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公开(公告)号：US06713151B1
公开(公告)日：2004-03-30
申请号：US09333564
申请日：1999-06-21
申请人： Nancy F. Dean , Roger A. Emigh , Michael R. Pinter , Charles Smith , Timothy R. Knowles , Mani Ahmadi , Brett M. Ellman , Christopher L. Seaman
发明人： Nancy F. Dean , Roger A. Emigh , Michael R. Pinter , Charles Smith , Timothy R. Knowles , Mani Ahmadi , Brett M. Ellman , Christopher L. Seaman
IPC分类号： B32B3300
CPC分类号： B32B5/16 , H01L2924/0002 , Y10T428/23914 , Y10T428/23943 , Y10T428/23986 , Y10T428/23993 , H01L2924/00
摘要： Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.
摘要翻译： 描述的是纤维热界面。 该界面包括以基本垂直取向嵌入粘合剂中的植绒热传导纤维，其中部分纤维延伸出粘合剂。 密封剂填充纤维部分之间的空间，其延伸出粘合剂之外并且在纤维的自由尖端之下。
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公开(公告)号：US06617199B2
公开(公告)日：2003-09-09
申请号：US09735305
申请日：2001-01-31
申请人： Charles Smith , Michael M. Chau , Roger A. Emigh , Nancy F. Dean
发明人： Charles Smith , Michael M. Chau , Roger A. Emigh , Nancy F. Dean
IPC分类号： H01L2144
CPC分类号： H01L23/433 , H01L23/3733 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/10253 , H01L2924/16195 , H01L2924/00
摘要： Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
摘要翻译： 描述了具有柔顺纤维界面的电子设备。 该界面包括一个自由纤维尖端结构，其具有嵌入粘合剂中的基本垂直取向的植入的热导纤维，纤维的一部分延伸出粘合剂，并且纤维部分之间的密封剂延伸出粘合剂，纤维的自由 提示。
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3.发明授权
公开(公告)号：US5590389A
公开(公告)日：1996-12-31
申请号：US363397
申请日：1994-12-23
申请人： John A. Dunlop , Jun Yuan , Janine K. Kardokus , Roger A. Emigh
发明人： John A. Dunlop , Jun Yuan , Janine K. Kardokus , Roger A. Emigh
CPC分类号： C23C14/3414 , B21C23/001 , B21C23/01 , B22F3/115 , B22F3/20 , C22C1/0416 , C22C21/00 , B22F2998/10
摘要： A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
摘要翻译： 一种溅射靶，其包括诸如铝的金属体及其具有超细晶粒尺寸和小的第二相的合金。 还描述了一种制造超细晶粒溅射靶的方法，包括熔化，雾化和沉积雾化金属以形成工件，以及制造工件以形成溅射靶。 还公开了一种方法，其包括以下步骤：将工件挤压通过具有基本相同横截面的连续的，横向的入口和出口通道的模具，并将挤压制品制造成溅射靶。 挤出可以进行几次，产生更小尺寸的颗粒尺寸和受控的颗粒纹理。
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公开(公告)号：US06740972B2
公开(公告)日：2004-05-25
申请号：US09892244
申请日：2001-06-26
申请人： Charles Smith , Michael M. Chau , Roger A. Emigh , Nancy F. Dean
发明人： Charles Smith , Michael M. Chau , Roger A. Emigh , Nancy F. Dean
IPC分类号： H01L2352
CPC分类号： H01L23/433 , H01L23/3733 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/10253 , H01L2924/16195 , H01L2924/00
摘要： Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
摘要翻译： 描述了具有柔顺纤维界面的电子设备。 该界面包括一个自由纤维尖端结构，其具有嵌入粘合剂中的基本垂直取向的植入的热导纤维，纤维的一部分延伸出粘合剂，并且纤维部分之间的密封剂延伸出粘合剂，纤维的自由 提示。
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