Joining method of aluminum member and manufacturing method of semiconductor device
    2.
    发明专利
    Joining method of aluminum member and manufacturing method of semiconductor device 审中-公开
    铝构件的接合方法和半导体器件的制造方法

    公开(公告)号:JP2014184439A

    公开(公告)日:2014-10-02

    申请号:JP2013058900

    申请日:2013-03-21

    发明人: SATO MASA

    IPC分类号: B23K20/00 B23K20/24

    摘要: PROBLEM TO BE SOLVED: To provide a joining method of an aluminum member capable of uniformly and stably joining mutual aluminum members, even when the area of a joint object surface is large.SOLUTION: The joining method of the aluminum member is provided for joining a first aluminum member 10 and a second aluminum member 20 by bringing the first aluminum member 10 composed of aluminum or an aluminum alloy and the second aluminum member 20 composed of the aluminum or the aluminum alloy into pressure contact with each other. The joining method of the aluminum member includes an uneven structure forming process of forming an uneven structure on the respective joint object surfaces in the first aluminum member 10 and the second aluminum member 20 before bringing the first aluminum member 10 and the second aluminum member 20 into pressure contact with each other, and a pressure contact process of bringing the first aluminum member 10 and the second aluminum member 20 into pressure contact with each other in a state of opposing the joint object surfaces, in this order.

    摘要翻译: 要解决的问题:即使当接合物面的面积大时,也能够提供能够均匀且稳定地接合相互的铝构件的铝构件的接合方法。解决方案:铝构件的接合方法用于接合 第一铝构件10和第二铝构件20通过使由铝或铝合金构成的第一铝构件10和由铝或铝合金构成的第二铝构件20彼此压力接触。 铝构件的接合方法包括在使第一铝构件10和第二铝构件20进入之前在第一铝构件10和第二铝构件20的各个接合物表面上形成不平坦结构的凹凸结构形成工艺 并且使第一铝构件10和第二铝构件20以与接合面对置的状态相互压力接触的压接工序。