公开(公告)号：US07190432B2

公开(公告)日：2007-03-13

申请号：US11249783

申请日：2005-10-13

Applicant: Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

Inventor： Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

IPC: G03B27/32 ,  G03B27/42 ,  G03B27/70 ,  G03B27/54

CPC classification number: G03F7/70425

Abstract: Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.

Abstract translation: 提供了一种在半导体器件制造工艺中使用的晶片曝光装置，该曝光装置包括：用于反射从光源提供的光的反射镜; 用于改变从反射镜提供的光的路径的光路改变器; 首先将镜子安装在光路改换器的两侧，以改变光线的路径; 第二个镜子安装在材料的两侧以改变光线的路径; 和第三反射镜，其安装在掩模的两侧，以将由第一反射镜反射的光进入掩模，并将通过掩模的光进入第二反射镜，由此可以连续地将一个表面，两个表面或一个 在晶片一次对准的状态下晶片的比表面。

公开(公告)号：US20060109444A1

公开(公告)日：2006-05-25

申请号：US11249783

申请日：2005-10-13

Applicant: Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

Inventor： Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

IPC: G03B27/54

CPC classification number: G03F7/70425

Abstract: Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.

Abstract translation: 提供了一种在半导体器件制造工艺中使用的晶片曝光装置，该曝光装置包括：用于反射从光源提供的光的反射镜; 用于改变从反射镜提供的光的路径的光路改变器; 首先将镜子安装在光路改换器的两侧，以改变光线的路径; 第二个镜子安装在材料的两侧以改变光线的路径; 和第三反射镜，其安装在掩模的两侧，以将由第一反射镜反射的光进入掩模，并将通过掩模的光进入第二反射镜，由此可以连续地将一个表面，两个表面或一个 在晶片一次对准的状态下晶片的比表面。