公开(公告)号：US20230154938A1

公开(公告)日：2023-05-18

申请号：US18066497

申请日：2022-12-15

Applicant: AGC INC.

Inventor： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC: H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

CPC classification number: H01L27/1266 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/006 ,  C03C3/091 ,  C03C27/10 ,  H01L21/6835 ,  H01L27/1222 ,  H01L29/78672 ,  B32B7/06 ,  H01L2221/68386 ,  B32B2307/30 ,  B32B2307/308 ,  B32B2307/546 ,  B32B2307/734 ,  B32B2315/08 ,  B32B2457/00 ,  G02F1/1341

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

公开(公告)号：US20240116277A1

公开(公告)日：2024-04-11

申请号：US18528253

申请日：2023-12-04

Applicant: AGC Inc.

Inventor： Shunji UEDA ,  Kenichi EBATA

IPC: B32B17/10

CPC classification number: B32B17/10981 ,  B32B17/10036 ,  B32B17/10302 ,  B32B17/10761 ,  B32B2605/00

Abstract: A method of producing component-attached vehicle window glass includes disposing a component on a main surface of a glass plate having a heat absorbing layer via an adhesive, locally heating the heat absorbing layer, and transferring heat from the heat absorbing layer to the adhesive to heat and cure the adhesive.

公开(公告)号：US20230118345A1

公开(公告)日：2023-04-20

申请号：US18066505

申请日：2022-12-15

Applicant: AGC INC.

Inventor： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC: H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.