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    코어리스 기판 가공을 위한 캐리어 제작 방법 및 이를이용한 코어리스 기판
    82.
    发明公开
    코어리스 기판 가공을 위한 캐리어 제작 방법 및 이를이용한 코어리스 기판 失效
    制造载体和其制造的无机基材的方法

    公开(公告)号：KR1020090065622A

    公开(公告)日：2009-06-23

    申请号：KR1020070133013

    申请日：2007-12-18

    申请人： 대덕전자 주식회사

    发明人： 조원진 ,  지상철

    IPC分类号： H05K3/00

    CPC分类号： H05K3/4682 ,  H05K3/0058 ,  H05K3/007

    摘要： A method for manufacturing a carrier and a coreless substrate manufactured thereby are provided to cut only a release film by using only a copper foil disk and a prepreg instead of cutting a CCL(Copper Cladded Layer) and the prepreg. A cutting process is performed to cut a release film(120). The release film is laminated on both sides of a unhardened resin(110). A metal foil(100) is laminated on the release film to form a carrier. A prepreg is used as the unhardened resin. The metal foil is made of a copper foil disk or CAC(Cu-Al-Cu). The carrier is separated from a substrate(130) by peeling off the release film. The area of the cut release film is smaller than the area of the unhardened resin. The release film is inserted between the metal foil and the prepreg. The release film is sealed by the prepreg and the metal foil, in order to form the carrier.

    摘要翻译： 提供一种用于制造其制造的载体和无芯基板的方法，仅通过仅使用铜箔盘和预浸料来切割脱模膜，而不是切割CCL（铜包层）和预浸料。 执行切割处理以切割剥离膜（120）。 将剥离膜层压在未硬化树脂（110）的两侧。 将金属箔（100）层叠在剥离膜上以形成载体。 使用预浸料作为未硬化树脂。 金属箔由铜箔盘或CAC（Cu-Al-Cu）制成。 通过剥离剥离膜将载体与基板（130）分离。 切断膜的面积小于未硬化树脂的面积。 将剥离膜插入在金属箔和预浸料之间。 为了形成载体，用预浸料和金属箔密封脱模膜。

    인쇄회로기판 제조방법
    85.
    发明授权
    인쇄회로기판 제조방법 失效
    制造印刷电路板的方法

    公开(公告)号：KR100796981B1

    公开(公告)日：2008-01-22

    申请号：KR1020060101632

    申请日：2006-10-19

    申请人： 삼성전기주식회사

    发明人： 박정우 ,  강명삼 ,  박정현 ,  김지은 ,  최종규 ,  김상덕 ,  정회구

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4007 ,  H05K3/007 ,  H05K3/1258

    摘要： A method for manufacturing a printed circuit board is provided to simplify a process and prevent a void between a pattern and an insulation layer from occurring by reducing the height difference of the rest part except for a bump. A method for manufacturing a printed circuit board includes the steps of: forming engraved patterns corresponding to bumps on a carrier(S10); stacking on the carrier masks having opening units corresponding to the engraved patterns(S11); forming the bumps by charging a conductive paste on the engraved patterns(S20); stacking the carrier formed thereon the bump on one surface or both surfaces of a substrate so as to transfer the bumps to the substrate(S30); exposing the bumps by removing the carrier(S40); and stacking a first insulation layer on the one surface or the both surfaces of the substrate(S50).

    摘要翻译： 提供了一种用于制造印刷电路板的方法，以简化工艺并通过减小除了凸起之外的其余部分的高度差来防止图案和绝缘层之间的空隙。 制造印刷电路板的方法包括以下步骤：形成与载体上的凸起相对应的雕刻图案（S10）; 堆叠在具有对应于雕刻图案的开口单元的载体掩模上（S11）; 通过在雕刻图案上充电导电膏来形成凸块（S20）; 将形成在其上的载体堆叠在基板的一个表面或两个表面上，以将凸块传送到基板（S30）; 通过移除载体来暴露凸起（S40）; 并在基板的一个表面或两个表面上层叠第一绝缘层（S50）。