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公开(公告)号:US20100155931A1
公开(公告)日:2010-06-24
申请号:US12340862
申请日:2008-12-22
申请人: Urmi Ray , Fifin Sweeney , Kenneth Kaskoun , Shiquin Gu , Thomas R. Toms
发明人: Urmi Ray , Fifin Sweeney , Kenneth Kaskoun , Shiquin Gu , Thomas R. Toms
IPC分类号: H01L23/538 , H01L21/50
CPC分类号: H01L25/0657 , H01L23/481 , H01L23/5383 , H01L23/5385 , H01L23/5389 , H01L25/03 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06541 , H01L2225/06568 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要: An integrated circuit package has a die or die stack with through silicon vias embedded in a package substrate. A method of producing an integrated circuit package embeds at least one die with a through silicon via in a package substrate. The package substrate provides a protective cover for the die or die stack.
摘要翻译: 集成电路封装具有通过硅通孔嵌入封装衬底中的管芯或管芯堆叠。 一种制造集成电路封装件的方法在封装衬底中嵌入具有穿硅通孔的至少一个管芯。 封装衬底提供用于管芯或管芯堆叠的保护盖。