摘要:
PROBLEM TO BE SOLVED: To provide a method for cutting a workpiece which can accurately cut a workpiece with a wire saw to prepare a wafer having a good warp shape. SOLUTION: In the method, a cylindrical workpiece held on a workpiece holder is pressed against a wire line formed of a wire spirally wound between a plurality of wire guides. The wire is travelled while supplying slurry into a contact part between the workpiece and the wire to cut the workpiece in a wafer form. In this case, the workpiece is cut in such a manner that the axial direction of the workpiece is inclined to a plane formed by the wire line. The workpiece is cut after inclination such that the workpiece on its side remote from the plane of the wire line is extended in an axial direction of the wire guide. COPYRIGHT: (C)2010,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide an apparatus for slicing or a component thereof capable of bringing about high versatility, low wire breaking property, improved workpiece handling capacity, high-speed property, high process control or the like.SOLUTION: A wire slicing system and a method using the same comprise one or more of following mechanisms: an apparatus and/or operation related to handling of a wire; a machine and a method related to wire spread; an instrument and a technology for treating a workpiece; an apparatus and/or operation designed for cooling and removal of swarf (strip); and control and/or automatization usable jointly with these mechanisms.