公开(公告)号：US11239170B2

公开(公告)日：2022-02-01

申请号：US16305008

申请日：2016-12-02

申请人： SNAPTRACK, INC.

发明人： Andreas Franz ,  Jürgen Portmann ,  Claus Reitlinger ,  Stefan Kiefl ,  Oliver Freudenberg ,  Karl Weidner

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/373 ,  H01L23/49 ,  H01L23/66 ,  H01L25/10 ,  H01L25/16 ,  H01L25/11 ,  H01L25/065 ,  H01L25/07 ,  H01L23/00 ,  H01L25/00 ,  H01L23/552 ,  H01L23/498 ,  H01L21/56 ,  H01L23/367

摘要： The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

公开(公告)号：US11095268B2

公开(公告)日：2021-08-17

申请号：US15316145

申请日：2015-08-11

申请人： Snaptrack Inc.

发明人： Edgar Schmidhammer

IPC分类号： H03H9/64 ,  H03H9/60 ,  H03H9/54 ,  H03H9/56 ,  H03H7/38 ,  H03H9/72 ,  H03H9/02 ,  H03H9/70

摘要： An RF filter is disclosed. In an embodiment, the RF filter includes series-interconnected basic elements, each basic element having an electroacoustic resonator and impedance converters interconnected in series between the basic elements, wherein the impedance converters are impedance inverters and/or admittance inverters, and wherein the resonators of the basic elements are either only series resonators or only parallel resonators.

公开(公告)号：US10680159B2

公开(公告)日：2020-06-09

申请号：US15546229

申请日：2015-12-18

申请人： SNAPTRACK, INC.

发明人： Thomas Metzger ,  Jürgen Portmann

IPC分类号： H01L41/053 ,  H03H9/05 ,  B81B7/02 ,  H01L41/047 ,  H01L41/08 ,  H01L41/23

摘要： A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

公开(公告)号：US10574207B2

公开(公告)日：2020-02-25

申请号：US15531299

申请日：2014-12-16

申请人： SNAPTRACK, INC.

发明人： Jiman Yoon ,  Philipp Michael Jäger

IPC分类号： H03H9/02 ,  H03H9/145

摘要： An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a transversal velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode. A dielectric material with a periodic structure contributes to the formation of the periodic structure of the velocity profile.

公开(公告)号：US10404217B2

公开(公告)日：2019-09-03

申请号：US15915936

申请日：2018-03-08

申请人： SKYWORKS SOLUTIONS, INC. ,  SNAPTRACK, INC.

发明人： Peter Harris Robert Popplewell ,  Jakub F. Pingot ,  Florinel G. Balteanu ,  Martin Wilson ,  Mark Tuckwell

IPC分类号： H03F3/04 ,  H03F1/02 ,  H03F3/19 ,  H02M3/156 ,  H03F3/195 ,  H02M3/158 ,  H03F3/193 ,  H03F3/21

摘要： Apparatus and methods for reducing inductor ringing of a voltage converter are provided. In certain configurations, a voltage converter includes an inductor connected between a first node and a second node, a plurality of switches, and a bypass circuit having an activated state and a deactivated state. The switches includes a first switch connected between a battery voltage and the first node, a second switch connected between the first node and a ground voltage, a third switch connected between the second node and the ground voltage, and a fourth switch connected between the second node and the output. The bypass circuit includes a first pair of transistors connected between the first node and the second node and configured to turn on to bypass the inductor in the activated state and to turn off in the deactivated state.

公开(公告)号：US20190089044A1

公开(公告)日：2019-03-21

申请号：US16086333

申请日：2017-03-31

申请人： SNAPTRACK, INC.

发明人： Hisashi KOBUKE ,  Naoki SOTOMA ,  Yousuke FUTAMATA ,  Emi NINOMIYA ,  Atsushi ISHIMOTO

IPC分类号： H01Q1/38 ,  H01L23/498 ,  H01L23/66 ,  H01L23/15 ,  H01L21/48 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H01Q9/04 ,  H01Q1/22

摘要： [Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate.

公开(公告)号：US20190074817A1

公开(公告)日：2019-03-07

申请号：US16080616

申请日：2017-03-03

申请人： SNAPTRACK, INC.

发明人： Gregory CARUYER

IPC分类号： H03H9/17 ,  H03H9/54 ,  H03H3/02 ,  C23C16/44 ,  H03H9/02

摘要： A BAW resonator that is less prone to spurious modes comprises a bottom electrode, a top electrode, a bottom piezoelectric layer between the electrodes, a top piezoelectric layer between the bottom piezoelectric layer and the top electrode, and a conductive layer between the two piezoelectric layers.

公开(公告)号：US10209072B2

公开(公告)日：2019-02-19

申请号：US14685375

申请日：2015-04-13

申请人： SnapTrack, Inc.

发明人： Philip Jason Stephanou ,  David William Burns ,  Ravindra Vaman Shenoy

IPC分类号： G01C19/5769 ,  H01L41/312 ,  H01L41/311 ,  H01L41/25 ,  G01C19/5719 ,  G01C25/00 ,  G01P15/08 ,  G01C19/5712 ,  G01P15/125 ,  G01P15/18 ,  G01C19/5747

摘要： This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.

公开(公告)号：US10164665B2

公开(公告)日：2018-12-25

申请号：US15571784

申请日：2016-04-27

申请人： SNAPTRACK, INC.

发明人： Juha Ellä ,  Edgar Schmidhammer

IPC分类号： H04B1/40 ,  H04B1/00 ,  H04B1/18 ,  H04L5/00 ,  H04B1/04

摘要： An HF circuit is specified, by means of which carrier aggregation is possible with a simple design. The circuit comprises a duplexer, a further filter, and two phase shifters, and can be used in an HF module of a mobile wireless device.

公开(公告)号：US10164166B2

公开(公告)日：2018-12-25

申请号：US15820471

申请日：2017-11-22

申请人： SnapTrack, Inc.

发明人： Hans Krüger ,  Alois Stelzl ,  Christian Bauer ,  Jürgen Portmann ,  Wolfgang Pahl

IPC分类号： H01L21/00 ,  H01L41/23 ,  H01L41/113 ,  H01L41/083 ,  H01L41/053 ,  H01L41/27 ,  H01L41/293 ,  B81B7/00 ,  H03H9/05 ,  H01L41/297 ,  H01L23/00

摘要： A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.