Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorber which has a sufficient flame resistance, an electromagnetic wave absorbing characteristic, a flexibility and an excellent chemical resistance. SOLUTION: A flame resistance electromagnetic wave absorbing material composition contains (A) a compound having two pieces or more of carboxyl group and/or acid anhydride group thereof in one molecule, (B) a compound having two pieces or more epoxy group in one molecule, (C) a soft magnetic powder, and (D) a fire retarding material. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a solder paste in which the organic halide compound to be blended to improve the solder wettability is sufficiently decomposed under the reflow condition without generating any ionic halogen, the performance as the solder paste is kept, and further the solder wettability is kept in a excellent condition, and the reliability of the product is excellent for a long time even without any cleaning. SOLUTION: In the solder paste in which the organic halide compound is blended as the activator, the flux in which 0.005-2.0wt.% polymer containing at least one of polyethylene glycol, poly-N-vinyl acetamide and poly-acrylic acid having the complex forming ability to the metal is added to the total weight of the flux, is blended.
Abstract:
PURPOSE:To prevent sagging and balling of solder by adding glyceride having the b. p. of a specific temp. or above at a specific ratio into a flux of the cream solder, the solder powder of which is spherical powder. CONSTITUTION:The solder powder is oxygenfree solder powder, for which the spherical powder having about =200 deg.C b. p. as the thixotropic agent, and kneading the mixture. The thixotropic property of the cream solder is lost at the time of reflow when the b. p. of the glyceride is =10%. The sagging and balling of the solder at the time of reflow are thus obviated.
Abstract:
PURPOSE:To prevent balling at the time of reflow by adding a fatty acid amine compd. at a specific ratio into a flux of the cream solder, the solder powder of which is spherical powder. CONSTITUTION:The solder powder is oxygenfree solder powder, for which the spherical powder having about =24 hours after printing. The sufficient protection of the solder surface is not possible when content of the antioxidant is =5%. The balling is obviated at the time of reflow and the workability in a mounting line is improved.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for raising the heat transfer rate of a cast lump from a casting mold surface to the inner wall surface of a casting mold when a rare earth alloy or particularly an alloy for an R-T-B magnet is manufactured by a centrifugal casting method and to thereby manufacture the alloy for the R-T-B magnet having microcrystalline grains which have not heretofore been. SOLUTION: The method for manufacturing a rare earth alloy by a centrifugal casting method comprises a step of mounting a film having a small thermal conductivity than that of a casting mold material on the inner wall surface of a cylindrical casting mold. The thermal conductivity of the film is 80 W/mK or less. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that, as when shifting to a component side of R of low concentration in a R-T-B-based magnet alloy, a ratio that a R-rich phase is present is decreased, densification cannot be expected when sintered to a magnet, and further an improvement cannot be expected in coercive force. SOLUTION: In a rare-earth magnet alloy agglomeration, an R-T-B-based magnet alloy contains an element of a type or more of Nd, Pr and Dy having 11.8 to 15.2 atomic % in all and B of 5.6 to 7.9 atomic % (R is of a type out of rare-earth elements containing Y, T has Fe as a main component, and a part thereof can be replaced with Co, Ni, or the like). Still, in a state of being cast, an R-rich phase of length 100 μm or more is not found substantially in cross section. In a method for manufacturing the rare-earth magnet alloy agglomeration, a melt 31 is received by a rotator 5 and is scattered by rotation of the rotator, and the scattered melt is deposited and fixed 7 on an inner plane of a rotating cylindrical die 4 of which the inner plane has a recessed and/or projected unsmoothed surface.
Abstract:
PROBLEM TO BE SOLVED: To obtain a solder paste for printed board holding the excellent performance for long term without developing solder ball even in the case of storing for long term by blending flux adding specific high molecular compound in specific wt. ratios. SOLUTION: The flux adding the high molecular compound having complex body forming capacity and at least decimer at 0.005-3.0wt.% to the flux wt., is blended to a metal constituting the solder. The high molecular compound has a functional group easily forming the metal complex body of amino group, imino group, hydroxyl group, ether group, pyridyl group, imidazole group, carboxyl group, thiol group, amide group, sulfo group, oxime group, hydroxam group, phosphate group, ketone group, or large ring ligand group such as porphyrin, etc. and further, contains at least one of polyethylene glycol, poly-N- vinylacetamide and polyacrylic acid.
Abstract:
PURPOSE:To obtain products having high reliability without short circuiting by incorporating capric acid into a compsn. contg. powder solder, resin, solvent, etc., thereby constituting the cream soldier. CONSTITUTION:The cream solder is constituted by incorporating the capric acid into the compsn. contg. the powder solder, resin, solvent, etc. The solder for non-washing is constituted by adding 5 to 35wt.% capric acid as an activator into flux components. The cream solder for fine patterns are constituted by adding 20 to 35wt.% capric acid to flux components together with other activators. The workability and productivity are improved in this way.
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorber which has high flexibility, chemical resistance, and strength with substantially non-halogen. SOLUTION: A composite is heated and cross-linked which contains (A) a compound having at least one or more carboxyl groups or a derivative thereof in a molecule, (B) an epoxy compound having two or more epoxy groups in a molecule, and (C) soft magnetic powder. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a Ti-Cr alloy with BCC structure which has low impurity, large capacity of hydrogen absorption and emission as well as ability for quenching solidification, in the manufacturing method for a hydrogen absorbing alloy whose main phase is a body-centered cubic structure(BCC structure) and capable to absorb and emit hydrogen. SOLUTION: The alloy containing Ti, Cr and one or more kinds of elements selected from V, Mo and W, is attached to a rotational axis R with which the alloy material is rotated together. An arc or plasma arc generating device is equipped to melt the rotating alloy material, and a rotating cylindrical mold is prepared around the material so that the rotating axis L of the mold makes an angle of inclination θ to the rotating axis R. Melted metal is solidified on the inside wall of the mold.