公开(公告)号：US20100130107A1

公开(公告)日：2010-05-27

申请号：US12615216

申请日：2009-11-09

申请人： Alpay Yilmaz ,  Edward Golubovsky ,  Jagan Rangarajan

发明人： Alpay Yilmaz ,  Edward Golubovsky ,  Jagan Rangarajan

IPC分类号： B24B53/02

CPC分类号： B24B53/017

摘要： A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.

摘要翻译： 描述了一种用于调节抛光垫的方法和装置。 该装置包括联接到平台的基座，具有联接到基座的第一端的第一臂构件和第二臂构件，第二臂构件具有可枢转地联接到第一臂构件的第二端的第一端和耦合到第一臂构件的调节盘 第二端与第一端相对。 该方法包括旋转抛光垫，将旋转的调节盘推向抛光垫的抛光表面，并相对于旋转的抛光垫沿直线方向移动调节盘以执行调节处理。

公开(公告)号：US20200234995A1

公开(公告)日：2020-07-23

申请号：US16738798

申请日：2020-01-09

申请人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

发明人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

IPC分类号： H01L21/687 ,  B24B41/06 ,  H01L21/677

摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

公开(公告)号：US07713390B2

公开(公告)日：2010-05-11

申请号：US11131009

申请日：2005-05-16

申请人： Edward Golubovsky

发明人： Edward Golubovsky

IPC分类号： C23C14/00

CPC分类号： H01J37/34 ,  H01J37/3411

摘要： Apparatus for processing a substrate in a physical vapor deposition chamber is provided herein. In one embodiment, apparatus for processing a substrate in a physical vapor deposition chamber having a target disposed in a lid assembly and a grounded chamber wall includes a ground frame and a ground shield. The ground frame is configured to be insulatively coupled to the lid assembly and has an electrically conductive lower surface. The ground shield has an electrically conductive wall that is adjustably and electrically coupled to the conductive lower surface of the ground frame. The ground shield is configured to circumscribe the target and has an upper edge configured to provide a gap between the upper edge and a peripheral edge of the target when installed.

摘要翻译： 本文提供了用于在物理气相沉积室中处理衬底的设备。 在一个实施例中，用于处理具有设置在盖组件中的靶的物理气相沉积室中的衬底和接地室壁的设备包括接地框架和接地屏蔽件。 接地框架被构造成绝缘地联接到盖组件并且具有导电的下表面。 接地屏蔽具有可调节地并且电耦合到接地框架的导电下表面的导电壁。 接地屏蔽被配置为围绕目标并且具有被配置为在安装时在目标的上边缘和周边边缘之间提供间隙的上边缘。

公开(公告)号：US20060254904A1

公开(公告)日：2006-11-16

申请号：US11131009

申请日：2005-05-16

申请人： Edward Golubovsky

发明人： Edward Golubovsky

IPC分类号： C23C14/00

CPC分类号： H01J37/34 ,  H01J37/3411

摘要： Apparatus for processing a substrate in a physical vapor deposition chamber is provided herein. In one embodiment, apparatus for processing a substrate in a physical vapor deposition chamber having a target disposed in a lid assembly and a grounded chamber wall includes a ground frame and a ground shield. The ground frame is configured to be insulatively coupled to the lid assembly and has an electrically conductive lower surface. The ground shield has an electrically conductive wall that is adjustably and electrically coupled to the conductive lower surface of the ground frame. The ground shield is configured to circumscribe the target and has an upper edge configured to provide a gap between the upper edge and a peripheral edge of the target when installed.

摘要翻译： 本文提供了用于在物理气相沉积室中处理衬底的设备。 在一个实施例中，用于处理具有设置在盖组件中的靶的物理气相沉积室中的衬底和接地室壁的设备包括接地框架和接地屏蔽件。 接地框架被构造成绝缘地联接到盖组件并且具有导电的下表面。 接地屏蔽具有可调节地并且电耦合到接地框架的导电下表面的导电壁。 接地屏蔽被配置为围绕目标并且具有被配置为在安装时在目标的上边缘和周边边缘之间提供间隙的上边缘。