System for analyzing a failure in a semiconductor wafer by calculating
correlation coefficient between collated data of defects per prescribed
unit and failures per prescribed unit
    1.
    发明授权
    System for analyzing a failure in a semiconductor wafer by calculating correlation coefficient between collated data of defects per prescribed unit and failures per prescribed unit 有权
    用于通过计算每个规定单位的缺陷的整理数据与每个规定单位的故障之间的相关系数来分析半导体晶片中的故障的系统

    公开(公告)号:US6009545A

    公开(公告)日:1999-12-28

    申请号:US182526

    申请日:1998-10-30

    摘要: Data containing defect position coordinates obtained based on the result of physical inspection of foreign material, a defect or the like at the surface of a semiconductor wafer by a defect inspecting apparatus is stored. Also stored is data of physical coordinates obtained based on fail bit data from a tester. Data indicating an additional failure region is produced by an additional failure region estimating apparatus based on the fail bit data, and is stored. Collation produces data of corrected physical position coordinates by adding the stored data of limitation by failure mode to the stored data of physical position coordinates, and collates the data of corrected physical position coordinates with stored data of defect position coordinates. Accordingly, accuracy in collation is improved, and failure can be analyzed even if caused not by a defect located at an address of the failure obtained by the fail bit data but by a defect relating to the defect located at the address of a failure.

    摘要翻译: 存储包含基于异物的物理检查结果,缺陷检查装置在半导体晶片的表面处的缺陷等的缺陷位置坐标的数据。 还存储了基于来自测试器的故障位数据获得的物理坐标的数据。 指示附加故障区域的数据由基于故障位数据的附加故障区域估计装置产生,并被存储。 通过将存储的故障模式的限制数据与所存储的物理位置坐标的数据相加,校正生成校正的物理位置坐标的数据,并且将校正的物理位置坐标的数据与存储的缺陷位置坐标的数据进行比较。 因此,排序的精度提高,即使不是由故障位数据所获得的故障的地址而是由于位于故障地址处的缺陷引起的缺陷引起的故障也可以被分析。

    Failure analyzer
    2.
    发明授权
    Failure analyzer 失效
    故障分析仪

    公开(公告)号:US5905650A

    公开(公告)日:1999-05-18

    申请号:US931505

    申请日:1997-09-16

    摘要: Failures detected by a tester are collated with defects detected by a defect checking device (Step S6). The collation is performed by retrieving defects coincident with each failure within a tolerance R0. Based on a mean value of displacements between the failures and the defects which are coincident with each other, coordinate values of the defects are corrected (Step S10). The coordinate values are corrected only when a collating ratio S that is a ratio of failures with which defects are coincident to whole failures exceeds a constant value S0 (Step S7). As a result, a coordinate value of a defect having high precision is obtained.

    摘要翻译: 由检测器检测到的故障与缺陷检查装置检测到的缺陷进行整理(步骤S6)。 通过在公差R0内检索与每个故障相符的缺陷来执行整理。 基于故障之间的位移的平均值和彼此一致的缺陷,修正缺陷的坐标值(步骤S10)。 只有当作为缺陷与故障一致的故障的比率的比较比S超过常数值S0时,才校正坐标值(步骤S7)。 结果,获得了精度高的缺陷的坐标值。

    Apparatus for analyzing a failure in a semiconductor wafer and method
thereof
    3.
    发明授权
    Apparatus for analyzing a failure in a semiconductor wafer and method thereof 失效
    用于分析半导体晶片的故障的装置及其方法

    公开(公告)号:US5844850A

    公开(公告)日:1998-12-01

    申请号:US619396

    申请日:1996-03-21

    摘要: Data containing defect position coordinates obtained based on the result of physical inspection of a foreign material, a defect and the like at a surface of a semiconductor wafer by a defect inspecting apparatus is stored in storage means. Data of physical position coordinates obtained based on fail bit data from a tester is stored in storage means. Data indicating an additional failure region is produced by additional failure region estimating means based on the fail bit data, and is stored in storage means. Collating means produces data of corrected physical position coordinates by adding the data of limitation by failure mode stored in storage means to the data of physical position coordinates stored in storage means, and collates the data of corrected physical position coordinates with data of defect position coordinates stored in storage means. Accordingly, accuracy in collation is improved, and therefore, a failure can be analyzed even if the failure is not caused by a defect located at an address of the failure obtained by the fail bit data but by a defect relating to the defect located at the address of a failure. As a result, accuracy in estimation is improved.

    摘要翻译: 通过缺陷检查装置将基于异物的物理检查结果,缺陷等的缺陷位置坐标数据存储在半导体晶片的表面。 基于来自测试器的故障位数据获得的物理位置坐标的数据被存储在存储装置中。 指示附加故障区域的数据由附加故障区域估计装置基于故障位数据产生,并存储在存储装置中。 整理装置通过将存储在存储装置中的故障模式的限制数据与存储在存储装置中的物理位置坐标的数据相加来产生经校正的物理位置坐标的数据,并将校正的物理位置坐标的数据与存储的缺陷位置坐标数据进行比较 在存储装置中。 因此,排序规则的精度提高,因此,即使故障不是由故障位数据所获得的故障的地址的缺陷引起的,也是由位于 失败的地址 结果,提高了估计精度。

    Method for modifying fibers and modified fibers
    4.
    发明申请
    Method for modifying fibers and modified fibers 审中-公开
    改性纤维和改性纤维的方法

    公开(公告)号:US20060000027A1

    公开(公告)日:2006-01-05

    申请号:US11168403

    申请日:2005-06-29

    IPC分类号: D06M11/00

    CPC分类号: D06M15/09 D06M2200/50

    摘要: A method for modifying fibers comprises steps of adding a crosslinking agent and/or an aqueous resin emulsion to an alkali aqueous solution dissolving therein a cellulose ether having such a low degree of substitution that a molar degree of substitution with an alkyl group and/or a hydroxyalkyl group ranges 0.05 to 1.3, applying the resulting solution to fibers, neutralizing the applied solution with an acid for coagulation, and thermally treating the fibers. Alternatively, the method comprises adding a crosslinking agent and/or an aqueous resin emulsion to an alkali aqueous solution dissolving therein a cellulose ether having such a low degree of substitution that a molar degree of substitution with an alkyl group and/or a hydroxyalkyl group ranges 0.05 to 1.3, applying the resulting solution to fibers, thermally treating the thus applied fibers, and applying an acid to the fibers to neutralize the alkali left on the fibers.

    摘要翻译: 改性纤维的方法包括以下步骤:向溶解有其中具有低取代度的纤维素醚的碱性水溶液中加入交联剂和/或水性树脂乳液,使用烷基和/或 羟基烷基的范围为0.05至1.3,将所得溶液施加到纤维上,用酸凝固所述溶液中和,并热处理纤维。 或者,该方法包括向溶解有其中具有低取代度的纤维素醚的碱性水溶液中加入交联剂和/或水性树脂乳液,使得烷基和/或羟烷基的取代摩尔量范围 0.05至1.3,将所得溶液施加到纤维上,热处理如此施加的纤维,并向纤维施加酸以中和留在纤维上的碱。

    Failure analysis method and device
    5.
    发明授权
    Failure analysis method and device 失效
    故障分析方法和设备

    公开(公告)号:US6016278A

    公开(公告)日:2000-01-18

    申请号:US55905

    申请日:1998-04-07

    CPC分类号: H01L22/20

    摘要: A method comprises steps of: forming a FBM (step S1); generating a second failure map by compressing data of the FBM (step S2); recognizing a failure mode from the second failure map (step S3); selecting a specific failure mode (step S4); and analyzing the specific failure mode by using a part of the corresponding FBM (step S5). This makes a detail analysis possible while suppressing the number of processing data, and thereby achieves a failure analysis method and device improving accuracy and reliability in comparison result.

    摘要翻译: 一种方法包括以下步骤:形成FBM(步骤S1); 通过压缩FBM的数据产生第二故障映射(步骤S2); 识别来自第二故障映射的故障模式(步骤S3); 选择特定的故障模式(步骤S4); 并通过使用对应的FBM的一部分来分析特定故障模式(步骤S5)。 这样可以在抑制处理数据的数量的同时进行细节分析,从而在比较结果中实现故障分析方法和装置提高精度和可靠性。