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    Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
    2.
    发明授权
    Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates 失效
    用于封装的液晶聚合物层和电路化衬底的改善的隐性

    公开(公告)号：US08143530B1

    公开(公告)日：2012-03-27

    申请号：US12884392

    申请日：2010-09-17

    申请人： Rabindra N. Das ,  Michael Rowlands

    发明人： Rabindra N. Das ,  Michael Rowlands

    IPC分类号： H05K1/03

    CPC分类号： B32B37/02 ,  B32B2309/105 ,  B32B2327/18 ,  B32B2457/20 ,  H05K3/3452 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/061

    摘要： A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers.

    摘要翻译： 一种用于制造电子封装的基板及其制造方法，所述电子封装具有铜 - 铜 - 铜（CIC）的核心层，其具有置于CIC两侧的聚四氟乙烯（PTFE）层。 在每个PTFE层的外表面上放置一层蚀刻铜箔。 将一层液晶聚合物（LCP）放置在蚀刻铜箔的两层上。 蚀刻铜箔的外层被放置在LCP层的外表面上。

    Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
    4.
    发明申请
    Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate 失效
    具有内部电阻器的电路化衬底，制造所述电路化衬底的方法以及利用所述电路化衬底的电气组件

    公开(公告)号：US20080087459A1

    公开(公告)日：2008-04-17

    申请号：US11806685

    申请日：2007-06-04

    申请人： Rabindra Das ,  Michael Rowlands

    发明人： Rabindra Das ,  Michael Rowlands

    IPC分类号： H05K1/16 ,  H05K3/10

    CPC分类号： H05K1/095 ,  H05K1/116 ,  H05K1/167 ,  H05K3/429 ,  H05K2203/0568 ,  Y10T29/49165

    摘要： A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.

    摘要翻译： 电路基板，其利用至少一个内部（嵌入式）电阻器作为其一部分，所述电阻器由包括树脂的材料和一定量的纳米颗粒和/或微粒尺寸的粉末构成。 该电阻器用于降低形成的电路中的电容，同时仅稍微增加高频电阻，从而通过显着消除已知存在于这些结构中的一些不连续性来改善电路性能。 还提供电气组件（基板和至少一个电气部件）。

    CONNECTOR
    6.
    发明申请
    CONNECTOR 有权
    连接器

    公开(公告)号：US20160181713A1

    公开(公告)日：2016-06-23

    申请号：US14910352

    申请日：2014-08-07

    申请人： Kirk B. PELOZA ,  Michael ROWLANDS ,  Kent E. REGNIER ,  MOLEX INCORPORATED

    发明人： Kirk B. PELOZA ,  Michael ROWLANDS ,  Kent E. REGNIER

    IPC分类号： H01R12/73 ,  H01R12/72

    CPC分类号： H01R12/737 ,  H01R12/724 ,  H01R12/73

    摘要： A connector includes terminals. The terminals can have a contact that has a loop configuration. In an embodiment the contacts are positioned in a vertical connector similar to an edge card connector but with a differential pair aligned in a vertical direction. Thus the connector can provide edge-coupled differential pair in a high density configuration.

    摘要翻译： 连接器包括端子。 端子可以具有具有回路配置的触点。 在一个实施例中，触头定位在类似于边缘卡连接器的垂直连接器中，但是具有在垂直方向上对准的差动对。 因此，连接器可以提供高密度配置的边缘耦合差分对。