Abstract:
PURPOSE: A semiconductor element, a manufacturing method thereof, and a semiconductor device including the same are provided to stabilize the electrical properties of a transistor by forming an oxide semiconductor layer with crystallinity in a wide directional range of a film thickness. CONSTITUTION: An underlayer(102) with crystallinity is formed on a substrate(100). An oxide semiconductor layer(106) with the crystallinity is formed on the underlayer. A gate insulation layer(108) is formed on the oxide semiconductor layer. A gate electrode(110) is formed on the gate insulation layer. A source electrode(114a) and a drain electrode(114b) are electrically connected to the oxide semiconductor layer.
Abstract:
트랜지스터에 안정된 전기적 특성을 공급하여, 신뢰성이 높은 반도체 장치를 제작한다. 다결정 스퍼터링 타겟을 사용하여 스퍼터링법에 의해 산화물 반도체막이 성막된다. 이 경우, 성막 이전 또는 성막 시의 성막 챔버 내의 물 분압을 10 -3 Pa 이하, 바람직하게는 10 -4 Pa 이하, 보다 바람직하게는 10 -5 Pa 이하로 설정한다. 이렇게 하여, 치밀한 산화물 반도체막이 얻어진다. 산화물 반도체막의 밀도는 6.0 g/cm 3 초과 6.375 g/cm 3 미만이다.
Abstract:
PURPOSE: An oxide semiconductor film and a semiconductor device are provided to improve the reliability of the semiconductor device by using the oxide semiconductor film comprising indium zinc oxide for a transistor. CONSTITUTION: An oxide semiconductor film is composed of indium zinc oxide. The oxide semiconductor film includes a hexagonal crystal structure. A first insulating film is provided between a gate electrode and the oxide semiconductor film. A source electrode and a drain electrode are contacted to the oxide semiconductor film. A second insulating film is formed on the oxide semiconductor film.