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公开(公告)号：TWI459878B
公开(公告)日：2014-11-01
申请号：TW098127585
申请日：2009-08-17
申请人： 珊布蘭特有限公司 , SEMBLANT LIMITED
发明人： 佛列迪那迪 法蘭克 , FERDINANDI, FRANK , 史密斯 羅尼E , SMITH, RODNEY EDWARD , 休夫瑞斯 馬克R , HUMPHRIES, MARK ROBSON
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
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公开(公告)号：TW201014483A
公开(公告)日：2010-04-01
申请号：TW098127585
申请日：2009-08-17
申请人： 珊布蘭特有限公司
IPC分类号： H05K
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
摘要： 於某些實施例，一印刷電路板(PCB)包含一基材，其包含一絕緣材料。此PCB進一步包含多個導電軌，其附接至此基材之至少一表面。此PCB進一步包含一多層塗層，其係沈積於此基材之此至少一表面上。此多層塗層(i)覆蓋此等多個導電軌之至少一部份，及(ii)包含至少一料一鹵-烴類聚合物形成之層。此PCB進一步包含至少一電組件，其係藉由一焊料接頭與至少一導電軌金接，其中，此焊料接頭係經由此多層塗層焊接，如此，此焊料接頭鄰接此多層塗層。
简体摘要： 于某些实施例，一印刷电路板(PCB)包含一基材，其包含一绝缘材料。此PCB进一步包含多个导电轨，其附接至此基材之至少一表面。此PCB进一步包含一多层涂层，其系沉积于此基材之此至少一表面上。此多层涂层(i)覆盖此等多个导电轨之至少一部份，及(ii)包含至少一料一卤-烃类聚合物形成之层。此PCB进一步包含至少一电组件，其系借由一焊料接头与至少一导电轨金接，其中，此焊料接头系经由此多层涂层焊接，如此，此焊料接头邻接此多层涂层。
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