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    Magnetron sputtering method and apparatus utilizing a pulsed energy pattern
    1.
    发明授权
    Magnetron sputtering method and apparatus utilizing a pulsed energy pattern 失效
    使用脉冲能量图案的磁控管溅射方法和装置

    公开(公告)号：US6063245A

    公开(公告)日：2000-05-16

    申请号：US989246

    申请日：1997-12-12

    申请人： Peter Frach ,  Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Friedel Haese ,  Dieter W. Meyer ,  Manfred Muller ,  Harald Strecker

    发明人： Peter Frach ,  Klaus Goedicke ,  Michael Junghahnel ,  Torsten Winkler ,  Friedel Haese ,  Dieter W. Meyer ,  Manfred Muller ,  Harald Strecker

    IPC分类号： C23C14/00 ,  C23C14/06 ,  C23C14/35 ,  C23C14/34

    CPC分类号： C23C14/352 ,  C23C14/0036 ,  C23C14/0605

    摘要： A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive atmosphere with a pulsed energy feed. During a pattern period of the pulses all targets (magnetrons) are once switched on as an anode and at least one target is switched as an anode at all times Various embodiments include detection and limitation of the "microarcs"; executing of regeneration processes according to fixed predetermined time intervals for at least 5 seconds. In one embodiment a microarc is detected on a magnetron and if a next pulse-off time is more than a selected time period away, then the magnetron is connected to a positive pole of the power supply. In another embodiment of the invention a pulsed negative voltage is applied to a substrate being sputtered by connecting the substrate to a negative pole of a pulsed power supply having a positive pole connected to a positive pole of a power supply for a magnetron. In another embodiment of the invention there is an electrode insulated from an installation mass which is connected to at least one positive pole of a power supply during the periodic pausing sputtering of substrates for regeneration.

    摘要翻译： 描述了使用反应性磁控溅射应用碳层的方法和装置。 该方法包括在反应性气氛中用脉冲能量进料溅射由碳制成的至少两个靶。 在脉冲的图案周期期间，所有目标（磁控管）一次作为阳极接通，并且至少一个目标始终作为阳极切换。各种实施例包括检测和限制“微型”; 根据固定的预定时间间隔执行至少5秒的再生处理。 在一个实施例中，在磁控管上检测到微弧，并且如果下一个脉冲关闭时间大于所选择的时间段，则磁控管连接到电源的正极。 在本发明的另一个实施例中，通过将衬底连接到具有连接到用于磁控管的电源的正极的正极的脉冲电源的负极来将脉冲负电压施加到正在溅射的衬底上。 在本发明的另一个实施例中，存在与在用于再生的衬底的周期性暂停溅射期间连接到电源的至少一个正极的安装质量绝缘的电极。

    Process and circuit for the bipolar pulse-shaped feeding of energy into low-pressure plasmas
    3.
    发明授权
    Process and circuit for the bipolar pulse-shaped feeding of energy into low-pressure plasmas 失效
    将双极脉冲形式的能量馈入低压等离子体的过程和电路

    公开(公告)号：US06005218A

    公开(公告)日：1999-12-21

    申请号：US836030

    申请日：1997-08-11

    申请人： Hendrik Walde ,  Jonathan Reschke ,  Klaus Goedicke ,  Torsten Winkler ,  Volker Kirchhoff ,  Peter Frach

    发明人： Hendrik Walde ,  Jonathan Reschke ,  Klaus Goedicke ,  Torsten Winkler ,  Volker Kirchhoff ,  Peter Frach

    IPC分类号： H01J37/32 ,  H05H1/46 ,  B23K10/00

    CPC分类号： H01J37/32018 ,  H01J37/32027 ,  H01J37/32064 ,  H05H1/46

    摘要： A process and circuit for the bipolar pulse-shaped feeding of energy into low-pressure plasmas is provided. Within an average time period, a power which is to be as high as possible is to be fed into the low pressure discharge. In each polarization, the same power is to be fed although the impedance differs considerably. In a system for plasma and surface treatment techniques having at least two electrodes and one power supply, the outputs of at least two potential-free direct current supplies are switched such that an output of one direct current supply is conductively connected with an output of the same polarity of the other direct current supply. By means of a switch which is connected with each feed line to the electrodes and whose other outputs are led in a combined manner to the other outputs of the direct current source, these switches are operated via a timing generator in synchronism with the pole changing frequency. The switches are opened up in the event of the occurrence of an arcing. The process is used for the bipolar pulse sputtering for depositing electrically insulating layers on workpieces. Preferably, such layers are used for a mechanical protection, protection against wear and the improvement of sliding characteristics.

    摘要翻译： PCT No.PCT / DE95 / 01473 Sec。 371日期1997年8月11日 102（e）日期1997年8月11日PCT 1995年10月19日PCT PCT。 WO96 / 13964 PCT出版物 日期：1996年5月9日提供了将能量双极脉冲馈入低压等离子体的工艺和电路。 在平均时间段内，要将尽可能高的功率送入低压放电。 在每个极化中，尽管阻抗明显不同，但仍要输入相同的功率。 在具有至少两个电极和一个电源的等离子体和表面处理技术的系统中，切换至少两个无电势直流电源的输出，使得一个直流电源的输出与 相同极性的另一个直流电源。 通过与每个馈电线连接到电极并且其另外的输出以直流电源的其他输出的方式被引导的开关，这些开关通过与极点变化频率​​同步的定时发生器来操作 。 发生电弧时，开关被打开。 该工艺用于双极脉冲溅射，用于在工件上沉积电绝缘层。 优选地，这些层用于机械保护，防止磨损和改善滑动特性。

    Thin film disk with barrier layer
    6.
    发明授权
    Thin film disk with barrier layer 失效
    具有阻隔层的薄膜盘

    公开(公告)号：US06436248B1

    公开(公告)日：2002-08-20

    申请号：US09434590

    申请日：1999-11-05

    申请人： Heinz Baur ,  Ralf Bluethner ,  Hans Buchberger ,  Klaus Goedicke ,  Michael Junghaehnel ,  Karl-Heinz Lehnert ,  Manfred Mueller ,  Hans-Herrman Schneider ,  Torsten Winkler

    发明人： Heinz Baur ,  Ralf Bluethner ,  Hans Buchberger ,  Klaus Goedicke ,  Michael Junghaehnel ,  Karl-Heinz Lehnert ,  Manfred Mueller ,  Hans-Herrman Schneider ,  Torsten Winkler

    IPC分类号： C23C1434

    CPC分类号： G11B5/7325 ,  C23C14/165 ,  C23C14/34

    摘要： A method of coating of thin film coated magnetic disks and thin film magnetic disks made thereby is described. In accordance with the invention, a barrier layer is deposited on the substrate before the underlayer film(s) to increase the corrosion resistance of metallic substrate magnetic disks and, in the case of nonmetallic substrates, to reduce the diffusion of water to the substrate and of freely moveable ions from the substrate. Preferably the barrier layer is deposited by medium frequency pulsed sputtering at a frequency of 10 to 200 kHz and a pulse length to pulse pause ratio from 5:1 to 1:10. Aluminum or chromium are the preferred materials for the barrier layer. Additional improvements may be achieved where the sputtering process gas contains a proportion of oxygen and/or nitrogen.

    摘要翻译： 描述了由此制成的薄膜涂覆磁盘和薄膜磁盘的涂覆方法。 根据本发明，在下层膜之前在衬底上沉积阻挡层以提高金属基底磁盘的耐腐蚀性，并且在非金属基底的情况下，减少水向衬底的扩散， 可自由移动的离子。 优选地，阻挡层通过中频脉冲溅射以10至200kHz的频率和脉冲长度与脉冲间隔比从5:1沉积到1:10。 铝或铬是阻挡层的优选材料。 当溅射工艺气体含有一部分氧和/或氮时，可以实现另外的改进。

    Process and system for operating magnetron discharges
    7.
    发明授权
    Process and system for operating magnetron discharges 有权
    用于操作磁控管放电的过程和系统

    公开(公告)号：US06340416B1

    公开(公告)日：2002-01-22

    申请号：US09341998

    申请日：1999-07-22

    申请人： Klaus Goedicke ,  Torsten Winkler ,  Michael Junghähnel ,  Fred Fietzke ,  Volker Kirchhoff ,  Jonathan Reschke

    发明人： Klaus Goedicke ,  Torsten Winkler ,  Michael Junghähnel ,  Fred Fietzke ,  Volker Kirchhoff ,  Jonathan Reschke

    IPC分类号： C23C1434

    CPC分类号： H01J37/34

    摘要： Magnetron discharges are pulse-operated to avoid the so-called “arcing”. In the case of magnetron discharges from alternating current-fed magnetrons, the process is limited to the minor power of the energy supply because of the load-carrying capacity of the required electric components. When the magnetron discharges are fed by direct current, their effectiveness deteriorates because of the deposition of layers on the anode surfaces. The new process should enable a high supply power and prevent arcing. In magnetron discharges with at least two magnetron electrodes, the energy is supplied in such a way that at least one magnetron electrode is a cathode or anode and a number n1 of direct current pulses of said polarity is supplied. The poles of at least one magnetron electrode are then reversed and a number n2 of direct currents of this polarity are supplied. The process is carried on in this manner, the frequency of the direct current pulses being higher than that of the polarity reversals. The energy supply effectiveness is thus improved. This process and system enable the production of layers having the most different properties, for example for the glass, packaging, electronic, and machine construction industries.

    摘要翻译： 磁控管放电是脉冲操作的，以避免所谓的“电弧”。 在由交流馈电磁控管放电的磁控管的情况下，由于所需的电气部件的承载能力，该过程被限制在能量供应的次要功率。 当磁控管放电由直流供电时，由于层在阳极表面上的沉积，它们的有效性降低。 新的过程应该能够实现高供电和防止电弧。 在具有至少两个磁控管电极的磁控管放电中，以至少一个磁控管电极为阴极或阳极并且提供所述极性的直流电脉冲数n1的方式提供能量。 然后至少一个磁控管电极的极被反转，并且提供这个极性的直流电的数量n2。 以这种方式进行该过程，直流脉冲的频率高于极性反转的频率。 从而提高能源供应效率。 该方法和系统能够生产具有最不同性质的层，例如用于玻璃，包装，电子和机械制造业。

    Reactive sputtering process
    8.
    发明授权
    Reactive sputtering process 失效
    反应溅射工艺

    公开(公告)号：US6132563A

    公开(公告)日：2000-10-17

    申请号：US894645

    申请日：1997-09-30

    申请人： Peter Frach ,  Hendrik Walde ,  Christian Gottfried ,  Klaus Goedicke

    发明人： Peter Frach ,  Hendrik Walde ,  Christian Gottfried ,  Klaus Goedicke

    IPC分类号： C23C14/00 ,  C23C14/35 ,  C23C14/54 ,  H01J37/34 ,  C23C14/34

    CPC分类号： H01J37/3405 ,  C23C14/0042 ,  C23C14/352 ,  C23C14/54

    摘要： In magnetron-type reactive sputtering the properties of the deposited layer are to remain constant throughout the entire use of a target, independey of the state of erosion, even after an exchange of targets. The method is also to be applicable for magnetron sputtering sources having a target consisting of several components with different partial discharge powers.Before sputtering of the substrates, the magnetic field strength associated with each partial target is set without reactive gas. Thereafter, a predetermined set of values of characteristic parameters is set by control of the reactive gas flow. During the subsequent sputtering the set of values predetermined for each partial target is kept constant by the controllable reactive gas flow. The first two steps are repeated at certain intervals in dependence of time the targets are used.Optical coatings or corrosion protection coatings may be fabricated by reactive sputtering in accordance with this method.

    摘要翻译： PCT No.PCT / DE96 / 00121 Sec。 371日期：1997年9月30日 102（e）1997年9月30日PCT PCT 1996年1月23日PCT公布。 公开号WO96 / 26302 PCT。 日期1996年8月29日在磁控管型反应溅射中，即使在目标交换之后，沉积层的性质也将在目标的整个使用过程中保持不变，独立于侵蚀状态。 该方法也适用于具有由具有不同局部放电功率的多个部件组成的靶的磁控溅射源。 在溅射基板之前，与每个部分目标相关的磁场强度设定为没有反应气体。 此后，通过控制反应气流来设定特定参数值的预定值。 在随后的溅射期间，通过可控的反应气流保持对于每个部分目标预定的一组值。 根据使用目标的时间，以特定的间隔重复前两个步骤。 可以根据该方法通过反应溅射制造光学涂层或防腐蚀涂层。

    Device for applying layers of hard material by dusting
    10.
    发明授权
    Device for applying layers of hard material by dusting 有权
    用于通过除尘施加硬质材料层的装置

    公开(公告)号：US06315877B1

    公开(公告)日：2001-11-13

    申请号：US09485713

    申请日：2000-03-01

    申请人： Klaus Goedicke ,  Fred Fietzke

    发明人： Klaus Goedicke ,  Fred Fietzke

    IPC分类号： C23C1434

    CPC分类号： C23C14/352 ,  C23C14/505 ,  C23C14/541

    摘要： A device for the sputter application of hard material coatings, including an exhaustible vacuum chamber, at least one sputtering source for depositing a coating material, a plurality of fixtures for supporting a plurality parts to be coated, the fixtures being mounted on planet gears which are movable via a planetary drive, a centrally disposed heating device, a reactive gas inlet, and a plurality of movable screens for covering the at least one sputtering source, the screens being arranged to surround the fixtures, wherein the heating device, the screens, and the planetary drive comprise an assembly which is removable from the vacuum chamber.

    摘要翻译： 用于溅射施加硬质材料涂层的装置，包括可抽真空的真空室，至少一个用于沉积涂层材料的溅射源，用于支撑待涂覆的多个部件的多个固定装置，固定装置安装在行星齿轮上 可通过行星驱动器，中央布置的加热装置，反应气体入口和用于覆盖至少一个溅射源的多个可移动屏幕移动，所述屏幕被布置成围绕固定装置，其中加热装置，屏幕和 行星驱动器包括可从真空室移除的组件。