Resin composition for insulating layer
    7.
    发明专利
    Resin composition for insulating layer 审中-公开
    用于绝缘层的树脂组合物

    公开(公告)号:JP2010163521A

    公开(公告)日:2010-07-29

    申请号:JP2009005812

    申请日:2009-01-14

    发明人: YAHAGI AKIRA

    IPC分类号: C08F299/00 C08F8/00

    摘要: PROBLEM TO BE SOLVED: To provide a resin composition for an insulating layer of an organic thin film transistor, which can be crosslinked without being treated at a high temperature for a long time and is capable of forming an insulating layer excellent in surface adhesion property.
    SOLUTION: The resin composition for the insulating layer of the organic thin film transistor comprises (A) a polymer compound containing a repeating unit to which a photosensitive group is bound through a urea bond or a urethane bond, (B) a hardener, and (C) an organic solvent. An organic thin film transistor is also provided using the resin composition as an overcoat layer.
    COPYRIGHT: (C)2010,JPO&INPIT

    摘要翻译: 要解决的问题:提供一种有机薄膜晶体管的绝缘层用树脂组合物,其可以交联而不经过长时间的高温处理,并且能够形成表面优异的绝缘层 粘附性。 < P>解决方案:有机薄膜晶体管的绝缘层用树脂组合物包含(A)含有通过脲键或氨基甲酸酯键与光敏基团结合的重复单元的高分子化合物,(B)固化剂 ,(C)有机溶剂。 还使用树脂组合物作为外涂层来提供有机薄膜晶体管。 版权所有(C)2010,JPO&INPIT