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    다층 세라믹 기판의 제조 방법
    1.
    发明公开
    다층 세라믹 기판의 제조 방법 无效
    多层基板的制造方法

    公开(公告)号：KR1020090066862A

    公开(公告)日：2009-06-24

    申请号：KR1020070134580

    申请日：2007-12-20

    申请人： 삼성전기주식회사

    发明人： 박은태 ,  고민지

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4611 ,  B32B18/00 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/661 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K2203/308

    摘要： A method for manufacturing a multilayer ceramic substrate is provided to improve fixing intensity between a ceramic lamination and an external electrode in a second baking process by preventing crystallization of a glass component included in the ceramic lamination in a first baking process. A ceramic lamination manufacturing process is performed to manufacture a ceramic lamination including a glass component. A constraining layer is laminated on an upper part and a lower part of the ceramic lamination. A first baking process is performed within a first temperature range to prevent the crystallization of the glass component included in the ceramic lamination. The constraining layer is removed after the first baking process. An external electrode is formed on the ceramic lamination. A second baking process is performed to bake the ceramic lamination including the external electrode in a second temperature range. The second temperature range is higher than the first temperature range.

    摘要翻译： 提供一种制造多层陶瓷基板的方法，用于通过在第一烘烤工艺中防止包含在陶瓷层压件中的玻璃成分的结晶而在第二烘烤工艺中提高陶瓷层压板和外部电极之间的固定强度。 执行陶瓷层压制造工艺以制造包括玻璃组分的陶瓷层压体。 在陶瓷层压体的上部和下部层压约束层。 在第一温度范围内进行第一烘焙处理，以防止包含在陶瓷层压体中的玻璃成分的结晶。 在第一次烘烤过程之后去除约束层。 在陶瓷层压板上形成外部电极。 进行第二烘烤处理以在第二温度范围内烘烤包括外部电极的陶瓷层压体。 第二温度范围高于第一温度范围。

    세라믹 기판의 제조방법 및 세라믹 기판
    2.
    发明公开
    세라믹 기판의 제조방법 및 세라믹 기판 无效
    生产陶瓷基材的方法和陶瓷基材

    公开(公告)号：KR1020050026369A

    公开(公告)日：2005-03-15

    申请号：KR1020040072126

    申请日：2004-09-09

    申请人： 니혼도꾸슈도교 가부시키가이샤

    发明人： 도사아키후미 ,  오츠카쥰 ,  사토마나부 ,  가시마히사히토

    IPC分类号： H01G4/12 ,  H01G4/005

    CPC分类号： B32B18/00 ,  C03C14/004 ,  C03C2214/20 ,  C04B2235/6567 ,  C04B2235/9615 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/568 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/30 ,  H01L21/481 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/09881 ,  H05K2203/308

    摘要： A method for manufacturing ceramic substrates, and the ceramic substrates are provided to minimize firing strains on a surface conductor by preventing external pollutants from adhering to the surface conductor. A surface-mount-type laminated ceramic capacitor(40) is a laminate of ceramic dielectric layers(5) and wiring pattern layers(6), which are alternately arranged in layers. Each of the wiring pattern layers(6) includes the first capacitor electrode(6a) and the second capacitor electrode(6b), which face each other with the corresponding ceramic dielectric layer(5) sandwiched therebetween. The first via electrodes(8) are electrically connected to the first capacitor electrodes(6a) and are not electrically connected to the second capacitor electrodes(6b). The second via electrodes(8') are electrically connected to the second capacitor electrodes(6b) and are not electrically connected to the first capacitor electrodes(6a). Metal terminals(33) have a diameter greater than that of the via electrodes and include a surface conductor(32) and a plating layer(31). The surface conductors(32) are embedded in a ceramic dielectric layer(7b) whose surface serves as a main surface(CP) of the capacitor(40). A ceramic green sheet(21) to be used in forming the second base portion is prepared. Then, a plurality of ceramic green sheets(5) to be laminated thereon are prepared. A plurality of via holes(4) are formed in the ceramic green sheets(5) at identical positions. A via electrode paste fills the via holes(4) to form via electrodes(8).

    摘要翻译： 提供陶瓷基板的制造方法和陶瓷基板，以通过防止外部污染物附着在表面导体上而使表面导体上的烧成应变最小化。 表面安装型层叠陶瓷电容器（40）是层叠交替排列的陶瓷电介质层（5）和布线图案层（6）的叠层体。 布线图案层（6）中的每一个包括第一电容器电极（6a）和第二电容器电极（6b），它们彼此相对，并且相应的陶瓷介电层（5）夹在它们之间。 第一通孔电极（8）电连接到第一电容器电极（6a），并且不与第二电容器电极（6b）电连接。 第二通孔电极（8'）电连接到第二电容器电极（6b），并且不与第一电容器电极（6a）电连接。 金属端子（33）的直径大于通孔电极的直径，并且包括表面导体（32）和镀层（31）。 表面导体（32）嵌入陶瓷电介质层（7b）中，其表面用作电容器（40）的主表面（CP）。 制备用于形成第二基底部分的陶瓷生片（21）。 然后，准备多个层压在其上的陶瓷生片（5）。 多个通孔（4）在相同的位置形成在陶瓷生片（5）中。 通孔电极浆料填充通孔（4）以形成通孔电极（8）。

    무수축 세라믹 기판의 제조방법
    4.
    发明授权
    무수축 세라믹 기판의 제조방법 失效
    制造非收缩陶瓷基板的方法

    公开(公告)号：KR100882101B1

    公开(公告)日：2009-02-06

    申请号：KR1020070113359

    申请日：2007-11-07

    申请人： 삼성전기주식회사

    发明人： 김형호 ,  이종면 ,  박은태 ,  유수현

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4611 ,  B32B18/00 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  H05K1/0306 ,  H05K3/245 ,  H05K3/4629 ,  H05K2203/0315 ,  H05K2203/308

    摘要： A method for manufacturing asystole ceramic substrate is provided to improve the sticking intensity of the ceramic laminated body and the electrode by preventing the diffusion of the glass, the binder etc, included in the green sheet. A ceramic laminated body(100) is prepared. The ceramic laminated body is made of a plurality of green sheets. Each green sheet has the wiring pattern. The outer electrode(101) is formed in at least one side among the upper side and the lower side of the ceramic laminated body. The metal layer(102) is formed in order to cover at least a part of the outer electrode. The green sheet(200) for binding is arranged in one or more side among upper side and lower side of the ceramic laminated body. The green sheet for binding suppresses the face direction contraction of the green sheet. The ceramic laminated body is plasticized at the firing temperature of the green sheet. Therefore, the metal layer is oxidized. The green sheet for binding and the metal oxide layer are removed. The metal layer is made of the aluminum (Al).

    摘要翻译： 提供一种制造心耳状陶瓷基片的方法，通过防止包含在生片中的玻璃，粘合剂等的扩散来提高陶瓷层叠体和电极的粘着强度。 制备陶瓷层叠体（100）。 陶瓷层叠体由多个生片构成。 每个生片具有布线图案。 外部电极（101）形成在陶瓷层叠体的上侧和下侧的至少一侧。 形成金属层（102）以覆盖外部电极的至少一部分。 用于装订的生片200被布置在陶瓷层叠体的上侧和下侧的一侧或多侧上。 用于结合的生片抑制生片的面方向收缩。 陶瓷层叠体在生片的烧成温度下被塑化。 因此，金属层被氧化。 去除用于粘合的生片和金属氧化物层。 金属层由铝（Al）制成。