公开(公告)号：US5305523A

公开(公告)日：1994-04-26

申请号：US996445

申请日：1992-12-24

Applicant: Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  James A. McDonald ,  Donald E. Myers ,  Joseph D. Peruffo ,  Thomas J. Walsh ,  Thomas J. Walsh, III

Inventor： Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  James A. McDonald ,  Donald E. Myers ,  Joseph D. Peruffo ,  Thomas J. Walsh ,  Thomas J. Walsh, III

IPC: H01L23/12 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/04 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K3/30

CPC classification number: H01L21/4839 ,  H05K1/16 ,  H05K3/4046 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/10416 ,  H05K2203/033 ,  H05K3/403 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.

Abstract translation: 提供一种用于在冲压操作期间在诸如计算机部件的多层结构中形成一个或多个电导体的方法。 将导电片放置成与可变形电介质材料的片材直接接触。 使用冲头从片材形成导电块并同时将块塞转移到电介质材料中。 在传送操作期间，电介质材料的一部分被移位，以便引起芯块和电介质材料之间的机械干涉。

公开(公告)号：US5303862A

公开(公告)日：1994-04-19

申请号：US999440

申请日：1992-12-31

Applicant: Arthur Bross ,  James J. Hedrick ,  Robert D. Johnson ,  Robert O. Lussow ,  James R. Lyerla, Jr. ,  Donald E. Myers ,  Joseph D. Peruffo ,  Krishna G. Sachdev ,  Thomas J. Walsh

Inventor： Arthur Bross ,  James J. Hedrick ,  Robert D. Johnson ,  Robert O. Lussow ,  James R. Lyerla, Jr. ,  Donald E. Myers ,  Joseph D. Peruffo ,  Krishna G. Sachdev ,  Thomas J. Walsh

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L25/065 ,  H05K3/28 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L25/0657 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/29 ,  H01L24/83 ,  H05K3/4617 ,  H01L2224/16237 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/1105 ,  H05K3/28 ,  H05K3/305 ,  H05K3/4046

Abstract: A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).

Abstract translation: 单步电/机械连接工艺利用图案化在衬底（1或21）上的粘合剂层（3或26）来机械连接多层结构（28）中的相邻衬底或将销（2）组件连接到 设备（5）。 在优选实施例中，粘合剂层（3或26）和基底（1或21）由在热和压力下进行酯交换的材料制成，以在它们之间产生非常强的粘结。 粘合剂层（3或26）位于针连接器组件或成型/片材（21）中的对准孔（24）内并且不覆盖焊料（4），从而允许粘结冶金以形成正电连接 在多层结构（28）中的销（2）和衬垫（6）和相邻球体（22）之间。