Abstract:
The etching liquid is automatically controlled in the specified nitrate acid consistency, acetic acid consistency and phosphoric acid consistency, and the liquid supply of the etching liquid processing tank is given proper management, the using liquid amount is reduced and the lie time is greatly shortened at the same time of certain ordinary etching performance, thereby making possible to reducethe integrate production cost. The invention provides an etching liquid which is provided with an etching liquid processing tank with nitrate acid, to make the etching liquid storing in the etching liquid processing tank carry on circular etching liquid circular mechanism and transmit the etching liquid management device in the etching processing device of etching processing mechanism of substrate with aluminum film by using the etching liquid circular mechanism. The invention is characterized in that the device comprises an etching liquid sampling mechanism to have sampling of the etching liquid, a dilution mechanism of etching liquid diluting with purified water and adopting etching liquid sampling mechanism, a conductivity meter which obtains the electrical conductivity value related to the nitrate acid consistency of etching liquid through testing and adopting the electrical conductivity of the etching liquid diluted by the dilution mechanism, and a replenishing solution supply mechanism which supplies replenishing solution to the etching liquid processing tank based on the electrical conductivity value with the conductivity meter.
Abstract:
PROBLEM TO BE SOLVED: To provide a resist peeling apparatus capable of preventing a variance in concentration of an effective component contained in a resist peeling solution, reducing the amount of the solution used and reducing the amount of waste gas to be treated. SOLUTION: The resist peeling apparatus 100 has a rinsing system 2 with a rinsing chamber 21, which is provided on a resist peeling system 1 with a plurality of resist stripping chambers 11 arranged in succession. The resist peeling chambers 11 are purged with gaseous nitrogen from a gaseous nitrogen supply system 7. A gaseous mixture containing a component of an aqueous resist peeling solution R1 generated in the chambers 11 is sent to a liquid recovery-supply system 3 and subjected to gas-liquid separation. A recovered resist peeling solution R2 is returned to a peeling solution tank 13 and a separated gas G is used for dewatering a substrate W supplied to each gas knife 12 in the chambers 11. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To always fix the resist release performance by automatically controlling a resist release solution so that the moisture concentration and the degraded component concentration become prescribed values and properly managing solution replenishment of a resist release processing tank, and to reduce the overall manufacturing cost by reducing the use quantity of the resist release solution and shortening the operation halt time. SOLUTION: The aqueous resist release solution management apparatus which manages the aqueous resist release solution used for a resist releasing apparatus in an adjustment tank (1) is provided with a degraded component concentration measuring means (16) which measures the concentration of degraded components derived from the aqueous resist release solution in the adjustment tank (1), solution supply means (24, 25, 26, and 27) which supply at least one of undiluted aqueous resist release solution, a recycled aqueous release solution, pure water and a preliminarily prepared fresh aqueous resist release solution to the adjustment tank, and a solution supply quantity control means (31) which controls the quantity of the solution to be supplied to the adjustment tank on the basis of the measured concentration of degraded components.