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    Field emission backlight unit
    6.
    发明授权
    Field emission backlight unit 失效
    场发射背光单元

    公开(公告)号：US07701127B2

    公开(公告)日：2010-04-20

    申请号：US11485275

    申请日：2006-07-13

    申请人： Byong-Gwon Song ,  Deuk-Seok Chung ,  Ho-Suk Kang ,  Kyoung-Won Min ,  Moon-Jin Shin

    发明人： Byong-Gwon Song ,  Deuk-Seok Chung ,  Ho-Suk Kang ,  Kyoung-Won Min ,  Moon-Jin Shin

    IPC分类号： H01J1/62

    CPC分类号： H01J63/06

    摘要： A field emission backlight unit includes: upper substrate and lower substrate separated from each other and facing each other; an anode formed on a bottom surface of the upper substrate; a phosphor layer formed on a bottom surface of the anode; a plurality of cathodes and gate electrodes alternately formed on a top surface of the lower substrate; and emitters formed on the cathodes; the gate electrodes include first gate electrodes formed of a conductive material on the top surface of the lower substrate and second gate electrodes having a greater thickness than that of the first gate electrodes and formed on a top surface of the first gate electrodes.

    摘要翻译： 场致发射背光单元包括：彼此分离并彼此面对的上基板和下基板; 形成在上基板的底面上的阳极; 形成在所述阳极的底面上的荧光体层; 多个阴极和栅电极交替地形成在下基板的顶表面上; 和形成在阴极上的发射体; 栅电极包括在下基板的顶表面上由导电材料形成的第一栅电极和具有比第一栅电极的厚度大的第二栅电极，并形成在第一栅电极的顶表面上。

    Field emission device (FED) having cathode aperture to improve electron beam focus and its method of manufacture
    7.
    发明授权
    Field emission device (FED) having cathode aperture to improve electron beam focus and its method of manufacture 失效
    具有阴极孔径以改善电子束聚焦的场发射器件（FED）及其制造方法

    公开(公告)号：US07646142B2

    公开(公告)日：2010-01-12

    申请号：US11223031

    申请日：2005-09-12

    申请人： Ho-Suk Kang ,  Jun-Hee Choi ,  Byong-Gwon Song ,  Ha-Jong Kim

    发明人： Ho-Suk Kang ,  Jun-Hee Choi ,  Byong-Gwon Song ,  Ha-Jong Kim

    IPC分类号： H01J19/06 ,  H01J1/14 ,  H01K1/04 ,  H01J1/62

    CPC分类号： H01J3/022 ,  H01J9/025 ,  H01J29/028 ,  H01J29/06 ,  H01J2329/00

    摘要： A Field Emission Device (FED) and its method of manufacture includes: forming a substrate; forming a cathode having a cathode aperture on an upper surface of the substrate; forming a material layer having a first through hole with a smaller diameter than that of the cathode aperture on an upper surface of the cathode; forming a first insulator having a first cavity on an upper surface of the material layer; forming a gate electrode having a second through hole on an upper surface of the first insulator; and forming an emitter in a central portion of the cathode aperture.

    摘要翻译： 现场发射装置（FED）及其制造方法包括：形成基板; 在所述基板的上表面上形成具有阴极孔的阴极; 在所述阴极的上表面上形成具有比所述阴极孔径小的直径的第一通孔的材料层; 形成在所述材料层的上表面上具有第一空腔的第一绝缘体; 在所述第一绝缘体的上表面上形成具有第二通孔的栅电极; 并在阴极孔的中心部分形成发射极。

    Method of manufacturing field emission device
    8.
    发明授权
    Method of manufacturing field emission device 失效
    场致发射装置的制造方法

    公开(公告)号：US07517710B2

    公开(公告)日：2009-04-14

    申请号：US11604731

    申请日：2006-11-28

    申请人： Jun-Hee Choi ,  Ho-Suk Kang ,  Chan-Wook Baik ,  Ha-Jong Kim

    发明人： Jun-Hee Choi ,  Ho-Suk Kang ,  Chan-Wook Baik ,  Ha-Jong Kim

    IPC分类号： H01L21/00 ,  H01L29/06

    CPC分类号： H01J9/025 ,  H01J3/021

    摘要： A method of manufacturing a field emission device (FED), which reduces the number of photomask patterning processes and improves the manufacturing yield of the FED, is provided. The method includes steps of sequentially forming a cathode layer, a first insulating layer, and a gate layer on a substrate, forming a protection layer on the gate electrode layer, etching portions of the protection layer and gate electrode to form a plurality of first opening holes where portions of the first insulating layer being exposed through the first opening holes, forming a second insulating layer on the protection layer and on the first opening holes, forming a focus electrode layer on the second insulating layer, forming a photoresist layer on the focus electrode layer, etching a portion of the photoresist layer and a portion of the focus electrode layer to form a second opening hole where a portion of the second insulating layer being exposed through the second opening hole, and forming emitter holes exposing a portion of the cathode layer by etching the exposed surface of the second insulating layer to a bottom surface of the first insulating layer. After removing the photoresist layer electron emission emitters are formed on the cathode layer.

    摘要翻译： 提供了一种制造场致发射器件（FED）的方法，其减少了光掩模图案化工艺的数量并提高了FED的制造成品率。 该方法包括以下步骤：在衬底上依次形成阴极层，第一绝缘层和栅极层，在栅电极层上形成保护层，蚀刻保护层和栅电极的部分，以形成多个第一开口 第一绝缘层的部分通过第一开孔露出的孔，在保护层和第一开孔上形成第二绝缘层，在第二绝缘层上形成聚焦电极层，在焦点上形成光致抗蚀剂层 蚀刻光致抗蚀剂层的一部分和聚焦电极层的一部分以形成第二开孔，其中第二绝缘层的一部分通过第二开孔暴露，并且形成暴露阴极的一部分的发射极 通过将第二绝缘层的暴露表面蚀刻到第一绝缘层的底表面。 在除去光致抗蚀剂层之后，在阴极层上形成电子发射发射体。

    Method of fabricating field emission array type light emitting unit
    9.
    发明申请
    Method of fabricating field emission array type light emitting unit 有权
    场致发射阵列型发光单元的制造方法

    公开(公告)号：US20080102547A1

    公开(公告)日：2008-05-01

    申请号：US11907942

    申请日：2007-10-18

    申请人： Sun-il Kim ,  Jun-hee Choi ,  Byong-gwon Song ,  Shang-hyeun Park ,  Ho-suk Kang ,  Deuk-seok Chung ,  Chan-wook Baik

    发明人： Sun-il Kim ,  Jun-hee Choi ,  Byong-gwon Song ,  Shang-hyeun Park ,  Ho-suk Kang ,  Deuk-seok Chung ,  Chan-wook Baik

    IPC分类号： H01L33/00

    CPC分类号： H01J63/02 ,  G02F2001/133625 ,  H01J9/247

    摘要： A method of fabricating a field emission array type light emitting unit that includes a rear substrate including a plurality of cathodes and a plurality of carbon nanotube emitters on a front side, a front substrate including a plurality of anodes and a phosphor layer on a rear side, wherein the rear substrate and the front substrate are arranged at a distance apart from each other and a plurality of spacers are arranged between the rear substrate and the front substrate, the plurality of spacers being adapted to maintain constant the distance, the method includes producing a diffusion pattern by wet etching a front side of the front substrate.

    摘要翻译： 一种制造场发射阵列型发光单元的方法，该发光阵列型发光单元包括：前表面上包括多个阴极和多个碳纳米管发射体的后基板，包括多个阳极的前基板和背面的荧光体层 其特征在于，所述后基板和所述前基板被配置成彼此间隔开，并且在所述后基板与所述前基板之间配置有多个间隔件，所述多个间隔件适于保持距离恒定，所述方法包括： 通过湿法蚀刻前基板的前侧的扩散图案。