公开(公告)号：US5825054A

公开(公告)日：1998-10-20

申请号：US581246

申请日：1995-12-29

申请人： Biing-Jye Lee ,  Horng-Nign Chen ,  Jung-Tsung Hsu

发明人： Biing-Jye Lee ,  Horng-Nign Chen ,  Jung-Tsung Hsu

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64 ,  H01S5/00 ,  H01S5/022 ,  H01L33/00

CPC分类号： H01L33/483 ,  H01L33/58 ,  H01L33/642 ,  H01S5/02244 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01S5/0222 ,  H01S5/02228 ,  H01S5/02288

摘要： A plastic-molded apparatus for a semiconductor laser is disclosed, which comprise: a first lead having a broad end thereof serving as a mounting plate; a second lead located at one side of the first lead; a third lead located at other side of the first lead; a submount, disposed on a front end of the mounting plate, having a semiconductor laser chip disposed thereon, electrically connected to the second lead, and a monitor detector disposed on the mounting plate closely adjacent to the submount, electrically connected to the third lead, for receiving backward light from the semiconductor laser chip; a plastic-molded header to fix the first lead, the second lead and the third lead; and a transparent cap, adapted to the plastic-molded header, for sealing all components including the laser chip, the monitor detector and peripheral parts on the plastic-molded header.

摘要翻译： 公开了一种用于半导体激光器的塑料成型装置，其包括：具有其宽端作为安装板的第一引线; 位于第一引线一侧的第二引线; 第三个引线位于第一引线的另一侧; 设置在安装板的前端上的基座，其上设置有与第二引线电连接的半导体激光器芯片，以及监视器检测器，与第二引线紧密相邻的安装板设置， 用于从半导体激光芯片接收反向光; 用于固定第一引线，第二引线和第三引线的塑料模制接头; 以及适用于塑料模制头部的透明盖，用于密封包括激光芯片，监视器检测器和塑料模制头部上的周边部件的所有部件。