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公开(公告)号:JP2004079855A
公开(公告)日:2004-03-11
申请号:JP2002239648
申请日:2002-08-20
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor: OKA YOSHIO , KANDA MASAHIKO , HAYASHI NORIKATA , KIMURA TOSHIHIDE , KASHIWAGI SHUJI , NISHIMURA AKIRA
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a novel printed circuit board which is formed by adhering a metallic plate firmly with higher thermal conductivity and enables the metallic plate to fully exert its function as a heat sink and a reinforcing plate. SOLUTION: A metallic plate 3 is adhered to the rear of a chip mounting part 2 of a substrate 1 having the bump-method chip mounting part 2 consisting of a number of conductor circuits 21 in the surface of the substrate 1 via an adhesive layer 4 containing chain-like metallic powder. COPYRIGHT: (C)2004,JPO
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公开(公告)号:JP2006269977A
公开(公告)日:2006-10-05
申请号:JP2005089506
申请日:2005-03-25
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor: NAGAYOSHI TOSHIHARU , INADA SHOGO , KASHIWAGI SHUJI
Abstract: PROBLEM TO BE SOLVED: To provide a shield flexible wiring board used in an area of electronic equipment for preventing the leakage of an electromagnetic wave generated from a circuit to the outside and excellent in shielding effect, capable of shielding external noise, and preferably having further superior flexibility.
SOLUTION: The shild flexible wiring board comprises an insulating base-film, a circuit provided to contact with the base film, a cover lay for covering the circuit, a conductive shield layer formed on the cover lay and conducting to the circuit through the through-hole formed in the cover lay, and an insulating protective layer for covering the conductive shield layer. A grounding part for conducting the conductive shield layer to the conductor other than the flexible wiring board is formed in the insulating protective layer.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题:提供一种用于防止从电路产生到外部的电磁波泄漏的电子设备区域中的屏蔽柔性布线板,并且能够屏蔽外部噪声的屏蔽效果优异,以及 优选具有更好的柔性。 解决方案:光纤柔性布线板包括绝缘基膜,设置为与基膜接触的电路,覆盖电路的盖板,形成在盖上的导电屏蔽层,并通过 形成在盖中的通孔布置,并且覆盖导电屏蔽层的绝缘保护层。 在绝缘保护层中形成有用于将导电屏蔽层导通到柔性布线板以外的导体的接地部。 版权所有(C)2007,JPO&INPIT
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公开(公告)号:JP2005101112A
公开(公告)日:2005-04-14
申请号:JP2003330613
申请日:2003-09-22
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor: KASHIWAGI SHUJI , NAGAKUBO TAKAHIKO
CPC classification number: H05K1/028 , H05K2201/051 , H05K2201/055
Abstract: PROBLEM TO BE SOLVED: To provide a new flexible printed circuit board which is hardly reduced in durability even when it is repeatedly rotated while a flexible interconnect line member is wound thereon in spirals, easily assembled together, and more increased in the number of interconnect lines than a single-sided board. SOLUTION: A pair of rectilinear flexible interconnect line members 101 and 102 which can be folded in half along a folding line VL provided at a one lengthwise end and overlap with each other when they are folded in half, a first and a third connectors 11 and 13, which are extended in the direction so as to cross the lengthwise direction from the ends of the interconnect line members 101 and 102 on the folding line VL side, and a second and a fourth connectors 12 and 14, which are extended in the opposite direction from the other ends of the interconnect lines 101 and 102, are integrally formed with a sheet of base film, and conductor interconnect lines 16a and 16b and terminals 15a to 15d are formed in the flexible printed circuit board 1. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题:为了提供一种新颖的柔性印刷电路板,其即使在反复旋转时几乎不降低耐用性,同时柔性互连线构件以螺旋方式缠绕在其上,容易组装在一起,并且数量增加 的互连线比单面板。 解决方案:一对直线柔性互连线构件101和102,其可以沿着折叠线VL折叠成一半,并且当它们折叠成一半时彼此重叠,第一和第三 连接器11和13沿着折叠线VL侧的互连线构件101和102的端部沿纵向方向延伸的方向延伸,以及延伸的第二和第四连接器12和14 在与互连线101和102的另一端相反的方向上,与基膜一体形成,并且在柔性印刷电路板1中形成导体互连线16a和16b以及端子15a至15d。
版权所有(C)2005,JPO&NCIPI
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公开(公告)号:JP2004247352A
公开(公告)日:2004-09-02
申请号:JP2003032736
申请日:2003-02-10
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor: KASHIWAGI SHUJI , INADA SHOGO
Abstract: PROBLEM TO BE SOLVED: To provide a new flexible printed board which is manufactured through a process simpler than usual, high in productivity, superior in manufacturing yield, capable of reducing distortion stress that is imposed on a conductor wiring when a flexible interconnect line unit is bent, and more improved in flexing resistance than usual.
SOLUTION: A first joint 1 is composed of regions 11 and 12, folded in two along a bending line BL, and equipped with a terminal unit T1 formed on the surface of its region 11 which borders on the BL and faces inward when the first joint 1 is folded in half, and an opening 12a which is for exposing the terminal unit T1 to the outside when the first joint 1 is folded in two and provided in its other region 12 (a). A pair of flexible wiring members 41 and 42 have plane forms that are nearly line-symmetrical so as to overlap with each other when the first joint 1 is folded in half, and equipped with conductor interconnect lines 51 and 52 formed on their surfaces that face inward when the first joint 1 is folded in half (b). A second and a third joint, 2 and 3, are formed on the tips of the flexible wiring members 41 and 42 respectively and equipped with terminal units T2 and T3 on their surfaces that face inward when the first joint 1 is folded in half (c). The first joint 1, the flexible wiring members 41 and 42, and the second and third joints 2 and 3, are formed integrally on a sheet of base film.
COPYRIGHT: (C)2004,JPO&NCIPI-
公开(公告)号:JP2004207650A
公开(公告)日:2004-07-22
申请号:JP2002377782
申请日:2002-12-26
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor: KASHIWAGI SHUJI , NAGAKUBO TAKAHIKO
CPC classification number: H05K1/118 , H01L2924/0002 , H05K3/0032 , H05K3/361 , H05K2201/09145 , H05K2201/09781 , H05K2203/167 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a novel flexible printed wiring substrate 1 which enables the formation of a flexible printed wiring board 1a with a highly precise connection part C which does not generate a connection failure in connection to a connector even if fine pitching is further proceeded. SOLUTION: In the flexible printed wiring substrate 1, dummy patterns DP, DP used for a mask for performing laser processing for a base film 11 with a shape corresponding to contours of both sides F1, F1 are formed of a metal thin film at both the sides F1, F1 which are functioned as the positioning of terminals 13 in the connection of a connection part C to a connector simultaneously with the terminals 13. COPYRIGHT: (C)2004,JPO&NCIPI
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