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公开(公告)号：JP2017080797A
公开(公告)日：2017-05-18
申请号：JP2015214871
申请日：2015-10-30
Applicant: パナソニックIpマネジメント株式会社 , Panasonic Ip Management Corp
Inventor： OHASHI NAOMICHI , YOSHIOKA YUKI , SUZUKI YASUHIRO , HINO HIROHISA , MORI MASAHITO , NISHIKAWA KAZUHIRO
IPC: B23K35/363 , H05K3/34
CPC classification number: B23K35/362 , B23K1/0016 , B23K35/025 , B23K35/264 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , H01L21/563 , H01L23/3142 , H01L24/17 , H01L24/81 , H01L2224/16227 , H01L2224/81411 , H01L2224/81413 , H01L2224/81815 , H01L2924/0665 , H01L2924/20102 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3489 , H05K3/3494 , H05K2201/10734 , H05K2203/048 , Y02P70/613
Abstract: 【課題】はんだ付け時のセルフアライメント性を向上したはんだペーストを提供する。【解決手段】はんだペーストは、はんだ粉末と、25℃で固形の第1のエポキシ樹脂と25℃で液状の第2のエポキシ樹脂とを含む複合エポキシ樹脂と、硬化剤と、を備え、第1のエポキシ樹脂は、はんだ粉末の融点より10℃以上低い軟化点を有し、複合エポキシ樹脂全体の100重量部に対し、10重量部〜75重量部の範囲で含まれる。【選択図】図3
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公开(公告)号：JP2010150651A
公开(公告)日：2010-07-08
申请号：JP2009124003
申请日：2009-05-22
Applicant: Shikoku Chem Corp , 四国化成工業株式会社
Inventor： HIRAO HIROHIKO , YAMACHI NORIAKI , MURAI TAKAYUKI
CPC classification number: C23F11/149 , B23K35/262 , B23K35/3615 , B23K2203/12 , C07D233/64 , C23C22/52 , H05K3/282 , H05K2203/124
Abstract: PROBLEM TO BE SOLVED: To provide a surface treating agent and a method of treating a surface for forming a chemical conversion coated film excellent in heat resistance on a surface of copper or a copper alloy to form a circuit or the like of a printed wiring board, and enhancing a wetting characteristic with solder and improving a soldering property, when an electronic part or the like is joined and connected to the printed wiring board using the solder. SOLUTION: The surface treating agent for copper or a copper alloy contains a specific imidazole compound. Also, the method of treating the surface uses the same. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 待解决的问题：提供一种表面处理剂和一种处理用于形成铜或铜合金表面上具有优异耐热性的化学转化涂层的表面以形成电路等的方法 印刷电路板，并且当使用焊料将电子部件等接合并连接到印刷线路板时，通过焊料增强润湿特性并提高焊接性能。 解决方案：铜或铜合金的表面处理剂含有特定的咪唑化合物。 此外，处理表面的方法也使用相同的方法。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP3498427B2
公开(公告)日：2004-02-16
申请号：JP15142695
申请日：1995-06-19
Applicant: ソニー株式会社 , 千住金属工業株式会社
IPC: B23K35/363 , B23K35/36 , C08K5/3415 , C08L93/04
CPC classification number: C08L93/04 , B23K35/3613 , B23K35/3615 , C08K5/3415
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公开(公告)号：JP6334719B2
公开(公告)日：2018-05-30
申请号：JP2016549607
申请日：2013-12-30
Applicant: 広州漢源新材料股▲ふん▼有限公司
IPC: B23K35/363
CPC classification number: B23K35/362 , B23K35/0222 , B23K35/0233 , B23K35/0244 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , B23K35/365
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公开(公告)号：JP6012955B2
公开(公告)日：2016-10-25
申请号：JP2011260167
申请日：2011-11-29
Applicant: ローム アンド ハース エレクトロニック マテリアルズ エルエルシー , Rohm and Haas Electronic Materials LLC , ダウ グローバル テクノロジーズ エルエルシー
Inventor： デイビッド・ディー.フレミング , マイク・ケー.ギャラガー , キム・サン・ホー , シャン−チン・リュー , アスガル・アクベル・ピエーラ , グレン・ロビンソン , イーアン・トムリンソン , マーク・アール.ウィンクル
IPC: H01L21/60 , B23K1/00 , B23K3/00 , H05K3/34 , B23K101/42 , B23K35/363
CPC classification number: B23K35/3615 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2201/38 , B23K2201/42
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Patent Agency Ranking
公开(公告)号：JP5737295B2
公开(公告)日：2015-06-17
申请号：JP2012548841
申请日：2011-12-16
Applicant: 荒川化学工業株式会社
IPC: B23K35/363
CPC classification number: B23K35/025 , B23K35/26 , B23K35/262 , B23K35/3615 , B23K35/362 , C22C1/0483 , C22C13/00 , C22C9/00
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公开(公告)号：JP5321878B2
公开(公告)日：2013-10-23
申请号：JP2008223663
申请日：2008-09-01
Applicant: 四国化成工業株式会社
CPC classification number: C23F11/149 , B23K35/3615 , C07D233/58 , C23C22/52 , H05K3/282 , H05K2203/124
Abstract: An object is to provide a surface treating agent, which in mounting electronic parts or the like to a printed wiring board using a lead-free solder, forms a chemical layer having excellent heat resistance on the surface of copper or a copper alloy constituting a circuit part of a printed wiring board or the like and at the same time, improves the wettability to the solder and makes the solderability good, and a surface treatment method. Also, another object is to provide a printed wiring board resulting from bringing the surface of copper or a copper alloy constituting a copper circuit part into contact with the foregoing surface treating agent and to provide a soldering method by bringing the surface of copper or a copper alloy into contact with the foregoing surface treating agent and then performing soldering using a lead-free solder. A surface treating agent for copper or a copper alloy, which contains an imidazole compound represented by the formula (I): wherein R1, R2 and R3 are the same or different and represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms; and at least one selected from R1, R2 and R3 is an alkyl group having 4 or more carbon atoms.
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公开(公告)号：JP2012148337A
公开(公告)日：2012-08-09
申请号：JP2011260174
申请日：2011-11-29
Applicant: Angus Chemical Co , Dow Global Technologies Llc , Rohm & Haas Electronic Materials Llc , アンガス ケミカル カンパニー , ダウ グローバル テクノロジーズ エルエルシー , ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー.
Inventor： FLEMING DAVID D , GALLAGHER MIKE K , HO KIM SANG , LIU XIANG-QIAN , ASGHAR AKBER PEERA , GLENN ROBINSON , IAN TOMLINSON , MARK R WINKLE
IPC: B23K35/363 , B23K1/00 , B23K3/00 , B23K35/26 , B23K101/42 , C22C12/00 , C22C13/00 , H05K3/34
CPC classification number: B23K35/3615 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2201/38 , B23K2201/42 , C07C215/18 , C07C215/28 , C07C217/28
Abstract: PROBLEM TO BE SOLVED: To provide a flux composition that is non-curable, facilitates reliable soldering and is customizable so as to promote the compatibility with a conventional epoxy-based underfill material.SOLUTION: This amine flux composition contains an amine fluxing agent that is a non-curable composition and represented by (I). The amine flux composition is designed to facilitate the compatibility thereof with variable underfill compositions, accordingly a soldered surface preferably does not need cleaning before application of the underfill compositions for forming finishing electrical joining.
Abstract translation: 要解决的问题：为了提供不可固化的助焊剂组合物，促进可靠的焊接并且是可定制的，以便促进与传统的环氧基底层填充材料的相容性。 解决方案：该胺助剂组合物含有作为不可固化组合物并由（I）表示的胺助熔剂。 胺助剂组合物被设计成促进其与可变底部填充剂组合物的相容性，因此在施加用于形成精加工电接合的底部填充组合物之前，焊接表面优选不需要清洁。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2012135813A
公开(公告)日：2012-07-19
申请号：JP2011260164
申请日：2011-11-29
Inventor： FLEMING DAVID D , GALLAGHER MIKE K , HO KIM SANG , MARK R WINKLE , LIU XIANG-QIAN
IPC: B23K35/363 , B23K1/00 , B23K3/00 , B23K35/26 , B23K101/42 , C22C12/00 , C22C13/00 , H05K3/34
CPC classification number: B23K35/3615 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2201/42
Abstract: PROBLEM TO BE SOLVED: To provide a flux composition which is non-hardenability, facilitates soldering connection that can be trusted, and can be customized to facilitate compatibility with an underfill material of a conventional epoxy base.SOLUTION: The flux composition comprises, as an initial component: a fluxing agent represented by formula I: wherein R, R, Rand Rare each independently selected from hydrogen, a substituted 1-80C alkyl group, an unsubstituted 1-80C alkyl group, a substituted 7-80C arylalkyl group and an unsubstituted 7-80C arylalkyl group; and wherein zero to three of R, R, Rand Ris (are) hydrogen. Also disclosed is a method of soldering an electrical contact using the flux composition.
Abstract translation: 要解决的问题：为了提供不淬透性的助焊剂组合物，便于可信赖的焊接连接，并且可以定制以便于与常规环氧基材的底部填充材料的相容性。 解决方案：助熔剂组合物包含作为初始组分：由式I表示的助熔剂：其中R
1 ，R 2 < / SP>，R 3 和R 4 各自独立地选自氢，取代的1-80C烷基，未取代的 1-80C烷基，取代的7-80C芳烷基和未取代的7-80C芳烷基; 并且其中R 1 ，R 2 ，R 3 而R 4 是氢。 还公开了使用助焊剂组合物焊接电触点的方法。 版权所有（C）2012，JPO＆INPIT -
公开(公告)号：JP4103591B2
公开(公告)日：2008-06-18
申请号：JP2002545879
申请日：2001-11-29
Applicant: 千住金属工業株式会社 , 松下電器産業株式会社
CPC classification number: B23K35/3613 , B23K35/025 , B23K35/262 , B23K35/3603 , B23K35/3615 , B23K35/3618
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