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    2- (2,4-dichloro-benzyl) -4-aryl-5-methyl imidazole compound
    5.
    发明专利
    2- (2,4-dichloro-benzyl) -4-aryl-5-methyl imidazole compound 有权

    公开(公告)号：JP5368244B2

    公开(公告)日：2013-12-18

    申请号：JP2009236772

    申请日：2009-10-14

    Applicant: 四国化成工業株式会社

    Inventor： 孝行 村井 ,  真幸 宮崎 ,  浩彦 平尾

    IPC: C07D233/64

    Abstract: PROBLEM TO BE SOLVED: To provide a 2-(2,4-dichlorobenzyl)-4-aryl-5-methylimidazole compound useful as an antioxidant agent of copper surface, a curing agent of an epoxy resin, or an intermediate for a medicine or an agrochemical. SOLUTION: The 2-(2,4-dichlorobenzyl)-4-aryl-5-methylimidazole compound can be synthesized by heating and reacting a 2-halogenated propiophenone compound with a (2,4-dichlorophenyl)acetamidine compound in the presence of a dehydrohalogenation agent in a reaction solvent. COPYRIGHT: (C)2011,JPO&INPIT

    Surface treatment agent and its use of copper or copper alloy
    6.
    发明专利
    Surface treatment agent and its use of copper or copper alloy 有权

    公开(公告)号：JP5321878B2

    公开(公告)日：2013-10-23

    申请号：JP2008223663

    申请日：2008-09-01

    Applicant: 四国化成工業株式会社

    Inventor： 浩彦 平尾 ,  範明 山地 ,  孝行 村井

    IPC: C23F11/00 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42 ,  H05K3/28 ,  H05K3/34

    CPC classification number: C23F11/149 ,  B23K35/3615 ,  C07D233/58 ,  C23C22/52 ,  H05K3/282 ,  H05K2203/124

    Abstract: An object is to provide a surface treating agent, which in mounting electronic parts or the like to a printed wiring board using a lead-free solder, forms a chemical layer having excellent heat resistance on the surface of copper or a copper alloy constituting a circuit part of a printed wiring board or the like and at the same time, improves the wettability to the solder and makes the solderability good, and a surface treatment method. Also, another object is to provide a printed wiring board resulting from bringing the surface of copper or a copper alloy constituting a copper circuit part into contact with the foregoing surface treating agent and to provide a soldering method by bringing the surface of copper or a copper alloy into contact with the foregoing surface treating agent and then performing soldering using a lead-free solder. A surface treating agent for copper or a copper alloy, which contains an imidazole compound represented by the formula (I): wherein R1, R2 and R3 are the same or different and represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms; and at least one selected from R1, R2 and R3 is an alkyl group having 4 or more carbon atoms.

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