POROUS POLYIMIDE FILM, AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20250051520A1

    公开(公告)日:2025-02-13

    申请号:US18723187

    申请日:2022-12-21

    Abstract: A porous polyimide film is obtained from a poly(amic acid) solution containing (a) a poly(amic acid), (b) an organic polar solvent that is a good solvent for the poly(amic acid), and (c) a hydrophobic solvent that is a poor solvent for the poly(amic acid). The poly(amic acid) is obtained by polymerizing an aromatic tetracarboxylic dianhydride containing at least pyromellitic dianhydride and an aromatic diamine containing at least 4,4′-diaminodiphenyl ether. The hydrophobic solvent dissolves in the organic polar solvent, evaporates less readily than the organic polar solvent at the same temperature and pressure, and has a log P in the range of 4.00 or more and 6.00 or less. A method of producing a porous polyimide film includes obtaining a porous polyimide film by drying and then baking a poly(amic acid) solution.

    Two-stage cure polyimide oligomers

    公开(公告)号:US10125224B2

    公开(公告)日:2018-11-13

    申请号:US15461957

    申请日:2017-03-17

    Abstract: A method for using citraconic anhydride and itaconic anhydride as addition cure end caps in reactions for forming polyamic acid oligomers and polyimide oligomers, is provided. Prepregs and high temperature adhesives made from the resulting oligomers, as well as, high temperature, low void volume composites made from the prepregs, are also provided.

    POLYIMIDE FIBRE AND METHOD FOR PRODUCING POLYIMIDE FIBRE

    公开(公告)号:US20170283990A1

    公开(公告)日:2017-10-05

    申请号:US15425249

    申请日:2017-02-06

    Abstract: The method for producing a polyimide fiber includes a coagulation step of forming a polyimide precursor fiber by extruding a polyimide precursor solution containing a polyimide precursor and a compound having an acid dissociation constant (pKa) of a conjugate acid in water at 25° C. of 6.0 to 10 inclusive and an octanol-water partition coefficient (Log P) at 25° C. of −0.75 to 0.75 inclusive into a poor solvent or nonsolvent for the polyimide precursor; and a heat drawing step of forming the polyimide fiber by drawing the polyimide precursor fiber while heating same. The polyimide fiber of the present disclosure has a physical property such that the coefficient of thermal expansion thereof is in the range of −15 ppm/K to 0 ppm/K inclusive.

    POLYIMIDE FILM
    8.
    发明申请
    POLYIMIDE FILM 审中-公开

    公开(公告)号:US20200283625A1

    公开(公告)日:2020-09-10

    申请号:US16496823

    申请日:2018-03-26

    Abstract: The present invention provides a colorless and transparent polyimide film which exhibits excellent heat resistance, transparency and strength equivalent to those of the conventional colorless and transparent polyimide film, can be produced at a lower cost than the conventional polyimide film, and is more resistant to methyl ethyl ketone than the conventional polyimide film. The colorless and transparent polyimide film of the present invention is made from a specific polyimide resin. The specific polyimide resins comprise a site derived from BPDA, at least one site selected from the group comprising a site derived from BPADA and a site derived from ODPA, a site derived from TFMB, and at least one site selected from the group comprising a site derived from 3,3′-DDS and a site derived from 4,4′-DDS. The haze value of the polyimide film is in the range of 0.1 or more and 2.0 or less.

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