Method and Device for the Thermal Treatment of Substrates
    2.
    发明申请
    Method and Device for the Thermal Treatment of Substrates 有权
    基板热处理方法和装置

    公开(公告)号:US20080217319A1

    公开(公告)日:2008-09-11

    申请号:US11573012

    申请日:2005-11-12

    IPC分类号: H05B3/20 G05B13/02 H01L21/02

    CPC分类号: H01L21/67248 H01L21/67103

    摘要: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

    摘要翻译: 本发明涉及一种用于热处理基板的方法和装置,其中基板被保持与加热板接触或距离加热板稍微距离,该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围,并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。

    Method and device for the thermal treatment of substrates
    3.
    发明授权
    Method and device for the thermal treatment of substrates 有权
    用于基材热处理的方法和装置

    公开(公告)号:US07842905B2

    公开(公告)日:2010-11-30

    申请号:US11573012

    申请日:2005-11-12

    IPC分类号: H05B3/68 A21B2/00 C23C16/00

    CPC分类号: H01L21/67248 H01L21/67103

    摘要: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

    摘要翻译: 本发明涉及一种用于热处理基板的方法和装置,其中基板被保持与加热板接触或距离加热板稍微距离,该加热板由多个可单独控制的加热元件在 所述加热板至少在其平面中被与所述基板间隔开的框架包围,并且所述加热板以受控方式被包围在所述框架与所述框架的至少一个边缘之间的间隙中 加热板。

    Apparatus and method for the treatment of substrates
    4.
    发明授权
    Apparatus and method for the treatment of substrates 有权
    用于处理基材的装置和方法

    公开(公告)号:US06512207B1

    公开(公告)日:2003-01-28

    申请号:US09914113

    申请日:2001-08-23

    IPC分类号: F27B514

    CPC分类号: H01L21/67248 H01L21/67103

    摘要: A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured. The temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.

    摘要翻译: 一种用于热处理基板的装置和方法。 基板被加热板加热以改善热均匀性。 使用多个单独控制的加热元件来加热加热板。 测量加热元件的温度,加热过程由PID控制器控制。 此外,局部测量背离加热板的基板表面的温度。 根据测量的温度确定衬底表面上的温度分布,并确定各个加热元件的温度的设定值并将其传输到PID控制器。