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    Electronic device having a sheathed body and a method of producing the same
    2.
    发明授权
    Electronic device having a sheathed body and a method of producing the same 有权
    具有护套体的电子设备及其制造方法

    公开(公告)号：US6139944A

    公开(公告)日：2000-10-31

    申请号：US139811

    申请日：1998-08-25

    申请人： Kozo Moriyasu ,  Toshiya Oshima ,  Kunisaburo Tomono

    发明人： Kozo Moriyasu ,  Toshiya Oshima ,  Kunisaburo Tomono

    IPC分类号： H01C1/02 ,  H01G4/224 ,  H01L23/29 ,  H01L23/31 ,  H01L41/09 ,  H03H3/02 ,  H03H9/02 ,  H03H9/17 ,  H05K3/28 ,  B32B3/26 ,  B32B3/12

    CPC分类号： H05K3/284 ,  H01L23/293 ,  H01L23/3135 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T29/435 ,  Y10T29/49012 ,  Y10T428/23 ,  Y10T428/234 ,  Y10T428/239

    摘要： An electronic device 1 includes an electronic element 3 having an outer sheath 5 covering at least substantially the entire outer surface of the electronic element. The outer sheath 5 has three layers: a first thermoplastic layer 5a formed on at least substantially the entire outer surface of the electronic element; a thermoplastic resin layer 5a formed on at least substantially the entire outer surface of the first thermosetting layer 5a, and a second thermoplastic resin layer 5b formed on at least substantially the entire outer surface of the thermoplastic layer. The outer sheath is formed by placing an uncured thermosetting resin on the outer surface of the electronic element to form the first thermosetting resin layer placing an uncured thermosetting resin on the outer surface of the first thermosetting resin layer to form the thermoplastic layer and placing an uncured thermosetting resin layer on the thermoplastic layer to form the second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layer and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.

    摘要翻译： 电子设备1包括电子元件3，电子元件3具有至少基本上覆盖电子元件的整个外表面的外护套5。 外护套5具有三层：在电子元件的至少基本上整个外表面上形成的第一热塑性层5a; 形成在第一热固性层5a的至少基本上整个外表面上的热塑性树脂层5a和形成在热塑性层的至少基本上整个外表面上的第二热塑性树脂层5b。 通过将未固化的热固性树脂放置在电子元件的外表面上形成外护套，以形成第一热固性树脂层，将未固化的热固性树脂放置在第一热固性树脂层的外表面上以形成热塑性层并将未固化的 热塑性树脂层，形成第二热固性树脂层。 然后加热所有三个层，以固化第一和第二热固性树脂层，并使热塑性层熔化并形成随后固化的无孔层。