Abstract:
Disclosed is a resin composition for an adhesive agent, which comprises: (a) a polyester resin containing a radical-polymerizable site; (b) a polymer of a radical-polymerizable monomer; (c) a modified polyester resin modified with a polymer of a radical-polymerizable monomer, in which the resin (a) and the polymer (b) are bound to each other; (d) a polyurethane resin having an acid value of 100 to 1000 equivalents/106 g inclusive; and (e) an epoxy compound having a dicyclopentadiene structure. In the resin composition, maleic anhydride makes up 10 to 60 mass% inclusive of the radical-polymerizable monomer, the resin (c) has a glass transition temperature (Tg(c)) of 0 to 80°C inclusive, the resin (d) has a glass transition temperature (Tg(d)) of -10 to 60°C inclusive, Tg(c) and Tg(d) meet the requirement represented by the formula: 50 = Tg(c)-Tg(d) = 5, and the acid value of the resin (c) (AV(c) equivalent/106 g) and the acid value of the resin (d) (AV(d) equivalent/106 g) meet the requirement represented by the formula: 8,000 = AV(c)-AV(d) = 200. Also disclosed are an adhesive agent, an adhesive sheet and a laminate for a print circuit board, each of which comprises the resin composition.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for an adhesive, which has adhesivity to various types of plastic films, adhesivity to metals such as copper, aluminum and stainless steel, and adhesivity to glass epoxides, and can maintain the adhesive force in high temperatures and high humidities, and can secure the sheet life of a B-stage adhesive sheet adaptable to the commercial distribution at ordinary temperature. SOLUTION: The resin composition for an adhesive comprises (a) a polyurethane resin containing a carboxyl group and having an acid value (unit: equivalent weight/10 6 g) of ≥100 and ≤1,000, a number-average molecular weight of ≥5.0×10 3 and ≤1.0×10 5 and a glass transition temperature of ≥-10°C and ≤70°C, (b) an epoxy resin containing a nitrogen atom, and (c) an epoxy resin having a dicyclopentadiene skeleton, wherein the formulation ratio of the resin (b) is ≥0.1 mass% and ≤20 mass% to the total of the epoxy resins contained in the resin composition. Also provided are an adhesive, an adhesive sheet, a laminate for a wiring board, and a printed wiring board, containing the composition. COPYRIGHT: (C)2010,JPO&INPIT