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    Multi-touch surface stackup arrangement
    2.
    发明授权
    Multi-touch surface stackup arrangement 有权
    多点触控面叠层布置

    公开(公告)号：US08031174B2

    公开(公告)日：2011-10-04

    申请号：US11650003

    申请日：2007-01-03

    Applicant: Mark Arthur Hamblin ,  Richard Hung Minh Dinh

    Inventor： Mark Arthur Hamblin ,  Richard Hung Minh Dinh

    IPC: G09G5/08

    CPC classification number: G06F3/041 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1684

    Abstract: A multi-layer cover for an electronic device having one or more of a sensor panel, a proximity sensor, an ambient light sensor, and a display device can include an outer hardcoat, a structural layer, an IR transmissive ink layer, a mask layer, and a backside hardcoat. The backside hardcoat can reduce cover warpage, enable full surface lamination of the cover to the sensor panel, prevent bubbles from forming in transparent windows in the cover, enable a wider range of functional inks to be applied in various layering orders to allow certain types of light to pass through while blocking others, and hide the sensors to provide a seamless, uncluttered visual appearance.

    Abstract translation: 具有传感器面板，接近传感器，环境光传感器和显示装置中的一个或多个的电子设备的多层盖可以包括外部硬涂层，结构层，IR透射油墨层，掩模层 ，和背面硬涂层。 背面硬涂层可以减少覆盖翘曲，使盖子完全表面层压到传感器面板上，防止在盖子的透明窗口中形成气泡，使得能够以各种分层顺序应用更广泛的功能油墨，以允许某些类型 光线通过，同时阻挡别人，并隐藏传感器，提供无缝，整洁的视觉外观。

    DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING
    4.
    发明申请
    DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING 有权
    双面触摸敏感面板和柔性电路接合

    公开(公告)号：US20110094993A1

    公开(公告)日：2011-04-28

    申请号：US12985239

    申请日：2011-01-05

    Applicant: Mark Arthur HAMBLIN ,  Steve Porter Hotelling

    Inventor： Mark Arthur HAMBLIN ,  Steve Porter Hotelling

    IPC: C03C15/00

    CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

    Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

    Abstract translation: 可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。 可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。 可以制造单个柔性电路以连接到直接相对侧上的行和列。 柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。 此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。 此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。

    Touch screen stack-up processing
    7.
    发明申请
    Touch screen stack-up processing 审中-公开
    触摸屏叠加处理

    公开(公告)号：US20080165139A1

    公开(公告)日：2008-07-10

    申请号：US11818335

    申请日：2007-06-13

    Applicant: Steve Porter Hotelling ,  Brian Richards Land ,  Mark Arthur Hamblin

    Inventor： Steve Porter Hotelling ,  Brian Richards Land ,  Mark Arthur Hamblin

    IPC: G06F3/041

    CPC classification number: G06F3/0414 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04101 ,  G06F2203/04104 ,  G06F2203/04105 ,  G06F2203/04111 ,  G09G3/36

    Abstract: A multi-touch sensor panel is disclosed that can be produced by forming a plurality of first traces of substantially transparent conductive material on a first substrate, forming a plurality of second traces of the substantially transparent material, and creating a fluid-tight gap between the plurality of first traces and the plurality of second traces. The fluid-tight gap can then be filled with a fluid having substantially no bubbles and an optical index similar to the optical index of the first and second traces to make the gap and the first and second traces substantially transparent. The second and first traces can be oriented to cross over each other at crossover locations separated by the fluid, the crossover locations forming mutual capacitance sensors for detecting touches.

    Abstract translation: 公开了一种多触摸传感器面板，其可以通过在第一基板上形成多个基本上透明的导电材料的第一迹线而形成，形成多个基本上透明的材料的第二迹线，并且在第一基板之间产生流体密封的间隙 多个第一迹线和多个第二迹线。 然后可以用基本上没有气泡的流体和类似于第一和第二迹线的光学折射率的光学折射来填充流体密封的间隙，以使间隙和第一和第二迹线基本上是透明的。 第二和第一迹线可以被定向成在由流体分开的交叉位置处彼此交叉，交叉位置形成用于检测触摸的互电容传感器。

    Multi-touch surface stackup arrangement
    8.
    发明申请
    Multi-touch surface stackup arrangement 有权
    多点触控面叠层布置

    公开(公告)号：US20080158173A1

    公开(公告)日：2008-07-03

    申请号：US11650003

    申请日：2007-01-03

    Applicant: Mark Arthur Hamblin ,  Richard Hung Minh Dinh

    Inventor： Mark Arthur Hamblin ,  Richard Hung Minh Dinh

    IPC: G06F3/041

    CPC classification number: G06F3/041 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1684

    Abstract: A multi-layer cover for an electronic device having one or more of a sensor panel, a proximity sensor, an ambient light sensor, and a display device can include an outer hardcoat, a structural layer, an IR transmissive ink layer, a mask layer, and a backside hardcoat. The backside hardcoat can reduce cover warpage, enable full surface lamination of the cover to the sensor panel, prevent bubbles from forming in transparent windows in the cover, enable a wider range of functional inks to be applied in various layering orders to allow certain types of light to pass through while blocking others, and hide the sensors to provide a seamless, uncluttered visual appearance.

    Abstract translation: 具有传感器面板，接近传感器，环境光传感器和显示装置中的一个或多个的电子设备的多层盖可以包括外部硬涂层，结构层，IR透射油墨层，掩模层 ，和背面硬涂层。 背面硬涂层可以减少覆盖翘曲，使盖子完全表面层压到传感器面板上，防止在盖子的透明窗口中形成气泡，使得能够以各种分层顺序应用更广泛的功能油墨，以允许某些类型 光线通过，同时阻挡别人，并隐藏传感器，提供无缝，整洁的视觉外观。

    Double-sided touch sensitive panel and flex circuit bonding
    9.
    发明授权
    Double-sided touch sensitive panel and flex circuit bonding 有权
    双面触摸屏和柔性电路接合

    公开(公告)号：US08446386B2

    公开(公告)日：2013-05-21

    申请号：US13235321

    申请日：2011-09-16

    Applicant: Mark Arthur Hamblin ,  Steve Porter Hotelling

    Inventor： Mark Arthur Hamblin ,  Steve Porter Hotelling

    IPC: G09G5/00

    CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

    Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

    Abstract translation: 可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。 可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。 可以制造单个柔性电路以连接到直接相对侧上的行和列。 柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。 此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。 此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。

    DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING
    10.
    发明申请
    DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING 有权
    双面触摸敏感面板和柔性电路接合

    公开(公告)号：US20120004012A1

    公开(公告)日：2012-01-05

    申请号：US13235321

    申请日：2011-09-16

    Applicant: Mark Arthur HAMBLIN ,  Steve Porter HOTELLING

    Inventor： Mark Arthur HAMBLIN ,  Steve Porter HOTELLING

    IPC: H04W88/02 ,  H05K3/00 ,  G06F3/045

    CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

    Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

    Abstract translation: 可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。 可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。 可以制造单个柔性电路以连接到直接相对侧上的行和列。 柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。 此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。 此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。

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