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1.发明授权Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method 有权激光加工装置，骨整合方法，植入材料和植入材料制造方法公开(公告)号：US09192418B2
公开(公告)日：2015-11-24
申请号：US12438264
申请日：2007-08-21
申请人： Masaru Kanaoka , Taira Ogita , Tooru Murai , Shigeru Tadano , Masahiro Todoh
发明人： Masaru Kanaoka , Taira Ogita , Tooru Murai , Shigeru Tadano , Masahiro Todoh
IPC分类号： A61B18/18 , A61N5/06 , A61C5/02 , A61B17/88 , A61B18/20 , A61C1/00 , A61C8/00 , B23K26/00 , B23K26/32 , B23K26/38 , B23K26/40 , B29C65/16 , B29C65/82 , B29C65/00 , A61F2/46 , A61F2/30 , A61B18/22 , A61F2/00 , A61B18/00 , A61B17/16 , A61B17/00
CPC分类号： A61B17/88 , A61B17/16 , A61B17/164 , A61B18/20 , A61B18/22 , A61B2017/00508 , A61B2018/00565 , A61B2018/00601 , A61B2018/00619 , A61B2018/00636 , A61B2018/00779 , A61C1/0046 , A61C8/0089 , A61F2/30 , A61F2/4601 , A61F2/4644 , A61F2002/0086 , B23K26/0006 , B23K26/32 , B23K26/323 , B23K26/324 , B23K26/354 , B23K26/389 , B23K2103/30 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B29C65/16 , B29C65/1616 , B29C65/1619 , B29C65/1648 , B29C65/1651 , B29C65/8253 , B29C66/0246 , B29C66/1142 , B29C66/12463 , B29C66/41 , B29C66/474 , B29C66/532 , B29C66/7392 , B29C66/7483
摘要： A method of integrating bone and implant material includes drilling a hole in either one of the bone and the implant material through to a junction of the bone and the implant material by applying a laser beam to either one of the bone and the implant material and integrating the bone and the implant material by applying a laser beam to the junction through the hole drilled at the drilling.
摘要翻译： 整合骨骼和植入材料的方法包括通过将激光束施加到骨骼和植入材料中的任何一个并且将整体的骨骼和植入物材料中的任一个施加，从而将骨骼和植入材料中的任一个中的孔钻孔到骨骼和植入材料的接合处 骨和植入材料通过在钻孔中钻出的孔施加激光束到接合处。
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2.发明申请LASER PROCESSING APPARATUS, OSSEOINTEGRATION METHOD, IMPLANT MATERIAL, AND IMPLANT-MATERIAL FABRICATION METHOD 有权激光加工装置，OSECOINTEGRATION方法，植入材料和植物材料制造方法公开(公告)号：US20100049179A1
公开(公告)日：2010-02-25
申请号：US12438264
申请日：2007-08-21
申请人： Masaru Kanaoka , Taira Ogita , Tooru Murai , Shigeru Tadano , Masahiro Todoh
发明人： Masaru Kanaoka , Taira Ogita , Tooru Murai , Shigeru Tadano , Masahiro Todoh
CPC分类号： A61B17/88 , A61B17/16 , A61B17/164 , A61B18/20 , A61B18/22 , A61B2017/00508 , A61B2018/00565 , A61B2018/00601 , A61B2018/00619 , A61B2018/00636 , A61B2018/00779 , A61C1/0046 , A61C8/0089 , A61F2/30 , A61F2/4601 , A61F2/4644 , A61F2002/0086 , B23K26/0006 , B23K26/32 , B23K26/323 , B23K26/324 , B23K26/354 , B23K26/389 , B23K2103/30 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B29C65/16 , B29C65/1616 , B29C65/1619 , B29C65/1648 , B29C65/1651 , B29C65/8253 , B29C66/0246 , B29C66/1142 , B29C66/12463 , B29C66/41 , B29C66/474 , B29C66/532 , B29C66/7392 , B29C66/7483
摘要： A method of integrating bone and implant material includes drilling a hole in either one of the bone and the implant material through to a junction of the bone and the implant material by applying a laser beam to either one of the bone and the implant material and integrating the bone and the implant material by applying a laser beam to the junction through the hole drilled at the drilling.
摘要翻译： 整合骨骼和植入材料的方法包括通过将激光束施加到骨骼和植入材料中的任何一个并且将整体的骨骼和植入物材料中的任一个施加，从而将骨骼和植入材料中的任一个中的孔钻孔到骨骼和植入材料的接合处 骨和植入材料通过在钻孔中钻出的孔施加激光束到接合处。
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