公开(公告)号：US20080261415A1

公开(公告)日：2008-10-23

申请号：US12062580

申请日：2008-04-04

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09281 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Abstract translation: 电连接板包括在一个面上的电连接端子，其具有与半导体部件连接的视图和分别连接到这些端子的电连接轨道。 端子布置成具有两个正交方向的正方形矩阵。 在其表面上，板包括多个相同的相邻连接组，每个组具有N个相邻的端子和沿着该方向放置的N个磁道，同时向矩阵的边缘延伸。 组的端子相对于相邻组的端子偏移一个间距。 板和半导体部件通过电连接球连接在一起。

公开(公告)号：US08013253B2

公开(公告)日：2011-09-06

申请号：US12062580

申请日：2008-04-04

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09281 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Abstract translation: 电连接板包括在一个面上的电连接端子，其具有与半导体部件连接的视图和分别连接到这些端子的电连接轨道。 端子布置成具有两个正交方向的正方形矩阵。 在其表面上，板包括多个相同的相邻连接组，每个组具有N个相邻的端子和沿着该方向放置的N个磁道，同时向矩阵的边缘延伸。 组的端子相对于相邻组的端子偏移一个间距。 板和半导体部件通过电连接球连接在一起。

公开(公告)号：US07888791B2

公开(公告)日：2011-02-15

申请号：US12543873

申请日：2009-08-19

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H01L23/053 ,  H01L23/48

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/114 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.

Abstract translation: 提供一种用于电连接集成电路芯片的装置。 该装置包括主板，中间板和分隔板的空间中的电连接球。 在该空间中，周边区域包括球的外围矩阵，中心区域包括球的中心矩阵，第一次级区域包括连接到外围矩阵的两个相邻行球的球的电连接通孔矩阵 ，并且第二次级区域包括连接到中心矩阵的球的电连接通孔矩阵。 第一次级区域和第二次级区域由包括至少一个具有至少一个互补排的电连接球的第一部分的中间区隔开，以及具有互补电连接通路的第二部分，该互补电连接通孔连接到该互补排的球 。

公开(公告)号：US07589411B2

公开(公告)日：2009-09-15

申请号：US11305886

申请日：2005-12-16

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/114 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.

Abstract translation: 提供一种用于电连接集成电路芯片的装置。 该装置包括主板，中间板和分隔板的空间中的电连接球。 在该空间中，周边区域包括球的外围矩阵，中心区域包括球的中心矩阵，第一次级区域包括连接到外围矩阵的两个相邻行球的球的电连接通孔矩阵 ，并且第二次级区域包括连接到中心矩阵的球的电连接通孔矩阵。 第一次级区域和第二次级区域由包括至少一个具有至少一个互补排的电连接球的第一部分的中间区隔开，以及具有互补电连接通路的第二部分，该互补电连接通孔连接到该互补排的球 。

公开(公告)号：US20090310319A1

公开(公告)日：2009-12-17

申请号：US12543873

申请日：2009-08-19

Applicant: PIERRE BORMANN ,  Luc Morineau ,  Jacques Chavade

Inventor： PIERRE BORMANN ,  Luc Morineau ,  Jacques Chavade

IPC: H05K7/12

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/114 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.

Abstract translation: 提供一种用于电连接集成电路芯片的装置。 该装置包括主板，中间板和分隔板的空间中的电连接球。 在该空间中，周边区域包括球的外围矩阵，中心区域包括球的中心矩阵，第一次级区域包括连接到外围矩阵的两个相邻行球的球的电连接通孔矩阵 ，并且第二次级区域包括连接到中心矩阵的球的电连接通孔矩阵。 第一次级区域和第二次级区域由包括至少一个具有至少一个互补排的电连接球的第一部分的中间区隔开，以及具有互补电连接通路的第二部分，该互补电连接通孔连接到该互补排的球 。

公开(公告)号：US20060138636A1

公开(公告)日：2006-06-29

申请号：US11305886

申请日：2005-12-16

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H01L23/52

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/114 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.