公开(公告)号：US6063245A

公开(公告)日：2000-05-16

申请号：US989246

申请日：1997-12-12

申请人： Peter Frach ,  Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Friedel Haese ,  Dieter W. Meyer ,  Manfred Muller ,  Harald Strecker

发明人： Peter Frach ,  Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Friedel Haese ,  Dieter W. Meyer ,  Manfred Muller ,  Harald Strecker

IPC分类号： C23C14/00 ,  C23C14/06 ,  C23C14/35 ,  C23C14/34

CPC分类号： C23C14/352 ,  C23C14/0036 ,  C23C14/0605

摘要： A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive atmosphere with a pulsed energy feed. During a pattern period of the pulses all targets (magnetrons) are once switched on as an anode and at least one target is switched as an anode at all times Various embodiments include detection and limitation of the "microarcs"; executing of regeneration processes according to fixed predetermined time intervals for at least 5 seconds. In one embodiment a microarc is detected on a magnetron and if a next pulse-off time is more than a selected time period away, then the magnetron is connected to a positive pole of the power supply. In another embodiment of the invention a pulsed negative voltage is applied to a substrate being sputtered by connecting the substrate to a negative pole of a pulsed power supply having a positive pole connected to a positive pole of a power supply for a magnetron. In another embodiment of the invention there is an electrode insulated from an installation mass which is connected to at least one positive pole of a power supply during the periodic pausing sputtering of substrates for regeneration.

摘要翻译： 描述了使用反应性磁控溅射应用碳层的方法和装置。 该方法包括在反应性气氛中用脉冲能量进料溅射由碳制成的至少两个靶。 在脉冲的图案周期期间，所有目标（磁控管）一次作为阳极接通，并且至少一个目标始终作为阳极切换。各种实施例包括检测和限制“微型”; 根据固定的预定时间间隔执行至少5秒的再生处理。 在一个实施例中，在磁控管上检测到微弧，并且如果下一个脉冲关闭时间大于所选择的时间段，则磁控管连接到电源的正极。 在本发明的另一个实施例中，通过将衬底连接到具有连接到用于磁控管的电源的正极的正极的脉冲电源的负极来将脉冲负电压施加到正在溅射的衬底上。 在本发明的另一个实施例中，存在与在用于再生的衬底的周期性暂停溅射期间连接到电源的至少一个正极的安装质量绝缘的电极。

公开(公告)号：US6019876A

公开(公告)日：2000-02-01

申请号：US80088

申请日：1998-05-15

申请人： Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Artur Lang ,  Dieter Meyer ,  Manfred Muller ,  Hans-Herrmann Schneider ,  Rainer C. Schneider

发明人： Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Artur Lang ,  Dieter Meyer ,  Manfred Muller ,  Hans-Herrmann Schneider ,  Rainer C. Schneider

IPC分类号： C23C14/32 ,  G11B5/84 ,  G11B5/85 ,  G11B5/851

CPC分类号： G11B5/851 ,  G11B5/8404

摘要： A method and apparatus for depositing an underlayer and/or a magnetic thin film layer on a data storage disk are described. The sputtering power is supplied in the form of pulses during the application of the underlayer and/or magnetic storage to periodically ignite the plasma and increase the charge-carrier density in the sputtering chamber. The repetition frequency and parameters for the pulses and pauses between pulses are adjusted to achieve a desired nominal value for the coercive field strength of the magnetic layer. Preferably the repetition frequency of the power switching is from 10 to 80 kHz and the ratio of pulse length to pulse pause is within 5:1 to 1:5.

摘要翻译： 描述了用于在数据存储盘上沉积底层和/或磁性薄膜层的方法和装置。 在施加底层和/或磁性存储器期间以脉冲的形式提供溅射功率以周期性地点燃等离子体并且增加溅射室中的电荷 - 载流子密度。 脉冲之间的脉冲和重复频率的重复频率和参数被调整以达到磁层的矫顽磁场强度的期望标称值。 优选地，功率切换的重复频率为10至80kHz，并且脉冲长度与脉冲暂停的比率在5:1至1:5之间。