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1.发明专利
公开(公告)号：JP2009038241A
公开(公告)日：2009-02-19
申请号：JP2007201975
申请日：2007-08-02
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： HIGO ICHIEI , HIRANO SATOSHI , OKUYAMA MASAHIKO , SATO MANABU
CPC分类号： H01L2224/16237 , H01L2924/1461 , H01L2924/15311 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a component accommodating wiring board capable of preventing crack by mitigating a stress generated in a state that components are accommodated in the wiring board. SOLUTION: The wiring board 10 includes a core substrate 11, a ceramic capacitor 101 and a wiring lamination unit 31. A hold hole 90 for holding ceramic capacitor 101 is formed on the core substrate 11. The ceramic capacitor 101 has stress mitigating layers 151 formed on the main surface 102 of capacitor, on the rear surface 103 of capacitor and on the side surfaces 106 of capacitor. The stress mitigating layer 151 mitigates an external stress applied on the surfaces of the ceramic capacitor 101 under a state that the ceramic capacitor 101 is accommodated in the wiring substrate 10. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 要解决的问题：提供一种能够通过减轻在组件容纳在布线板中的状态下产生的应力来防止裂纹的部件容纳布线板。 布线板10包括芯基板11，陶瓷电容器101和布线层叠单元31.在芯基板11上形成有用于保持陶瓷电容器101的保持孔90.陶瓷电容器101具有减轻应力 形成在电容器的主表面102上的层151，电容器的背面103和电容器的侧表面106上。 应力缓和层151在陶瓷电容器101容纳在布线基板10中的状态下减轻施加在陶瓷电容器101的表面上的外部应力。（C）2009，JPO＆INPIT
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公开(公告)号：JP2005197285A
公开(公告)日：2005-07-21
申请号：JP2003435171
申请日：2003-12-26
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which does not contain Pb, effectively suppresses a contraction in a manufacturing time while holding dielectric characteristics, and easily removes a contraction suppressing layer, and also to provide a method of manufacturing the same.
SOLUTION: The multilayer ceramic substrate having a glass ceramics blending part includes a glass phase consisting of glass having: transition point of 580-700°C; a temperature difference between the glass transition point and a softening point of 140°C or lower; and a content of 0-1 mass% Pb in terms of an oxide. The method of manufacturing the substrate includes a step of baking an unbaked sheet containing a ceramic filler and a glass powder without pressurization the contraction suppressing layer on the front and rear surfaces of a laminate obtained by laminating the unburned sheets. In the method, the glass powder has the glass transition point of 580-700°C, the temperature difference between the glass transition point and the softening point of 140°C or lower, and the glass that the content of Pb is 1 mass% or less (including "0") in terms of the oxide, is used.
COPYRIGHT: (C)2005,JPO&NCIPI摘要翻译： 要解决的问题：为了提供不含Pb的多层陶瓷基板，在保持介电特性的同时有效抑制制造时间的收缩，容易除去收缩抑制层，并且还提供制造方法 相同。 ＆lt; P＆gt;解决方案：具有玻璃陶瓷配合部的多层陶瓷基板包括由玻璃构成的玻璃相，其转变点为580〜700℃; 玻璃化转变点与软化点之间的温度差为140℃以下; 以氧化物换算为0〜1质量％的Pb。 制造基板的方法包括如下步骤：将不含有陶瓷填料和玻璃粉末的未烘烤片材加压而不加压通过层压未燃烧片材得到的层压板的前后表面的收缩抑制层。 在该方法中，玻璃粉末的玻璃化转变点为580-700℃，玻璃化转变温度与软化点的温度差为140℃以下，Pb含量为1质量％ 或更少（包括“0”）。 版权所有（C）2005，JPO＆NCIPI
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3.发明专利
公开(公告)号：JP2005129918A
公开(公告)日：2005-05-19
申请号：JP2004285180
申请日：2004-09-29
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
摘要： PROBLEM TO BE SOLVED: To provide a ceramic substrate for a thin film electronic component equipped with a circuit pattern in a glaze layer, and thin film electronic component using the substrate. SOLUTION: This substrate is equipped with a ceramic substrate 2, glaze layer 3 formed on at least one surface of the substrate, and circuit pattern 21 arranged inside the layer 3 with the part of the pattern exposed over the surface of the layer 3. This circuit pattern 21 can be extended inside the ceramic substrate 2 and the part of the pattern can be exposed to the other surface of the ceramic substrate 2. The thickness of the layer 3 can be from 10 to 100 μm. The surrender point of the layer 3 can be 700°C or over. The principal components of glass that constitutes the layer 3 can be Si, Al, B, Ca and O. The layer 3 can be obtained by heat and pressure treatment of a glass layer 24 formed on the frontal surface of the ceramic substrate 2. This thin film electronic component is equipped with this substrate. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译： 要解决的问题：提供一种用于在釉层中配备电路图案的薄膜电子部件的陶瓷基板和使用该基板的薄膜电子部件。 解决方案：该基板装备有陶瓷基板2，形成在基板的至少一个表面上的釉层3和布置在层3内的电路图案21，其中图案的一部分暴露在层的表面上 该电路图案21可以在陶瓷基板2内部延伸，并且图案的一部分可以暴露于陶瓷基板2的另一个表面。层3的厚度可以为10至100μm。 第3层的投降点可以为700°C以上。 构成层3的玻璃的主要成分可以是Si，Al，B，Ca和O.层3可以通过对形成在陶瓷基板2的前表面上的玻璃层24进行热处理和压力处理来获得。 薄膜电子部件配备有该基板。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2001261315A
公开(公告)日：2001-09-26
申请号：JP2000078989
申请日：2000-03-21
摘要： PROBLEM TO BE SOLVED: To provide a composite material excellent in performance for absorbing bacteria, virus, animal and plant cells, malodorous components, etc., especially for absorbing acidic substances, and to provide a method of producing the same. SOLUTION: In this method of producing the composite material, a base material is sequentially immersed in the first aqueous solution which contains calcium ions but does not contain phosphate ions, then in the second aqueous solution which contains the phosphate ions but does not contain the calcium ions and has a pH of >=8, and finally in the third aqueous solution which has a fluoride ion concentration of 0.03-0.1 mM and does not substantially contain magnesium ions nor carbonate ions, so that aggregates of fluorine-containing columnar hydroxyapatite crystals of which the each has a section size of 10-300 nm and a length of 0.03-3 μm, and a coating having voids formed among the crystals are formed on the surface of the base material. The voids have openings which are cut out on the surface of the coating, and the composite material is composed of the coating and the base material.
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公开(公告)号：JP2001237507A
公开(公告)日：2001-08-31
申请号：JP2000047236
申请日：2000-02-24
申请人： NGK SPARK PLUG CO
摘要： PROBLEM TO BE SOLVED: To inexpensively provide a high permittivity composite material having excellent heat-resistant shock sensitivity and sufficient permittivity, a printed wiring board using the high permittivity composite material, and a multiplayer printed wiring board. SOLUTION: In this high permittivity composite material, a thermosetting resin and a dielectric filler are at least included (a), the dielectric filler has two kinds of average length diameters (b), the particle shape of the dielectric filler having the large average length diameter being exposed on the lap polishing surface of the high permittivity composite material is mainly set to nearly triangular and rectangular shapes (c), and the dielectric filler contained in a high permittivity composite material of 100 vol.% is set to 65 to 90 vol.% (d).
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公开(公告)号：JP2001168490A
公开(公告)日：2001-06-22
申请号：JP34731299
申请日：1999-12-07
申请人： NGK SPARK PLUG CO
发明人： SUMI YASUSHI , KOJIMA TOSHIFUMI , OKUYAMA MASAHIKO
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board that has improved adhesion property between a wiring conductor and an insulation resin layer, and improved filling property of hole-filling paste, and an improved peeling-resistance property at the interface between a through-hole conductor and a hole filler. SOLUTION: Degree of roughness Rz according to the average roughness (conforming to JIS B 0601 3.5.1) of ten uneven points being formed on the surface of the through-hole conductor of a through hole is set smaller than the roughness Rz, according to the average roughness of ten uneven points being formed on the surface of a wiring conductor.
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公开(公告)号：JP2000302617A
公开(公告)日：2000-10-31
申请号：JP11207899
申请日：1999-04-20
摘要： PROBLEM TO BE SOLVED: To obtain antibacterial powder and an antibacterial laminated body capable of readily adsorbing bacteria, viruses, animal and plant cells, or the like, and having an excellent antibacterial property, and a method for producing them. SOLUTION: The antibacterial powder is obtained by dipping powder derived from a mixture of a solution containing silver ion and calcium ion without generating the compounds of silver and calcium and a solution containing phosphoric acid ion and not containing calcium ion and having >=pH 8 into a solution containing an apatite hydroxide component from a saturated concentration to a supersaturated concentration. The antibacterial laminated body is obtained by dipping a base body in the solution containing silver ion and calcium ion and not generating the compounds of silver and calcium, and then dipping it in the solution containing phosphoric acid ion and not containing calcium ion and having >=pH 8, and further dipping it in the solution containing the apatite hydroxide component from the saturated concentration to the supersaturated concentration.
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公开(公告)号：JP2000277922A
公开(公告)日：2000-10-06
申请号：JP7880099
申请日：1999-03-24
申请人： NGK SPARK PLUG CO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a sufficient permittivity by exposing a part of a dielectrics filler on the top surface of a dielectrics layer provided at a multilayer printed interconnection board, with a part of the exposed part contacted to an electrode layer with no intervention of a resin content. SOLUTION: Each dielectrics resin 2 is coated on a PET(polyethylene terephthalate) 1 whose surface is silicon-coated by screen printing, and after it is semi-settled under a specified condition, a coat layer on the dielectrics layer 2 is removed using a belt sander, forming a first exposed surface 10a where a dielectrics filler is exposed. A film 1 as a supporter is released from a primary laminated body like that, and a coat layer on the dielectrics layer 2 is removed to form a second exposed surface where a dielectrics filler is exposed. Then the exposed surface of the dielectrics layer 2 is so contacted as to sandwich between electrodes 6 and 7 to constitute an inner layer capacitor.
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公开(公告)号：JP2000256115A
公开(公告)日：2000-09-19
申请号：JP6033499
申请日：1999-03-08
摘要： PROBLEM TO BE SOLVED: To obtain the subject cement powder and composition affording low viscosity in its kneading with even a small amount of a kneading liquid, excellent in handleability, and giving the corresponding hardened form of high mechanical strength. SOLUTION: This calcium phosphate cement powder is such one as to contain 0.1-10 pts.wt. of urea based on 100 pts.wt. of calcium phosphate powder. The other objective calcium phosphate cement composition is such one as to contain calcium phosphate powder and an urea-contg. kneading liquid; wherein the amount of the urea is 0.1-20 pts.wt. based on 100 pts.wt. of the kneading liquid. The above powder or kneading liquid may also be formulated with polysaccharides including dextran and a sulfate salt thereof. The calcium phosphate powder is esp. pref. a combination of tetracalcium phosphate powder with calcium hydrogenphosphate powder about in an equimolar ratio; in addition, powder such as of tricalcium α-phosphate and/or tricalcium β-phosphate may also be used.
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公开(公告)号：JPH11335155A
公开(公告)日：1999-12-07
申请号：JP1882299
申请日：1999-01-27
IPC分类号： A61L24/00 , A61F2/00 , A61K6/06 , A61K6/838 , A61K6/898 , A61L27/00 , A61L27/12 , A61L27/46 , C04B24/10 , C04B24/12 , C04B28/34 , A61K6/097 , A61L25/00
摘要： PROBLEM TO BE SOLVED: To obtain a cement that can suppress the viscosity increase in the kneading, even when the weight ratio of the kneading solution is low, shows excellent operability and moldability with the curing time shortened and gives the hardened or cured product of high strength. SOLUTION: Powdery calcium phosphate is mixed with N-alkyl-D-glucamine (the alkyl is methyl, ethyl, n-propyl or iso-propyl) to prepare the objective calcium phosphate cement or water is added to the phosphate cement and the mixture is kneaded to give the objective cement composition. The N-alkyl-D- glucamine has an average particle size of 0.1-100 μm and its content is 0.05-5 pts.wt., per 100 pts.wt. of the cement. In a preferred embodiment, the glucamine is included in the cement composition in an amount of 0.1-10 pts.wt. The N- alkyl-D-glucamine may be replaced with an alkanolamine (the alkanol means methanol, ethanol, n- or iso-propanol; the amine means mono-, di- or triamine).
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