Epitaxial wafer and method of fabricating thereof
    1.
    发明授权
    Epitaxial wafer and method of fabricating thereof 失效
    外延晶片及其制造方法

    公开(公告)号:US5679476A

    公开(公告)日:1997-10-21

    申请号:US671204

    申请日:1996-06-27

    摘要: An epitaxial wafer capable of removing impurities and oxide layers thereon having a high dielectric strength is disclosed. A substrate wafer 1 in which laser-scattering centers have a density of higher than 5.times.10.sup.6 /cm.sup.3 is provided. An epitaxial layer 3 is formed by epitaxial growth on a completely clean surface of the substrate. The surface of the epitaxial layer consists of a non-defect layer which is provided for device active regions. Moreover, a high density of laser-scattering centers are distributed near the interface of the epitaxial layer and the substrate wafer and the interior of the substrate, thus providing for a wafer capable of removing impurities.

    摘要翻译: 公开了能够去除其上具有高介电强度的杂质和氧化物层的外延晶片。 提供激光散射中心的密度高于5×10 6 / cm 3的衬底晶片1。 通过在衬底的完全干净的表面上外延生长形成外延层3。 外延层的表面由为器件活性区域提供的非缺陷层组成。 此外,激光散射中心的高密度分布在外延层和衬底晶片的界面附近以及衬底的内部附近,从而提供能够去除杂质的晶片。