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公开(公告)号：JP2003324256A
公开(公告)日：2003-11-14
申请号：JP2002129946
申请日：2002-05-01
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： KASHIWAGI TORU , KIMURA TOSHIHIDE
IPC: H05K1/02
Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which the generation of dust from a reinforcing board is restrained without performing chemical etching.
SOLUTION: On both surfaces of connector insertion parts A positioned on both ends of a flexible printed wiring board 1 and both surfaces of a part mounting part B positioned on an intermediate part of the board 1, a reinforcing board 2 whose working end surface is coated with a resin coating 3 is stuck, respectively, with an adhesive agent 4. By applying the resin coating to the cut end surface, the peel-off and fall-out of a small piece of a material from the end surface are restrained.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：提供一种柔性印刷线路板，其中在不进行化学蚀刻的情况下抑制来自加强板的灰尘的产生。 解决方案：位于柔性印刷电路板1的两端的连接器插入部A的两面和位于基板1的中间部的部件安装部B的两个面的加强板2的工作端 表面用树脂涂层3分别用粘合剂4粘贴。通过将树脂涂层施加到切割端表面，从端表面剥离和掉出一小块材料是 束缚 版权所有（C）2004，JPO
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公开(公告)号：JP2004079855A
公开(公告)日：2004-03-11
申请号：JP2002239648
申请日：2002-08-20
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： OKA YOSHIO , KANDA MASAHIKO , HAYASHI NORIKATA , KIMURA TOSHIHIDE , KASHIWAGI SHUJI , NISHIMURA AKIRA
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a novel printed circuit board which is formed by adhering a metallic plate firmly with higher thermal conductivity and enables the metallic plate to fully exert its function as a heat sink and a reinforcing plate. SOLUTION: A metallic plate 3 is adhered to the rear of a chip mounting part 2 of a substrate 1 having the bump-method chip mounting part 2 consisting of a number of conductor circuits 21 in the surface of the substrate 1 via an adhesive layer 4 containing chain-like metallic powder. COPYRIGHT: (C)2004,JPO
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