-
公开(公告)号：JPWO2013133015A1
公开(公告)日：2015-07-30
申请号：JP2013510817
申请日：2013-02-20
申请人： 東レ株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/83 , B32B37/0046 , B32B38/004 , B32B2307/202 , B32B2311/00 , B32B2457/14 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/14181 , H01L2224/16146 , H01L2224/16238 , H01L2224/27003 , H01L2224/2732 , H01L2224/27334 , H01L2224/27416 , H01L2224/27436 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75253 , H01L2224/753 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/81005 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00013 , H01L2924/00014 , H01L2924/10253 , H01L2924/1301 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2224/16225 , H01L2924/00012 , H01L2224/27 , H01L2924/01047 , H01L2224/16145 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2924/014 , H01L2224/05552
摘要： バンプを有する半導体チップを、該バンプに対応した電極を有する基板に、熱硬化性接着剤層を介してはんだ接続する半導体装置の製造方法であって:(A)半導体チップのバンプを有する面に、あらかじめ熱硬化性接着剤層を形成する工程、(B)熱硬化性接着剤層が形成された半導体チップの熱硬化性接着剤層側の面と基板とを合わせて、ヒートツールを用いて仮圧着し、仮圧着積層体を得る工程、(C)該ヒートツールと該仮圧着積層体の半導体チップ側の面との間に、熱伝導率100W/mK以上の保護フィルムを介在させ、ヒートツールを用いて、半導体チップと基板との間のはんだを溶融させると同時に熱硬化性接着剤層を硬化させる工程、をこの順に有する半導体装置の製造方法。樹脂がはんだバンプと電極パッドとの間に挟まることなく、良好な接続が得られる半導体装置の製造方法を提供する。
摘要翻译： 具有凸块的半导体芯片，具有对应于所述凸块，通过热固化性粘接层的制造半导体器件的方法的电极的基片，其中焊接连接：（A）具有半导体芯片的凸点的表面 成型出初步热固性粘合剂层，通过在表面和热固性半导体芯片热固性粘合层的粘合剂层侧的基板（B）组合形成，通过使用加热工具 临时粘结以获得临时压接层压板隔着（C）的临时接合层压板，100W / mK以上的保护膜的热导率的半导体芯片侧表面之间的热工具，热 使用工具，制造具有固化热固性粘接剂层，并在同一时间的步骤，以熔化半导体芯片与基板之间的焊接，在该顺序的半导体器件的方法。 无夹在凸点和电极焊盘的焊料树脂之间，提供一种制造半导体器件的方法是获得良好的连接。
-
公开(公告)号：JP5689336B2
公开(公告)日：2015-03-25
申请号：JP2011046864
申请日：2011-03-03
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , C09J11/02 , C09J11/08 , C09J201/00
CPC分类号： C09J7/0225 , B32B7/12 , B32B27/20 , B32B27/308 , B32B2457/00 , C08K3/013 , C08K5/0041 , C08K9/10 , C09J5/06 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2203/326 , C09J2205/102 , C09J2205/106 , C09J2205/11 , C09J2205/302 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2924/00013 , Y10T428/28 , Y10T428/2848 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
-
公开(公告)号：JP5686672B2
公开(公告)日：2015-03-18
申请号：JP2011126262
申请日：2011-06-06
申请人： 旭徳科技股▲ふん▼有限公司
CPC分类号： H01L33/644 , H01L23/13 , H01L23/142 , H01L23/3121 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32013 , H01L2224/48091 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
-
公开(公告)号：JP5657045B2
公开(公告)日：2015-01-21
申请号：JP2013035301
申请日：2013-02-26
申请人： スス マイクロテク エージー , スス マイクロテク エージー
发明人： ジョンソン，ヘイル , ゴームリー，ジェラード , ヒューレット，エメット , ラポインテ，ウィルヘルム
IPC分类号： H01L21/60
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014
-
公开(公告)号：JP5619236B2
公开(公告)日：2014-11-05
申请号：JP2013162189
申请日：2013-08-05
发明人： フランソワ・マリオン , ダミアン・サン−パトリス
IPC分类号： H01L21/60
CPC分类号： H01L24/12 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13099 , H01L2224/16237 , H01L2224/81191 , H01L2224/81208 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01046 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H05K3/3436 , H05K2201/09472 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49165 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599 , H01L2224/05099
-
公开(公告)号：JP5618603B2
公开(公告)日：2014-11-05
申请号：JP2010095104
申请日：2010-04-16
申请人： インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： G06F17/5068 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01019 , H01L2924/01087 , H01L2224/05599 , H01L2224/05099
-
7.发明专利
公开(公告)号：JP5559466B2
公开(公告)日：2014-07-23
申请号：JP2008190314
申请日：2008-07-23
IPC分类号： H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/522 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/5286 , H01L23/3121 , H01L23/481 , H01L23/522 , H01L23/528 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/451 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/49111 , H01L2224/4912 , H01L2224/49171 , H01L2224/731 , H01L2224/81801 , H01L2224/83 , H01L2224/85 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01032 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/05099 , H01L2924/00012
摘要： A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. The first chip includes a plurality of metal lines which may be deposited at its top surface, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package.
-
公开(公告)号：JP5549190B2
公开(公告)日：2014-07-16
申请号：JP2009263108
申请日：2009-11-18
申请人： 豊田合成株式会社
CPC分类号： H01L33/62 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/1131 , H01L2224/1132 , H01L2224/11505 , H01L2224/13005 , H01L2224/13013 , H01L2224/13014 , H01L2224/13017 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/13169 , H01L2224/1329 , H01L2224/13294 , H01L2224/13339 , H01L2224/13344 , H01L2224/13364 , H01L2224/13369 , H01L2224/14154 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/27505 , H01L2224/29013 , H01L2224/29139 , H01L2224/29144 , H01L2224/29164 , H01L2224/29169 , H01L2224/2929 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/29369 , H01L2224/30154 , H01L2224/3201 , H01L2224/32057 , H01L2224/73103 , H01L2224/73203 , H01L2224/81191 , H01L2224/81203 , H01L2224/83 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2933/0066 , H01L2924/2075 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/0401
摘要： A manufacturing method of a mounting part of a semiconductor light emitting element comprising: preparing a semiconductor light emitting element including an electrode which has a surface, and a board which has a surface; forming a plurality of bump material bodies on at least one of the surface of the electrode and the surface of the board by shaping bump material into islands, wherein the bump material is paste in which metal particles are dispersed, a top surface and a bottom surface of the bump material bodies have different areas, and the top surface is practically flat; solidifying the bump material bodies by thermally processing the bump material bodies; and fixing the semiconductor light emitting element and the board through the bumps.
-
公开(公告)号：JP5535448B2
公开(公告)日：2014-07-02
申请号：JP2008130846
申请日：2008-05-19
申请人： シャープ株式会社
发明人： 雄也 大西
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/13076 , H01L2224/1308 , H01L2224/13099 , H01L2224/16 , H01L2224/16503 , H01L2224/16507 , H01L2224/81191 , H01L2224/81203 , H01L2224/814 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15787 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
-
-
-
-
-
-
-
-
搜索结果
540 条记录 (耗时 0.029 秒)
