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公开(公告)号：US08444043B1
公开(公告)日：2013-05-21
申请号：US13362228
申请日：2012-01-31
Applicant: William E. Bernier , Marcus E. Interrante , Rajneesh Kumar , Chenzhou Lian , Janak G. Patel , Peter Slota, Jr.
Inventor： William E. Bernier , Marcus E. Interrante , Rajneesh Kumar , Chenzhou Lian , Janak G. Patel , Peter Slota, Jr.
CPC classification number: H01L23/49816 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0623 , B23K2101/42 , H01L23/13 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L2224/13111 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75101 , H01L2224/75252 , H01L2224/755 , H01L2224/75501 , H01L2224/81005 , H01L2224/81191 , H01L2224/81192 , H01L2224/81204 , H01L2224/81815 , H01L2225/06513 , H01L2924/10253 , H01L2924/1305 , H01L2924/15787 , H01L2924/351 , H01L2924/3511 , H01L2924/01047 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.
Abstract translation: 一组焊球附着到第一衬底和第二衬底之一的焊盘上。 在相对于第一基板和第二基板中的另一个的焊盘对准焊球的阵列之后，将热质量增加的夹具放置在第二基板的表面上以形成第一基板的组件，第二基板 基板以及它们之间的焊球的阵列，以及热质量增加夹具。 热质量增加夹具与第二基板的周边的至少一个表面物理接触。 热质量增加夹具降低了回流步骤后外围焊球的冷却速率，从而增加了冷却期间外围焊球变形的时间，并降低了冷却后焊锡球上的机械应力 。
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