公开(公告)号：JP4431606B2

公开(公告)日：2010-03-17

申请号：JP2007262665

申请日：2007-10-05

申请人： シャープ株式会社

发明人： 雄也 大西

IPC分类号： H01L21/60

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/30107 ,  H05K2201/0367 ,  Y02P70/613

摘要： In order to realize a semiconductor device which is easily mounted on a circuit board and which has high mounting reliability, a semiconductor device 1 of the present invention includes: a semiconductor substrate 2; and an Au bump 3 provided on an electrode 21. The Au bump 3 is provided with a projection 3a. Also, on a surface of the Au bump 3, a solder layer 32 is formed via a Ni layer 31. The projection 3a makes it possible to easily mount the semiconductor device 1 by applying a small weight. Further, even if the amount of solder 62 supplied on an electrode 61 on a circuit board 6 is reduced, it is possible to bond the semiconductor device with a sufficient amount of solder during mounting. Furthermore, because a Ni layer 31 prevents dissolution of the bump, it is possible to ensure high mounting reliability.

公开(公告)号：JP5535448B2

公开(公告)日：2014-07-02

申请号：JP2008130846

申请日：2008-05-19

申请人： シャープ株式会社

发明人： 雄也 大西

IPC分类号： H01L21/60

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099