公开(公告)号：JP2004079855A

公开(公告)日：2004-03-11

申请号：JP2002239648

申请日：2002-08-20

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： OKA YOSHIO ,  KANDA MASAHIKO ,  HAYASHI NORIKATA ,  KIMURA TOSHIHIDE ,  KASHIWAGI SHUJI ,  NISHIMURA AKIRA

IPC: C09J9/02 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L2224/16225

Abstract: PROBLEM TO BE SOLVED: To provide a novel printed circuit board which is formed by adhering a metallic plate firmly with higher thermal conductivity and enables the metallic plate to fully exert its function as a heat sink and a reinforcing plate. SOLUTION: A metallic plate 3 is adhered to the rear of a chip mounting part 2 of a substrate 1 having the bump-method chip mounting part 2 consisting of a number of conductor circuits 21 in the surface of the substrate 1 via an adhesive layer 4 containing chain-like metallic powder. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004128365A

公开(公告)日：2004-04-22

申请号：JP2002293178

申请日：2002-10-07

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： NAKAGAMA SHOJI ,  HAYASHI NORIKATA ,  OKA YOSHIO ,  YAGI SHIGETO ,  KANDA MASAHIKO ,  NAKAYAMA HIDEAKI ,  YAMAOKA SEIICHI

IPC: H05K3/38 ,  H05K3/16 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a flexible copper clad in which a stability of dimension and flexibility is excellent, a thin copper layer can be easily formed, peel strength reduction is small after a heat deterioration test and processes of a micro-via, desmear, gilding or the like, and further a minute circuit can be formed that has favorable patterns and is hard to exfoliate.
SOLUTION: In the flexible copper clad substrate in which a thermoplastic polyimide layer, a metallic layer that is composed of an alloy containing at least one sort of metals among nickel, chrome or nickel and chrome and has a thickness of 5 nm or more, and copper layer are formed in this order on a base film formed from a heat resistant resin. Further, the flexible copper clad circuit board has an unevenness whose center line roughness Ra is nearly in a range of 0.1 to 1.0μm in a boundary face between the thermoplastic polyimide layer and the metallic layer and is fabricated by using a fabricating method of the flexible copper clad circuit board.
COPYRIGHT: (C)2004,JPO