在湿气存在下固化的室温固化组合物。 （A）含反应性硅基的氧化烯聚合物，（B）含有反应性硅基的乙烯基聚合物，（C）有机锡化合物和（D）氨基 - 其特征在于，上述组合物中的锡原子相对于甲基乙基酮可溶成分的含量（质量％）为cSn <1> 其在式（1）中的系数k为0.60时确定：cSn 1 = k×（1-Y / S）其中Y是不溶于甲基乙基的组分的质量 酮和S是整个组合物的质量。 版权所有（C）2006，JPO＆NCIPI

    Resin composition and semiconductor device made using the same
    90.
    发明专利
    Resin composition and semiconductor device made using the same 审中-公开
    树脂组合物和使用该树脂组合物的半导体器件

    公开(公告)号：JP2006137841A

    公开(公告)日：2006-06-01

    申请号：JP2004328278

    申请日：2004-11-11

    Applicant: Sumitomo Bakelite Co Ltd ,  住友ベークライト株式会社

    Inventor： TANAKA NOBUKI ,  OKUBO HIKARI

    IPC: C09J175/04 ,  C09J9/02 ,  C09J11/00 ,  C09J133/24 ,  C09J201/10 ,  H01B1/22 ,  H01L21/52

    CPC classification number: H01L24/29 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a resin composition having sufficiently low stress, high in reflow resistance and exhibiting high adhesion, and to provide a highly reliable semiconductor device through using the resin composition as a die attach or heat sink attach material for semiconductors.
    SOLUTION: The resin composition comprises (A) a reaction product obtained by reaction between a (meth)acrylamide compound having in the molecule an alcoholic hydroxy group, a compound whose both ends are alcoholic hydroxy groups, and a diisocyanate, (B) silver powder and (C) a compound of the general formula(1) (wherein, R
    1 and R
    3 are each an alkoxy; R
    2 and R
    4 are each an alkyl; (a) and b are each an integer of 1-3; m1 and m2 are each an integer of 1-5; and m3 is an integer of 2-4 ).
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供具有足够低的应力，高耐回流性和高粘附性的树脂组合物，并且通过使用该树脂组合物作为芯片附着或散热器附着材料来提供高度可靠的半导体装置 半导体。 解决方案：树脂组合物包含（A）通过在分子中具有醇羟基的（甲基）丙烯酰胺化合物，其两端为醇羟基的化合物和二异氰酸酯（B ）银粉和（C）通式（1）的化合物（其中R 1和R 3各自为烷氧基; R 2为2） SP＆gt;和R＆lt; SP＆gt; 4＆lt; SP＆gt;各自为烷基;（a）和b各自为1-3的整数，m1和m2各自为1-5的整数; m3为2的整数 -4）。 版权所有（C）2006，JPO＆NCIPI

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