Thermosetting adhesive tape or sheet
    7.
    发明专利
    Thermosetting adhesive tape or sheet 有权
    热固胶带或薄片

    公开(公告)号:JP2012051994A

    公开(公告)日:2012-03-15

    申请号:JP2010194477

    申请日:2010-08-31

    摘要: PROBLEM TO BE SOLVED: To provide a thermosetting adhesive tape or sheet resistant to deposition of foreign matter, such as dust and dirt, to a surface of a thermosetting adhesive layer.SOLUTION: The thermosetting adhesive tape or sheet is an adhesive tape or sheet for a flexible printed circuit board including a release liner on at least one surface of the thermosetting adhesive layer, wherein arithmetic mean roughness (Ra) of at least one surface of the release liner is 0.6 μm or more and less than 20 μm and the surface (at least one surface) of the release liner having arithmetic mean roughness (Ra) of 0.6 μm or more and less than 20 μm is in contact with the surface of the thermosetting adhesive layer.

    摘要翻译: 要解决的问题:提供一种耐热的粘合带或薄片,其可以防止异物如灰尘和污垢沉积到热固性粘合剂层的表面上。 热固性粘合带或片是用于柔性印刷电路板的粘合带或片,其包括在热固性粘合剂层的至少一个表面上的剥离衬垫,其中至少一个表面的算术平均粗糙度(Ra) 的剥离衬垫的厚度为0.6μm以上且小于20μm,并且具有0.6μm以上且小于20μm的算术平均粗糙度(Ra)的剥离衬垫的表面(至少一个表面)与表面 的热固性粘合剂层。 版权所有(C)2012,JPO&INPIT