公开(公告)号：US20160049342A1

公开(公告)日：2016-02-18

申请号：US14927006

申请日：2015-10-29

Applicant: ABB Technology AG

Inventor： Munaf Rahimo ,  Hamit Duran

IPC: H01L23/053 ,  H01L23/20 ,  H01L23/31 ,  H01L23/26 ,  H01L23/00 ,  H01L23/24

CPC classification number: H01L23/053 ,  H01L23/049 ,  H01L23/10 ,  H01L23/20 ,  H01L23/24 ,  H01L23/26 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A module arrangement for power semiconductor devices, including one or more power semiconductor modules, wherein the one or more power semiconductor modules include a substrate with a first surface and a second surface being arranged opposite to the first surface, wherein the substrate is at least partially electrically insulating, wherein a conductive structure is arranged at the first surface of the substrate, wherein at least one power semiconductor device is arranged on the conductive structure and electrically connected thereto, wherein the one or more modules includes an inner volume for receiving the at least one power semiconductor device which volume is hermetically sealed from its surrounding by a module enclosure, wherein the module arrangement includes an arrangement enclosure at least partly defining a volume for receiving the one or more modules, and wherein the arrangement enclosure seals covers the volume.

Abstract translation: 一种用于功率半导体器件的模块装置，包括一个或多个功率半导体模块，其中所述一个或多个功率半导体模块包括具有第一表面的衬底和与所述第一表面相对布置的第二表面，其中所述衬底至少部分地 电绝缘，其中导电结构布置在衬底的第一表面处，其中至少一个功率半导体器件布置在导电结构上并与其电连接，其中所述一个或多个模块包括用于接收至少 一个功率半导体器件，其体积通过模块外壳与其周围气密密封，其中所述模块装置包括至少部分地限定用于接收所述一个或多个模块的体积的布置外壳，并且其中所述布置外壳密封件覆盖所述体积。